Mei-yee SHEK

Person

Palo Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of dielectric material fill and treatment
- Patent number 12,046,508
- Issue date Jul 23, 2024
- Applied Materials, Inc.
- Shi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High pressure annealing process for metal containing materials
- Patent number 11,881,411
- Issue date Jan 23, 2024
- Applied Materials, Inc.
- Kaushal K. Singh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of dielectric material fill and treatment
- Patent number 11,615,984
- Issue date Mar 28, 2023
- Applied Materials, Inc.
- Shi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming amorphous carbon hard mask layers and hard mask...
- Patent number 11,581,183
- Issue date Feb 14, 2023
- Applied Materials, Inc.
- Bhargav S. Citla
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon carbonitride gapfill with tunable carbon content
- Patent number 11,566,325
- Issue date Jan 31, 2023
- Applied Materials, Inc.
- Mei-Yee Shek
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
High pressure annealing process for metal containing materials
- Patent number 10,998,200
- Issue date May 4, 2021
- Applied Materials, Inc.
- Kaushal K. Singh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming amorphous carbon hard mask layers and hard mask...
- Patent number 10,950,429
- Issue date Mar 16, 2021
- Applied Materials, Inc.
- Bhargav S. Citla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming metal silicide layers and metal silicide layers...
- Patent number 10,916,433
- Issue date Feb 9, 2021
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to fabricate thermally stable low K-FinFET spacer
- Patent number 10,714,331
- Issue date Jul 14, 2020
- Applied Materials, Inc.
- Mihaela Balseanu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dielectric/metal barrier integration to prevent copper diffusion
- Patent number 10,008,448
- Issue date Jun 26, 2018
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu/barrier interface enhancement
- Patent number 9,633,861
- Issue date Apr 25, 2017
- Applied Materials, Inc.
- Weifeng Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric/metal barrier integration to prevent copper diffusion
- Patent number 9,601,431
- Issue date Mar 21, 2017
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancing electrical property and UV compatibility of ultrathin blo...
- Patent number 9,580,801
- Issue date Feb 28, 2017
- Applied Materials, Inc.
- Xiaolan Ba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cobalt selectivity improvement in selective cobalt process sequence
- Patent number 9,478,460
- Issue date Oct 25, 2016
- APPLIED MATERIALS, INC.
- Mei-yee Shek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming passivation protection for an interconnection s...
- Patent number 9,299,605
- Issue date Mar 29, 2016
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt selectivity improvement in selective cobalt process sequence
- Patent number 9,105,695
- Issue date Aug 11, 2015
- Applied Materials, Inc.
- Mei-yee Shek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for silicon oxide CVD resist planarization
- Patent number 8,852,962
- Issue date Oct 7, 2014
- Applied Materials, Inc.
- Steven Verhaverbeke
- G11 - INFORMATION STORAGE
Information Patent Grant
Copper oxide removal techniques
- Patent number 8,758,638
- Issue date Jun 24, 2014
- Applied Materials, Inc.
- Weifeng Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to increase tensile stress of silicon nitride films using a...
- Patent number 8,753,989
- Issue date Jun 17, 2014
- Applied Materials, Inc.
- Mihaela Balseanu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Prevention and reduction of solvent and solution penetration into p...
- Patent number 8,481,422
- Issue date Jul 9, 2013
- Applied Materials, Inc.
- Kelvin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to minimize wet etch undercuts and provide pore sealing of e...
- Patent number 8,445,075
- Issue date May 21, 2013
- Applied Materials, Inc.
- Huiwen Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon dioxide layer deposited with BDEAS
- Patent number 8,343,881
- Issue date Jan 1, 2013
- Applied Materials, Inc.
- Yong-Won Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to increase silicon nitride tensile stress using nitrogen pl...
- Patent number 8,138,104
- Issue date Mar 20, 2012
- Applied Materials, Inc.
- Mihaela Balseanu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to increase tensile stress of silicon nitride films using a...
- Patent number 8,129,290
- Issue date Mar 6, 2012
- Applied Materials, Inc.
- Mihaela Balseanu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to improve the step coverage and pattern loading for dielect...
- Patent number 7,923,386
- Issue date Apr 12, 2011
- Applied Materials, Inc.
- Mihaela Balseanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to improve the step coverage and pattern loading for dielect...
- Patent number 7,780,865
- Issue date Aug 24, 2010
- Applied Materials, Inc.
- Mihaela Balseanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to increase the compressive stress of PECVD silicon nitride...
- Patent number 7,732,342
- Issue date Jun 8, 2010
- Applied Materials, Inc.
- Mihaela Balseanu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integration process for fabricating stressed transistor structure
- Patent number 7,566,655
- Issue date Jul 28, 2009
- Applied Materials, Inc.
- Mihaela Balseanu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Boron diffusion barrier by nitrogen incorporation in spacer dielect...
- Patent number 7,132,353
- Issue date Nov 7, 2006
- Applied Materials, Inc.
- Li-Qun Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide deposition for use as a low dielectric constant ant...
- Patent number 6,951,826
- Issue date Oct 4, 2005
- Applied Materials, Inc.
- Christopher Bencher
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
