Mei Sun

Person

Los Altos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Instrumented substrate apparatus for acquiring measurement paramete...
- Patent number 11,150,140
- Issue date Oct 19, 2021
- KLA Corporation
- Mei Sun
- G01 - MEASURING TESTING
Information Patent Grant
Process condition sensing device and method for plasma chamber
- Patent number 10,777,393
- Issue date Sep 15, 2020
- KLA-Tencor Corporation
- Earl Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch-resistant coating on sensor wafers for in-situ measurement
- Patent number 10,720,350
- Issue date Jul 21, 2020
- KLA-TENCORE CORPORATION
- Andrew Nguyen
- G01 - MEASURING TESTING
Information Patent Grant
Encapsulated instrumented substrate apparatus for acquiring measure...
- Patent number 10,460,966
- Issue date Oct 29, 2019
- KLA-Tencor Corporation
- Mei Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for measuring radiation and temperature exposure...
- Patent number 10,215,626
- Issue date Feb 26, 2019
- KLA-Tencor Corporation
- Mei Sun
- G01 - MEASURING TESTING
Information Patent Grant
Wafer level spectrometer
- Patent number 9,964,440
- Issue date May 8, 2018
- KLA-Tencor Corporation
- Earl M. Jensen
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for measuring radiation and temperature exposure...
- Patent number 9,823,121
- Issue date Nov 21, 2017
- KLA-Tencor Corporation
- Mei Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for measuring heat flux
- Patent number 9,719,867
- Issue date Aug 1, 2017
- KLA-Tencor Corporation
- Stephen Sharratt
- G01 - MEASURING TESTING
Information Patent Grant
Methods of attaching a module on wafer substrate
- Patent number 9,514,970
- Issue date Dec 6, 2016
- KLA-Tencor Corporation
- Vaibhaw Vishal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film thickness monitor
- Patent number 9,360,302
- Issue date Jun 7, 2016
- KLA-Tencor Corporation
- Earl Jensen
- G01 - MEASURING TESTING
Information Patent Grant
High temperature sensor wafer for in-situ measurements in active pl...
- Patent number 9,222,842
- Issue date Dec 29, 2015
- KLA-Tencor Corporation
- Mei Sun
- G01 - MEASURING TESTING
Information Patent Grant
Wafer level spectrometer
- Patent number 9,140,604
- Issue date Sep 22, 2015
- KLA-Tencor Corporation
- Earl Jensen
- G01 - MEASURING TESTING
Information Patent Grant
Process condition measuring device (PCMD) and method for measuring...
- Patent number 9,134,186
- Issue date Sep 15, 2015
- KLA-Tencor Corporation
- Mei Sun
- G01 - MEASURING TESTING
Information Patent Grant
Process condition sensing device and method for plasma chamber
- Patent number 8,889,021
- Issue date Nov 18, 2014
- KLA-Tencor Corporation
- Earl Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat shield module for substrate-like metrology device
- Patent number 8,681,493
- Issue date Mar 25, 2014
- KLA-Tencor Corporation
- Vaibhaw Vishal
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Component package for maintaining safe operating temperature of com...
- Patent number 8,604,361
- Issue date Dec 10, 2013
- KLA-Tencor Corporation
- Mei Sun
- G01 - MEASURING TESTING
Information Patent Grant
Process condition measuring device
- Patent number 8,104,342
- Issue date Jan 31, 2012
- KLA-Tencor Corporation
- Mei H. Sun
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Process condition sensing wafer and data analysis system
- Patent number 8,033,190
- Issue date Oct 11, 2011
- KLA-Tencor Technologies Corporation
- Wayne G. Renken
- G01 - MEASURING TESTING
Information Patent Grant
Temperature effects on overlay accuracy
- Patent number 7,924,408
- Issue date Apr 12, 2011
- KLA-Tencor Technologies Corporation
- Tony DiBiase
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Integrated process condition sensing wafer and data analysis system
- Patent number 7,855,549
- Issue date Dec 21, 2010
- KLA-Tencor Corporation
