Meow Koon Eng

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged semiconductor assemblies and methods for manufacturing suc...
- Patent number 10,622,308
- Issue date Apr 14, 2020
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 10,396,059
- Issue date Aug 27, 2019
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 10,056,359
- Issue date Aug 21, 2018
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor assemblies and methods for manufacturing suc...
- Patent number 9,911,696
- Issue date Mar 6, 2018
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 9,653,444
- Issue date May 16, 2017
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic components
- Patent number 9,418,872
- Issue date Aug 16, 2016
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 9,165,910
- Issue date Oct 20, 2015
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 8,906,744
- Issue date Dec 9, 2014
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 8,536,702
- Issue date Sep 17, 2013
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with leadframes, including leadframe-b...
- Patent number 8,525,320
- Issue date Sep 3, 2013
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects for packaged semiconductor devices and methods for ma...
- Patent number 8,445,330
- Issue date May 21, 2013
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor assemblies and methods for manufacturing suc...
- Patent number 8,232,657
- Issue date Jul 31, 2012
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 8,198,720
- Issue date Jun 12, 2012
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies and packages
- Patent number 8,063,493
- Issue date Nov 22, 2011
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor assemblies and methods for manufacturing suc...
- Patent number 7,855,462
- Issue date Dec 21, 2010
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 7,843,050
- Issue date Nov 30, 2010
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects for packaged semiconductor devices and methods for ma...
- Patent number 7,791,203
- Issue date Sep 7, 2010
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic imagers and methods for manufacturing such microele...
- Patent number 7,659,134
- Issue date Feb 9, 2010
- Aptina Imaging Corporation
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies and packages with edge contacts and...
- Patent number 7,633,159
- Issue date Dec 15, 2009
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip semiconductor package
- Patent number 7,553,697
- Issue date Jun 30, 2009
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making multichip wafer level packages and computing syste...
- Patent number 7,485,562
- Issue date Feb 3, 2009
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,304,375
- Issue date Dec 4, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,271,027
- Issue date Sep 18, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellated chip-scale packages and methods for fabricating the same
- Patent number 7,208,335
- Issue date Apr 24, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,193,312
- Issue date Mar 20, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip semiconductor package
- Patent number 7,173,330
- Issue date Feb 6, 2007
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip wafer level packages and computing systems incorporating...
- Patent number 7,087,992
- Issue date Aug 8, 2006
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip semiconductor package and method of fabricating same
- Patent number 6,987,031
- Issue date Jan 17, 2006
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip wafer level system packages and methods of forming same
- Patent number 6,964,881
- Issue date Nov 15, 2005
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip semiconductor package
- Patent number 6,958,537
- Issue date Oct 25, 2005
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20220013460
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20200243444
- Publication date Jul 30, 2020
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20180323179
- Publication date Nov 8, 2018
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20180158778
- Publication date Jun 7, 2018
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20170207206
- Publication date Jul 20, 2017
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20160099237
- Publication date Apr 7, 2016
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20150091166
- Publication date Apr 2, 2015
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC COMPONENTS
- Publication number 20140141544
- Publication date May 22, 2014
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20140124960
- Publication date May 8, 2014
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20140015130
- Publication date Jan 16, 2014
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH LEADFRAMES, INCLUDING LEADFRAME-B...
- Publication number 20110215453
- Publication date Sep 8, 2011
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES WITH EDGE CONTACTS AND...
- Publication number 20100072603
- Publication date Mar 25, 2010
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20090014858
- Publication date Jan 15, 2009
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple chip semiconductor package
- Publication number 20070059862
- Publication date Mar 15, 2007
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device assemblies and packages with edge contacts and...
- Publication number 20060006521
- Publication date Jan 12, 2006
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Castellation wafer level packaging of integrated circuit chips
- Publication number 20060001143
- Publication date Jan 5, 2006
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple chip semiconductor package and method of fabricating same
- Publication number 20050236709
- Publication date Oct 27, 2005
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making multichip wafer level packages and computing syste...
- Publication number 20050116337
- Publication date Jun 2, 2005
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip wafer level packages and computing systems incorporating...
- Publication number 20050073029
- Publication date Apr 7, 2005
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Castellated chip-scale packages and methods for fabricating the same
- Publication number 20050067680
- Publication date Mar 31, 2005
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple chip semiconductor package
- Publication number 20050006748
- Publication date Jan 13, 2005
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged microelectronic devices and methods of packaging microelec...
- Publication number 20040238909
- Publication date Dec 2, 2004
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip wafer level system packages and methods of forming same
- Publication number 20040229400
- Publication date Nov 18, 2004
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip wafer level packages and computing systems incorporating...
- Publication number 20040046250
- Publication date Mar 11, 2004
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple chip semiconductor package and method of fabricating same
- Publication number 20040042190
- Publication date Mar 4, 2004
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip wafer level system packages and methods of forming same
- Publication number 20040043533
- Publication date Mar 4, 2004
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS

Meow Koon Eng

Person

Patents Grantslast 30 patents

Packaged semiconductor assemblies and methods for manufacturing suc...

Microelectronic die packages with metal leads, including metal lead...

Microelectronic die packages with metal leads, including metal lead...

Packaged semiconductor assemblies and methods for manufacturing suc...

Microelectronic die packages with metal leads, including metal lead...

Packaged microelectronic components

Microelectronic die packages with metal leads, including metal lead...

Microelectronic die packages with metal leads, including metal lead...

Microelectronic die packages with metal leads, including metal lead...

Microelectronic die packages with leadframes, including leadframe-b...

Interconnects for packaged semiconductor devices and methods for ma...

Packaged semiconductor assemblies and methods for manufacturing suc...

Microelectronic die packages with metal leads, including metal lead...

Semiconductor device assemblies and packages

Packaged semiconductor assemblies and methods for manufacturing suc...

Microelectronic die packages with metal leads, including metal lead...

Interconnects for packaged semiconductor devices and methods for ma...

Microelectronic imagers and methods for manufacturing such microele...

Semiconductor device assemblies and packages with edge contacts and...

Multiple chip semiconductor package

Method of making multichip wafer level packages and computing syste...

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Castellated chip-scale packages and methods for fabricating the same

Castellation wafer level packaging of integrated circuit chips

Multiple chip semiconductor package

Multichip wafer level packages and computing systems incorporating...

Multiple chip semiconductor package and method of fabricating same

Multi-chip wafer level system packages and methods of forming same

Multiple chip semiconductor package

Patents Applicationslast 30 patents

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

PACKAGED MICROELECTRONIC COMPONENTS

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

MICROELECTRONIC DIE PACKAGES WITH LEADFRAMES, INCLUDING LEADFRAME-B...

SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES WITH EDGE CONTACTS AND...

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

Multiple chip semiconductor package

Semiconductor device assemblies and packages with edge contacts and...

Castellation wafer level packaging of integrated circuit chips

Multiple chip semiconductor package and method of fabricating same

Method of making multichip wafer level packages and computing syste...

Multichip wafer level packages and computing systems incorporating...

Castellated chip-scale packages and methods for fabricating the same

Multiple chip semiconductor package

Packaged microelectronic devices and methods of packaging microelec...

Multichip wafer level system packages and methods of forming same

Multichip wafer level packages and computing systems incorporating...

Multiple chip semiconductor package and method of fabricating same

Multi-chip wafer level system packages and methods of forming same