Melvin Martin

Person

Stuttgart, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Pillared cavity down MIS-SiP
- Patent number 11,532,489
- Issue date Dec 20, 2022
- Dialog Semiconductor (UK) Limited
- Ernesto Gutierrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Very thin embedded trace substrate-system in package (SIP)
- Patent number 11,309,255
- Issue date Apr 19, 2022
- Dialog Semiconductor (UK) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillared cavity down MIS-SIP
- Patent number 11,075,167
- Issue date Jul 27, 2021
- Dialog Semiconductor (UK) Limited
- Ernesto Gutierrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Very thin embedded trace substrate-system in package (SIP)
- Patent number 10,636,742
- Issue date Apr 28, 2020
- Dialog Semiconductor (US) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for assembling various dice in a single...
- Patent number 10,410,996
- Issue date Sep 10, 2019
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for assembling various dice in a single...
- Patent number 10,332,864
- Issue date Jun 25, 2019
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Pillared Cavity Down MIS-SIP
- Publication number 20210305167
- Publication date Sep 30, 2021
- Dialog Semiconductor (UK) Limited
- Ernesto Gutierrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillared Cavity Down MIS-SIP
- Publication number 20200251350
- Publication date Aug 6, 2020
- Dialog Semiconductor (UK) Limited
- Ernesto Gutierrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Very Thin Embedded Trace Substrate-System in Package (SIP)
- Publication number 20200227356
- Publication date Jul 16, 2020
- Dialog Semiconductor (UK) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Re-Routable Clip for Leadframe Based Product
- Publication number 20190259689
- Publication date Aug 22, 2019
- Dialog Semiconductor (UK) Limited
- Tung Ching Lui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Very Thin Embedded Trace Substrate-System in Package (SIP)
- Publication number 20190096815
- Publication date Mar 28, 2019
- Dialog Semiconductor (UK) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package For Assembling Various Dice In A Single...
- Publication number 20180158804
- Publication date Jun 7, 2018
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WFCQFN (Very-Very Thin Flip Chip Quad Flat No Lead) with Embedded C...
- Publication number 20180025965
- Publication date Jan 25, 2018
- Dialog Semiconductor (UK) Limited
- Baltazar Canete
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Heat Slug to Enhance Substrate Thermal Conductivity
- Publication number 20140355215
- Publication date Dec 4, 2014
- Baltazar Canete
- H01 - BASIC ELECTRIC ELEMENTS

Melvin Martin

Person

Patents Grantslast 30 patents

Pillared cavity down MIS-SiP

Very thin embedded trace substrate-system in package (SIP)

Pillared cavity down MIS-SIP

Very thin embedded trace substrate-system in package (SIP)

Integrated circuit package for assembling various dice in a single...

Integrated circuit package for assembling various dice in a single...

Patents Applicationslast 30 patents

Pillared Cavity Down MIS-SIP

Pillared Cavity Down MIS-SIP

Very Thin Embedded Trace Substrate-System in Package (SIP)

Re-Routable Clip for Leadframe Based Product

Very Thin Embedded Trace Substrate-System in Package (SIP)

Integrated Circuit Package For Assembling Various Dice In A Single...

WFCQFN (Very-Very Thin Flip Chip Quad Flat No Lead) with Embedded C...

Embedded Heat Slug to Enhance Substrate Thermal Conductivity