- Wayne Glenn Renken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process condition sensing wafer and data analysis system
- Patent number 7,757,574
- Issue date Jul 20, 2010
- KLA-Tencor Corporation
- Wayne G. Renken
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensing device
- Patent number 7,698,952
- Issue date Apr 20, 2010
- KLA-Tencor Corporation
- Wayne G. Renken
- G01 - MEASURING TESTING
Information Patent Grant
Process condition measuring device and method for measuring shear f...
- Patent number 7,497,134
- Issue date Mar 3, 2009
- KLA-Tencor Corporation
- Wayne G. Renken
- G01 - MEASURING TESTING
Information Patent Grant
Integrated process condition sensing wafer and data analysis system
- Patent number 7,135,852
- Issue date Nov 14, 2006
- SensArray Corporation
- Wayne Glenn Renken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor positioning systems and methods
- Patent number 6,915,589
- Issue date Jul 12, 2005
- SensArray Corporation
- Mei H. Sun
- G01 - MEASURING TESTING
Information Patent Grant
Optical techniques for measuring parameters such as temperature acr...
- Patent number 6,616,332
- Issue date Sep 9, 2003
- SensArray Corporation
- Wayne Renken
- G01 - MEASURING TESTING
Information Patent Grant
Integrated wafer temperature sensors
- Patent number 6,325,536
- Issue date Dec 4, 2001
- SensArray Corporation
- Wayne Glenn Renken
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for sensing temperature on a substrate in an integrated c...
- Patent number 6,190,040
- Issue date Feb 20, 2001
- SensArray Corporation
- Wayne G. Renken
- G01 - MEASURING TESTING
Information Patent Grant
In situ technique for monitoring and controlling a process of chemi...
- Patent number 6,010,538
- Issue date Jan 4, 2000
- Luxtron Corporation
- Mei H. Sun
- G05 - CONTROLLING REGULATING
Information Patent Grant
Measuring system employing a luminescent sensor and methods of desi...
- Patent number 5,414,266
- Issue date May 9, 1995
- Luxtron Corporation
- Mei H. Sun
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Encapsulated Instrumented Substrate Apparatus for Acquiring Measure...
- Publication number 20200203200
- Publication date Jun 25, 2020
- KLA-Tencor Corporation
- Mei Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS CONDITION SENSING DEVICE AND METHOD FOR PLASMA CHAMBER
- Publication number 20180114681
- Publication date Apr 26, 2018
- KLA-Tencor Corporation
- Earl Jensen
- G01 - MEASURING TESTING
Information Patent Application
Method and System for Measuring Radiation and Temperature Exposure...
- Publication number 20180052045
- Publication date Feb 22, 2018
- KLA-Tencor Corporation
- Mei Sun
- G01 - MEASURING TESTING
Information Patent Application
Encapsulated Instrumented Substrate Apparatus for Acquiring Measure...
- Publication number 20170365495
- Publication date Dec 21, 2017
- KLA-Tencor Corporation
- Mei Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Instrumented Substrate Apparatus for Acquiring Measurement Paramete...
- Publication number 20170219437
- Publication date Aug 3, 2017
- KLA-Tencor Corporation
- Mei Sun
- G01 - MEASURING TESTING
Information Patent Application
Method and System for Measuring Radiation and Temperature Exposure...
- Publication number 20160138969
- Publication date May 19, 2016
- KLA-Tencor Corporation
- Mei Sun
- G01 - MEASURING TESTING
Information Patent Application
WAFER LEVEL SPECTROMETER
- Publication number 20160011046
- Publication date Jan 14, 2016
- KLA Tencor
- Earl M. Jensen
- G01 - MEASURING TESTING
Information Patent Application
PROCESS CONDITION SENSING DEVICE AND METHOD FOR PLASMA CHAMBER
- Publication number 20150020972
- Publication date Jan 22, 2015
- KLA-Tencor Corporation
- Earl Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Measuring Heat Flux
- Publication number 20140355643
- Publication date Dec 4, 2014
- KLA-Tencor Corporation
- Stephen Sharratt
- G01 - MEASURING TESTING
Information Patent Application
METHODS OF ATTACHING A MODULE ON WAFER SUBSTRATE