DIRECTIONAL SELECTIVE FILL OF SILICON OXIDE MATERIALS
- Publication number 20250022704
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Qiang Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT
- Publication number 20240379420
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Shi YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT
- Publication number 20230187276
- Publication date Jun 15, 2023
- Applied Materials, Inc.
- Shi YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBONITRIDE GAPFILL WITH TUNABLE CARBON CONTENT
- Publication number 20230066497
- Publication date Mar 2, 2023
- Applied Materials, Inc.
- Mei-Yee Shek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT
- Publication number 20210317580
- Publication date Oct 14, 2021
- Applied Materials, Inc.
- Shi YOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH PRESSURE ANNEALING PROCESS FOR METAL CONTAINING MATERIALS
- Publication number 20210257221
- Publication date Aug 19, 2021
- Applied Materials, Inc.
- Kaushal K. SINGH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING AMORPHOUS CARBON HARD MASK LAYERS AND HARD MASK...
- Publication number 20210193461
- Publication date Jun 24, 2021
- Applied Materials, Inc.
- Bhargav S. CITLA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Silicon Carbonitride Gapfill With Tunable Carbon Content
- Publication number 20210189555
- Publication date Jun 24, 2021
- Applied Materials, Inc.
- Mei-Yee Shek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING AMORPHOUS CARBON HARD MASK LAYERS AND HARD MASK...
- Publication number 20190348283
- Publication date Nov 14, 2019
- Applied Materials, Inc.
- Bhargav S. CITLA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD TO FABRICATE THERMALLY STABLE LOW K-FINFET SPACER
- Publication number 20190311896
- Publication date Oct 10, 2019
- Applied Materials, Inc.
- Mihaela BALSEANU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING METAL SILICIDE LAYERS AND METAL SILICIDE LAYERS...
- Publication number 20190311908
- Publication date Oct 10, 2019
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PRESSURE ANNEALING PROCESS FOR METAL CONTAINING MATERIALS
- Publication number 20190279879
- Publication date Sep 12, 2019
- Applied Materials, Inc.
- Kaushal K. SINGH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PROCESSING A MASK SUBSTRATE TO ENABLE BETTER FILM QUALITY
- Publication number 20190258153
- Publication date Aug 22, 2019
- Applied Materials, Inc.
- Srinivas D. NEMANI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
DIELECTRIC/METAL BARRIER INTEGRATION TO PREVENT COPPER DIFFUSION
- Publication number 20170162511
- Publication date Jun 8, 2017
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT SELECTIVITY IMPROVEMENT IN SELECTIVE COBALT PROCESS SEQUENCE
- Publication number 20160141203
- Publication date May 19, 2016
- Applied Materials, Inc.
- MEI-YEE SHEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCING ELECTRICAL PROPERTY AND UV COMPATIBILITY OF ULTRATHIN BLO...
- Publication number 20160071724
- Publication date Mar 10, 2016
- Applied Materials, Inc.
- Xiaolan BA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ENHANCING UV COMPATIBILITY OF LOW K BARRIER FILM
- Publication number 20160013049
- Publication date Jan 14, 2016
- Applied Materials, Inc.
- Weifeng YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING PASSIVATION PROTECTION FOR AN INTERCONNECTION S...
- Publication number 20150255329
- Publication date Sep 10, 2015
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC/METAL BARRIER INTEGRATION TO PREVENT COPPER DIFFUSION
- Publication number 20150221596
- Publication date Aug 6, 2015
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT SELECTIVITY IMPROVEMENT IN SELECTIVE COBALT PROCESS SEQUENCE
- Publication number 20140349480
- Publication date Nov 27, 2014
- Mei-yee SHEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VBD AND TDDB IMPROVEMENT THRU INTERFACE ENGINEERING
- Publication number 20140273516
- Publication date Sep 18, 2014
- Li-Qun XIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU/BARRIER INTERFACE ENHANCEMENT
- Publication number 20140273438
- Publication date Sep 18, 2014
- Weifeng YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULATED COMPOSITIONAL AND STRESS CONTROLLED MULTILAYER ULTRATHIN...
- Publication number 20130333923
- Publication date Dec 19, 2013
- International Business Machines Corporation
- Mihaela Balseanu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ADHESION IMPROVEMENT FOR LOW K DIELECTRICS TO CONDUCTIVE MATERIALS
- Publication number 20130230986
- Publication date Sep 5, 2013
- Applied Materials, Inc.
- NAGARAJAN RAJAGOPALAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHODS FOR SILICON OXIDE CVD RESIST PLANARIZATION
- Publication number 20130130405
- Publication date May 23, 2013
- Steven VERHAVERBEKE
- G11 - INFORMATION STORAGE
Information Patent Application
COPPER OXIDE REMOVAL TECHNIQUES
- Publication number 20120289049
- Publication date Nov 15, 2012
- Applied Materials, Inc.
- WEIFENG YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO INCREASE TENSILE STRESS OF SILICON NITRIDE FILMS USING A...
- Publication number 20120196452
- Publication date Aug 2, 2012
- Applied Materials, Inc.
- Mihaela Balseanu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD TO INCREASE SILICON NITRIDE TENSILE STRESS USING NITROGEN PL...
- Publication number 20120196450
- Publication date Aug 2, 2012
- Applied Materials, Inc.
- Mihaela Balseanu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DUAL DELIVERY CHAMBER DESIGN
- Publication number 20120097330
- Publication date Apr 26, 2012
- Applied Materials, Inc.
- Prahallad Iyengar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SILICON DIOXIDE LAYER DEPOSITED WITH BDEAS
- Publication number 20110298099
- Publication date Dec 8, 2011
- Applied Materials, Inc.
- Yong-Won LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Mei-yee SHEK

