Mengzhi Pang

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Solder joints with enhanced electromigration resistance
- Patent number 8,759,974
- Issue date Jun 24, 2014
- Intel Corporation
- Mengzhi Pang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Doping of lead-free solder alloys and structures formed thereby
- Patent number 8,395,051
- Issue date Mar 12, 2013
- Intel Corporation
- Mengzhi Pang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joints with enhanced electromigration resistance
- Patent number 8,013,444
- Issue date Sep 6, 2011
- Intel Corporation
- Mengzhi Pang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pin grid array package substrate including pins having curved pin h...
- Patent number 7,791,185
- Issue date Sep 7, 2010
- Intel Corporation
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System, apparatus, and method for advanced solder bumping
- Patent number 7,790,598
- Issue date Sep 7, 2010
- Intel Corporation
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of providing mixed size solder bumps on a substrate using a...
- Patent number 7,569,471
- Issue date Aug 4, 2009
- Intel Corporation
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System, apparatus, and method for advanced solder bumping
- Patent number 7,517,788
- Issue date Apr 14, 2009
- Intel Corporation
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of providing solder bumps of mixed sizes on a substrate usin...
- Patent number 7,485,563
- Issue date Feb 3, 2009
- Intel Corporation
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pin grid array package substrate including pins having anchoring el...
- Patent number 7,485,017
- Issue date Feb 3, 2009
- Intel Corporation
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE
- Publication number 20110290864
- Publication date Dec 1, 2011
- Mengzhi PANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE
- Publication number 20110293962
- Publication date Dec 1, 2011
- Mengzhi PANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Doping of lead-free solder alloys and structures formed thereby
- Publication number 20100155115
- Publication date Jun 24, 2010
- Mengzhi Pang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE
- Publication number 20100155947
- Publication date Jun 24, 2010
- Mengzhi PANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM, APPARATUS, AND METHOD FOR ADVANCED SOLDER BUMPING
- Publication number 20090196000
- Publication date Aug 6, 2009
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD TO PREVENT COPPER MIGRATION IN A SEMICONDUCTOR PACKAGE
- Publication number 20090166864
- Publication date Jul 2, 2009
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pin Grid Array Package Substrate Including Pins Having Curved Pin H...
- Publication number 20080303135
- Publication date Dec 11, 2008
- Mengzhi Pang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PIN GRID ARRAY PACKAGE SUBSTRATE INCLUDING PINS HAVING ANCHORING EL...
- Publication number 20080305655
- Publication date Dec 11, 2008
- Mengzhi Pang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solder composition doped with a barrier component and method of mak...
- Publication number 20080242063
- Publication date Oct 2, 2008
- Mengzhi Pang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC DIE INCLUDING SOLDER CAPS ON BUMPING SITES THEREOF...
- Publication number 20080160751
- Publication date Jul 3, 2008
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of providing solder bumps of mixed sizes on a substrate usin...
- Publication number 20080003802
- Publication date Jan 3, 2008
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of providing solder bumps of mixed sizes on a substrate usin...
- Publication number 20080003804
- Publication date Jan 3, 2008
- Ravi Nalla
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of providing mixed size solder bumps on a substrate using a...
- Publication number 20080003805
- Publication date Jan 3, 2008
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of providing solder bumps using reflow in a forming gas atmo...
- Publication number 20070269973
- Publication date Nov 22, 2007
- Ravi K. Nalla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System, apparatus, and method for advanced solder bumping
- Publication number 20070152024
- Publication date Jul 5, 2007
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and method for solder bumping using a disposable mask and a...
- Publication number 20070155154
- Publication date Jul 5, 2007
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and method for advanced solder bumping using a disposable mask
- Publication number 20070145104
- Publication date Jun 28, 2007
- Mengzhi Pang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and method for flip chip substrate pad
- Publication number 20070148951
- Publication date Jun 28, 2007
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Mengzhi Pang

Person

Patents Grantslast 30 patents

Solder joints with enhanced electromigration resistance

Doping of lead-free solder alloys and structures formed thereby

Solder joints with enhanced electromigration resistance

Pin grid array package substrate including pins having curved pin h...

System, apparatus, and method for advanced solder bumping

Method of providing mixed size solder bumps on a substrate using a...

System, apparatus, and method for advanced solder bumping

Method of providing solder bumps of mixed sizes on a substrate usin...

Pin grid array package substrate including pins having anchoring el...

Patents Applicationslast 30 patents

SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE

SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE

Doping of lead-free solder alloys and structures formed thereby

SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE

SYSTEM, APPARATUS, AND METHOD FOR ADVANCED SOLDER BUMPING

METHOD TO PREVENT COPPER MIGRATION IN A SEMICONDUCTOR PACKAGE

Pin Grid Array Package Substrate Including Pins Having Curved Pin H...

PIN GRID ARRAY PACKAGE SUBSTRATE INCLUDING PINS HAVING ANCHORING EL...

Solder composition doped with a barrier component and method of mak...

MICROELECTRONIC DIE INCLUDING SOLDER CAPS ON BUMPING SITES THEREOF...

Method of providing solder bumps of mixed sizes on a substrate usin...

Method of providing solder bumps of mixed sizes on a substrate usin...

Method of providing mixed size solder bumps on a substrate using a...

Method of providing solder bumps using reflow in a forming gas atmo...

System, apparatus, and method for advanced solder bumping

System and method for solder bumping using a disposable mask and a...

System and method for advanced solder bumping using a disposable mask

System and method for flip chip substrate pad