- Publication number 20140202267
- Publication date Jul 24, 2014
- KLA-Tencor Corporation
- Vaibhaw Vishal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH TEMPERATURE SENSOR WAFER FOR IN-SITU MEASUREMENTS IN ACTIVE PL...
- Publication number 20140192840
- Publication date Jul 10, 2014
- KLA-Tencor Corporation
- Mei Sun
- G01 - MEASURING TESTING
Information Patent Application
FILM THICKNESS MONITOR
- Publication number 20130155390
- Publication date Jun 20, 2013
- Earl Jensen
- G01 - MEASURING TESTING
Information Patent Application
PROCESS CONDITION MEASURING DEVICE
- Publication number 20130029433
- Publication date Jan 31, 2013
- KLA-Tencor Corporation
- Mei H. Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL SPECTROMETER
- Publication number 20120318966
- Publication date Dec 20, 2012
- KLA-Tencor Corporation
- Earl Jensen
- G01 - MEASURING TESTING
Information Patent Application
HEAT SHIELD MODULE FOR SUBSTRATE-LIKE METROLOGY DEVICE
- Publication number 20120287574
- Publication date Nov 15, 2012
- KLA-Tencor Corporation
- Vaibhaw Vishal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS CONDITION MEASURING DEVICE (PCMD) AND METHOD FOR MEASURING...
- Publication number 20120203495
- Publication date Aug 9, 2012
- KLA-Tencor Corporation
- Mei Sun
- G01 - MEASURING TESTING
Information Patent Application
ETCH-RESISTANT COATING ON SENSOR WAFERS FOR IN-SITU MEASUREMENT
- Publication number 20120074514
- Publication date Mar 29, 2012
- KLA-Tencor Corporation
- ANDREW NGUYEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS CONDITION SENSING DEVICE AND METHOD FOR PLASMA CHAMBER
- Publication number 20110174777
- Publication date Jul 21, 2011
- KLA-Tencor Corporation
- Earl Jensen
- G01 - MEASURING TESTING
Information Patent Application
PROCESS CONDITION SENSING WAFER AND DATA ANALYSIS SYSTEM
- Publication number 20100294051
- Publication date Nov 25, 2010
- KLA-Tencor Corporation
- Wayne G. Renken
- G01 - MEASURING TESTING
Information Patent Application
COMPONENT PACKAGE FOR MAINTAINING SAFE OPERATING TEMPERATURE OF COM...
- Publication number 20100155098
- Publication date Jun 24, 2010
- KLA-Tencor Corporation
- Mei Sun
- G01 - MEASURING TESTING
Information Patent Application
PROCESS CONDITION MEASURING DEVICE
- Publication number 20090056441
- Publication date Mar 5, 2009
- KLA-Tencor Corporation
- Mei H. Sun
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Temperature effects on overlay accuracy
- Publication number 20080204678
- Publication date Aug 28, 2008
- KLA-Tencor Technologies Corporation
- Tony DiBiase
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Shear Force Sensing Device
- Publication number 20080087105
- Publication date Apr 17, 2008
- SensArray Corporation
- Wayne G. Renken
- G01 - MEASURING TESTING
Information Patent Application
Pressure Sensing Device
- Publication number 20080087069
- Publication date Apr 17, 2008
- SensArray Corporation
- Wayne G. Renken
- G01 - MEASURING TESTING
Information Patent Application
Integrated Process Condition Sensing Wafer and Data Analysis System
- Publication number 20070046284
- Publication date Mar 1, 2007
- SensArray Corporation
- Wayne Glenn Renken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process condition sensing wafer and data analysis system
- Publication number 20060174720
- Publication date Aug 10, 2006
- SensArray Corporation
- Wayne G. Renken
- G01 - MEASURING TESTING
Information Patent Application
Sensor positioning systems and methods
- Publication number 20050081398
- Publication date Apr 21, 2005
- SensArray Corporation
- Mei H. Sun
- G01 - MEASURING TESTING
Information Patent Application
Integrated process condition sensing wafer and data analysis system
- Publication number 20040225462
- Publication date Nov 11, 2004
- Wayne Glenn Renken
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Instrumented substrate apparatus for acquiring measurement paramete...

