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Meng Boon Chan

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Patents Grantslast 30 patents

  • Information Patent Grant

    Light emitting diode (LED) packages
    • Patent number 8,674,488
    • Issue date Mar 18, 2014
    • Carsem (M) Sdn. Bhd.
    • Yong Lam Wai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Large panel leadframe
    • Patent number 8,535,988
    • Issue date Sep 17, 2013
    • Carsem (M) Sdn. Bhd.
    • Yong Lam Wai
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Manufacturing light emitting diode (LED) packages
    • Patent number 8,394,675
    • Issue date Mar 12, 2013
    • Carsem (M) SDN. BHD.
    • Yong Lam Wai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Leadframe package with recessed cavity for LED
    • Patent number 8,314,479
    • Issue date Nov 20, 2012
    • Carsem (M) SDN. BHD.
    • Yong Lam Wai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stress-free lead frame
    • Patent number 7,786,554
    • Issue date Aug 31, 2010
    • Carsem (M) Sdn. Bhd.
    • Lee Kock Huat
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stress-free lead frame
    • Patent number 7,288,833
    • Issue date Oct 30, 2007
    • Carsem (M) Sdn. Bhd.
    • Lee Kock Huat
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stress-free lead frame
    • Patent number 6,867,483
    • Issue date Mar 15, 2005
    • Carsen Semiconductor SDN. BHD.
    • Lee Kock Huat
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for sawing a moulded leadframe package
    • Patent number 6,544,817
    • Issue date Apr 8, 2003
    • Carsem Semiconductor SDN. BHD.
    • Lee Kock Huat
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents