Maurice Heathcote Norcott

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
High density integrated circuit apparatus, test probe and methods o...
- Patent number 7,538,565
- Issue date May 26, 2009
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Control of buried oxide in SIMOX
- Patent number 7,492,008
- Issue date Feb 17, 2009
- International Business Machines Corporation
- Stephen Richard Fox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a structure for making contact with a device
- Patent number 7,332,922
- Issue date Feb 19, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
High density integral test probe
- Patent number 7,276,919
- Issue date Oct 2, 2007
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Method for fabricating a structure for making contact with an IC de...
- Patent number 6,880,245
- Issue date Apr 19, 2005
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Control of buried oxide in SIMOX
- Patent number 6,784,072
- Issue date Aug 31, 2004
- International Business Machines Corporation
- Stephen Richard Fox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of buried oxide quality in low dose SIMOX
- Patent number 6,756,639
- Issue date Jun 29, 2004
- International Business Machines Corporation
- Maurice H. Norcott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a structure for electronic devices contact locations
- Patent number 6,722,032
- Issue date Apr 20, 2004
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Ultimate SIMOX
- Patent number 6,717,217
- Issue date Apr 6, 2004
- International Business Machines Corporation
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultimate SIMOX
- Patent number 6,541,356
- Issue date Apr 1, 2003
- International Business Machines Corporation
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of buried oxide quality in low dose SIMOX
- Patent number 6,486,037
- Issue date Nov 26, 2002
- International Business Machines Corporation
- Maurice H. Norcott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density integrated circuit apparatus, test probe and methods o...
- Patent number 6,334,247
- Issue date Jan 1, 2002
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Method of making high density integral test probe
- Patent number 6,332,270
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
High density cantilevered probe for electronic devices
- Patent number 6,329,827
- Issue date Dec 11, 2001
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
High density integrated circuit apparatus, test probe and methods o...
- Patent number 6,300,780
- Issue date Oct 9, 2001
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Interconnector with contact pads having enhanced durability
- Patent number 6,286,208
- Issue date Sep 11, 2001
- International Business Machines Corporation
- Da-Yuan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for passive characterization of semiconductor...
- Patent number 6,104,201
- Issue date Aug 15, 2000
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
High density test probe with rigid surface structure
- Patent number 6,062,879
- Issue date May 16, 2000
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
High density cantilevered probe for electronic devices
- Patent number 5,914,614
- Issue date Jun 22, 1999
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Integral rigid chip test probe
- Patent number 5,838,160
- Issue date Nov 17, 1998
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Test probe for high density integrated circuits, methods of fabrica...
- Patent number 5,821,763
- Issue date Oct 13, 1998
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
High density cantilevered probe for electronic devices
- Patent number 5,811,982
- Issue date Sep 22, 1998
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Interconnector with contact pads having enhanced durability
- Patent number 5,810,607
- Issue date Sep 22, 1998
- International Business Machines Corporation
- Da-Yuan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density test probe with rigid surface structure
- Patent number 5,785,538
- Issue date Jul 28, 1998
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Test probe having elongated conductor embedded in an elostomeric ma...
- Patent number 5,635,846
- Issue date Jun 3, 1997
- International Business Machines Corporation
- Brian S. Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming a three dimensional high performance interconnect...
- Patent number 5,531,022
- Issue date Jul 2, 1996
- International Business Machines Corporation
- Brain S. Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Three dimensional high performance interconnection package
- Patent number 5,371,654
- Issue date Dec 6, 1994
- International Business Machines Corporation
- Brian S. Beaman
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20100052715
- Publication date Mar 4, 2010
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20100045317
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20100045320
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20100045321
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20100045318
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20100045266
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20100045324
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20090315579
- Publication date Dec 24, 2009
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20090128176
- Publication date May 21, 2009
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080129319
- Publication date Jun 5, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080132094
- Publication date Jun 5, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080129320
- Publication date Jun 5, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080121879
- Publication date May 29, 2008
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080123310
- Publication date May 29, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080117612
- Publication date May 22, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080116913
- Publication date May 22, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080116916
- Publication date May 22, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080116912
- Publication date May 22, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080116914
- Publication date May 22, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080116915
- Publication date May 22, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080117611
- Publication date May 22, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080117613
- Publication date May 22, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080111568
- Publication date May 15, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080111570
- Publication date May 15, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080112145
- Publication date May 15, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080112144
- Publication date May 15, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080112146
- Publication date May 15, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080112147
- Publication date May 15, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080112148
- Publication date May 15, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080111569
- Publication date May 15, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING

Maurice Heathcote Norcott

Person

Patents Grantslast 30 patents

High density integrated circuit apparatus, test probe and methods o...

Control of buried oxide in SIMOX

Method for fabricating a structure for making contact with a device

High density integral test probe

Method for fabricating a structure for making contact with an IC de...

Control of buried oxide in SIMOX

Control of buried oxide quality in low dose SIMOX

Method of forming a structure for electronic devices contact locations

Ultimate SIMOX

Ultimate SIMOX

Control of buried oxide quality in low dose SIMOX

High density integrated circuit apparatus, test probe and methods o...

Method of making high density integral test probe

High density cantilevered probe for electronic devices

High density integrated circuit apparatus, test probe and methods o...

Interconnector with contact pads having enhanced durability

Method and apparatus for passive characterization of semiconductor...

High density test probe with rigid surface structure

High density cantilevered probe for electronic devices

Integral rigid chip test probe

Test probe for high density integrated circuits, methods of fabrica...

High density cantilevered probe for electronic devices

Interconnector with contact pads having enhanced durability

High density test probe with rigid surface structure

Test probe having elongated conductor embedded in an elostomeric ma...

Method of forming a three dimensional high performance interconnect...

Three dimensional high performance interconnection package

Patents Applicationslast 30 patents

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...