Process condition sensing device and method for plasma chamber

Etch-resistant coating on sensor wafers for in-situ measurement

Encapsulated instrumented substrate apparatus for acquiring measure...

Method and system for measuring radiation and temperature exposure...

Wafer level spectrometer

Method and system for measuring radiation and temperature exposure...

Method and system for measuring heat flux

Methods of attaching a module on wafer substrate

Film thickness monitor

High temperature sensor wafer for in-situ measurements in active pl...

Wafer level spectrometer

Process condition measuring device (PCMD) and method for measuring...

Process condition sensing device and method for plasma chamber

Heat shield module for substrate-like metrology device

Component package for maintaining safe operating temperature of com...

Process condition measuring device

Process condition sensing wafer and data analysis system

Temperature effects on overlay accuracy

Integrated process condition sensing wafer and data analysis system

Process condition sensing wafer and data analysis system

Pressure sensing device

Process condition measuring device and method for measuring shear f...

Integrated process condition sensing wafer and data analysis system

Sensor positioning systems and methods

Optical techniques for measuring parameters such as temperature acr...

Integrated wafer temperature sensors

Apparatus for sensing temperature on a substrate in an integrated c...

In situ technique for monitoring and controlling a process of chemi...

Measuring system employing a luminescent sensor and methods of desi...

Patents Applicationslast 30 patents

Encapsulated Instrumented Substrate Apparatus for Acquiring Measure...

PROCESS CONDITION SENSING DEVICE AND METHOD FOR PLASMA CHAMBER

Method and System for Measuring Radiation and Temperature Exposure...

Encapsulated Instrumented Substrate Apparatus for Acquiring Measure...

Instrumented Substrate Apparatus for Acquiring Measurement Paramete...

Method and System for Measuring Radiation and Temperature Exposure...

WAFER LEVEL SPECTROMETER

PROCESS CONDITION SENSING DEVICE AND METHOD FOR PLASMA CHAMBER

Method and System for Measuring Heat Flux

METHODS OF ATTACHING A MODULE ON WAFER SUBSTRATE

HIGH TEMPERATURE SENSOR WAFER FOR IN-SITU MEASUREMENTS IN ACTIVE PL...

FILM THICKNESS MONITOR

PROCESS CONDITION MEASURING DEVICE

WAFER LEVEL SPECTROMETER

HEAT SHIELD MODULE FOR SUBSTRATE-LIKE METROLOGY DEVICE

PROCESS CONDITION MEASURING DEVICE (PCMD) AND METHOD FOR MEASURING...

ETCH-RESISTANT COATING ON SENSOR WAFERS FOR IN-SITU MEASUREMENT

PROCESS CONDITION SENSING DEVICE AND METHOD FOR PLASMA CHAMBER

PROCESS CONDITION SENSING WAFER AND DATA ANALYSIS SYSTEM

COMPONENT PACKAGE FOR MAINTAINING SAFE OPERATING TEMPERATURE OF COM...

PROCESS CONDITION MEASURING DEVICE

Temperature effects on overlay accuracy

Shear Force Sensing Device

Pressure Sensing Device

Integrated Process Condition Sensing Wafer and Data Analysis System

Process condition sensing wafer and data analysis system

Sensor positioning systems and methods

Integrated process condition sensing wafer and data analysis system