Person

Patents Grantslast 30 patents

Method of dielectric material fill and treatment

High pressure annealing process for metal containing materials

Method of dielectric material fill and treatment

Methods of forming amorphous carbon hard mask layers and hard mask...

Silicon carbonitride gapfill with tunable carbon content

High pressure annealing process for metal containing materials

Methods of forming amorphous carbon hard mask layers and hard mask...

Methods of forming metal silicide layers and metal silicide layers...

Method to fabricate thermally stable low K-FinFET spacer

Dielectric/metal barrier integration to prevent copper diffusion

Cu/barrier interface enhancement

Dielectric/metal barrier integration to prevent copper diffusion

Enhancing electrical property and UV compatibility of ultrathin blo...

Cobalt selectivity improvement in selective cobalt process sequence

Methods for forming passivation protection for an interconnection s...

Cobalt selectivity improvement in selective cobalt process sequence

Apparatus and methods for silicon oxide CVD resist planarization

Copper oxide removal techniques

Method to increase tensile stress of silicon nitride films using a...

Prevention and reduction of solvent and solution penetration into p...

Method to minimize wet etch undercuts and provide pore sealing of e...

Silicon dioxide layer deposited with BDEAS

Method to increase silicon nitride tensile stress using nitrogen pl...

Method to increase tensile stress of silicon nitride films using a...

Method to improve the step coverage and pattern loading for dielect...

Method to improve the step coverage and pattern loading for dielect...

Method to increase the compressive stress of PECVD silicon nitride...

Integration process for fabricating stressed transistor structure

Boron diffusion barrier by nitrogen incorporation in spacer dielect...

Silicon carbide deposition for use as a low dielectric constant ant...

Patents Applicationslast 30 patents

DIRECTIONAL SELECTIVE FILL OF SILICON OXIDE MATERIALS

METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT

METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT

SILICON CARBONITRIDE GAPFILL WITH TUNABLE CARBON CONTENT

METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT

HIGH PRESSURE ANNEALING PROCESS FOR METAL CONTAINING MATERIALS

METHODS OF FORMING AMORPHOUS CARBON HARD MASK LAYERS AND HARD MASK...

Silicon Carbonitride Gapfill With Tunable Carbon Content

METHODS OF FORMING AMORPHOUS CARBON HARD MASK LAYERS AND HARD MASK...

METHOD TO FABRICATE THERMALLY STABLE LOW K-FINFET SPACER

METHODS OF FORMING METAL SILICIDE LAYERS AND METAL SILICIDE LAYERS...

HIGH PRESSURE ANNEALING PROCESS FOR METAL CONTAINING MATERIALS

METHOD FOR PROCESSING A MASK SUBSTRATE TO ENABLE BETTER FILM QUALITY

DIELECTRIC/METAL BARRIER INTEGRATION TO PREVENT COPPER DIFFUSION

COBALT SELECTIVITY IMPROVEMENT IN SELECTIVE COBALT PROCESS SEQUENCE

ENHANCING ELECTRICAL PROPERTY AND UV COMPATIBILITY OF ULTRATHIN BLO...

ENHANCING UV COMPATIBILITY OF LOW K BARRIER FILM

METHODS FOR FORMING PASSIVATION PROTECTION FOR AN INTERCONNECTION S...

DIELECTRIC/METAL BARRIER INTEGRATION TO PREVENT COPPER DIFFUSION

COBALT SELECTIVITY IMPROVEMENT IN SELECTIVE COBALT PROCESS SEQUENCE

VBD AND TDDB IMPROVEMENT THRU INTERFACE ENGINEERING

CU/BARRIER INTERFACE ENHANCEMENT

MODULATED COMPOSITIONAL AND STRESS CONTROLLED MULTILAYER ULTRATHIN...

ADHESION IMPROVEMENT FOR LOW K DIELECTRICS TO CONDUCTIVE MATERIALS

APPARATUS AND METHODS FOR SILICON OXIDE CVD RESIST PLANARIZATION

COPPER OXIDE REMOVAL TECHNIQUES

METHOD TO INCREASE TENSILE STRESS OF SILICON NITRIDE FILMS USING A...

METHOD TO INCREASE SILICON NITRIDE TENSILE STRESS USING NITROGEN PL...

DUAL DELIVERY CHAMBER DESIGN

SILICON DIOXIDE LAYER DEPOSITED WITH BDEAS