Claims
- 1. A packaged microelectronic device, comprising:
an image sensor die having a first side with a bond-pad, an active area on the first side, and a second side opposite the first side; a radiation transmissive window attached to the first side of the die and positioned over the active area; and a lead mounted to the second side of the image sensor die and electrically coupled to the bond-pad.
- 2. The device of claim 1, further comprising a casing over the bond-pad, at least a portion of the second side of the image sensor die, and at least a portion of the lead.
- 3. The device of claim 1, further comprising a casing over the bond-pad, at least a portion of the second side of the image sensor die, and a portion of the lead; and
wherein the lead includes an end external to the casing.
- 4. A packaged microelectronic device, comprising:
an image sensor die having a first side with a bond-pad, an active area on the first side, and a second side opposite the first side; a radiation transmissive window positioned over the active area; a lead mounted to the second side of the image sensor die and electrically coupled to the bond-pad; a casing over the bond-pad, at least a portion of the second side of the image sensor die, and at least a portion of the lead; and a solder ball electrically coupled to the lead.
- 5. A packaged microelectronic device, comprising
an image sensor die having a first side with a bond-pad, an active area on the first side, and a second side opposite the first side; a radiation transmissive window positioned over the active area; a lead mounted to the second side of the image sensor die and electrically coupled to the bond-pad; and a casing over at least a portion of the second side of the image sensor die; wherein the lead includes a first end and a second end opposite the first end; wherein the first and second ends are covered by the casing; and wherein a portion of the lead between the first and second ends is exposed to an ambient environment.
- 6. The device of claim 1 wherein the lead is coupled to the second side of the image sensor die by a lead-on-chip tape.
- 7. A packaged microelectronic device, comprising
an image sensor die having a first side with a bond-pad, an active area on the first side, and a second side opposite the first side; a radiation transmissive window positioned over the active area; a lead mounted to the second side of the image sensor die and electrically coupled to the bond-pad; and a casing over at least a portion of the second side of the image sensor die; wherein the lead includes a first portion attached to the second side of the image sensor die and a second portion at least proximate to the first portion; wherein the casing has a recess exposing the second portion of the lead to an ambient environment; and wherein the recess defines an axis that intersects the window and the image sensor die.
- 8. A packaged microelectronic device, comprising:
an image sensor die having a first side with a bond-pad, an active area on the first side, and a second side opposite the first side: a radiation transmissive window positioned over the active area: a lead mounted to the second side of the image sensor die and electrically coupled to the bond-pad; and a casing over at least a portion of the second side of the image sensor die and a portion of the lead; wherein the lead includes a first portion attached to the image sensor die and a second portion spaced apart from the first portion; and wherein the casing includes a recess exposing the second portion of the lead for attachment to a substrate.
- 9. A packaged microelectronic device, comprising:
an image sensor die having a first side with a bond-pad, an active area on the first side, and a second side opposite the first side; a radiation transmissive window positioned over the active area; and a lead mounted to the second side of the image sensor die and electrically coupled to the bond-pad; wherein the window includes a first side and a second side attached to the image sensor die and opposite the first side; and wherein the device further comprises a removable protective covering over at least a portion of the first side of the window.
- 10. The device of claim 1 wherein the window is attached to the image sensor die with an adhesive.
- 11. A packaged microelectronic device, comprising:
an image sensor die having a first side with an active area, a plurality of bond-pads on the first side, and a second side opposite the first side; a radiation transmissive member juxtaposed to the first side of the image sensor die; a plurality of leads carried by the second side of the image sensor die and electrically coupled to corresponding bond-pads; and a casing covering the bond-pads, at least a portion of the second side of the image sensor die, and at least a portion of the individual leads.
- 12. The device of claim 11 wherein the leads include an end external to the casing.
- 13. The device of claim 11, further comprising:
a plurality of ball-pads on corresponding leads; and a plurality of solder balls on corresponding ball-pads; wherein the leads are not exposed to an ambient environment.
- 14. The device of claim 11 wherein:
the leads include a first end and a second end opposite the first end; the first and second ends are covered by the casing; and a portion of the leads between the first and second ends are exposed to an ambient environment.
- 15. The device of claim 11 wherein the leads are attached to the second side of the image sensor die by a lead-on-chip tape.
- 16. The device of claim 11 wherein:
the leads include a first portion attached to the second side of the image sensor die and a second portion at least proximate to the first portion; the casing has a plurality of recesses exposing the second portion of the leads; and the recesses define a plurality of axes that intersect the window and the image sensor die.
- 17. The device of claim 11 wherein:
the leads include a first portion attached to the image sensor die and a second portion spaced apart from the first portion; and the casing includes a plurality of recesses exposing the second portion of the leads for attachment to a substrate.
- 18. The device of claim 11 wherein:
the window includes a first side and a second side opposite the first side, the second side being attached to the image sensor die; and the device further comprises a removable protective covering over at least a portion of the first side of the window.
- 19. The device of claim 11 wherein the leads include a portion external to the casing, the portion having an arcuate configuration.
- 20. The device of claim 11 wherein the leads include a portion external to the casing, the portion having an “L” shaped configuration.
- 21. A packaged microelectronic device, comprising:
an image sensor die having a first side with a bond-pad, an active area, and a second side opposite the first side; a window at the first side of the image sensor die; a lead mounted to the second side of the image sensor die and electrically coupled to the bond-pad, the lead having a first end and a second end opposite the first end; and a casing over the bond-pad and at least a portion of the second side of the image sensor die, wherein at least a portion of the second end of the lead is exposed through the casing.
- 22. The device of claim 21 wherein:
the lead further includes a first portion attached to the second side of the image sensor die and a second portion at least proximate to the first portion; the casing has a recess exposing the second portion of the lead; and the recess defines an axis that intersects the window and the image sensor die.
- 23. The device of claim 21 wherein the lead is attached to the second side of the image sensor die by a lead-on-chip tape.
- 24. The device of claim 21 wherein:
the window includes a first side and a second side opposite the first side, the second side being attached to the image sensor die; and the device further comprises a removable protective covering over at least a portion of the first side of the window.
- 25. The device of claim 21 wherein the second end of the lead has an arcuate configuration.
- 26. The device of claim 21 wherein the second end of the lead has an “L” shaped configuration.
- 27. A method for packaging a microelectronic device including an image sensor die having a first side with a bond-pad, an active area, and a second side opposite the first side, the method comprising:
attaching a radiation transmissive window to the first side of the image sensor die; mounting a lead to the second side of the image sensor die; electrically coupling the bond-pad to the lead; and encapsulating at least a portion of the lead and at least a portion of the second side of the image sensor die with a casing.
- 28. The method of claim 27, further comprising attaching a removable protective covering over at least a portion of the window.
- 29. The method of claim 27 wherein the lead includes an end, and wherein encapsulating at least a portion of the lead comprises covering the portion of the lead with the casing without covering the end of the lead.
- 30. The method of claim 27, further comprising:
forming a ball-pad on the lead; and placing a solder ball on the ball-pad.
- 31. The method of claim 27 wherein the lead includes a first end and a second end opposite the first end, and wherein encapsulating at least a portion of the lead comprises covering the first and second ends of the lead with the casing without covering a portion of the lead between the first and second ends.
- 32. The method of claim 27 wherein:
the lead includes a first portion and a second portion at least proximate to the first portion, the first portion being attached to the second side of the image sensor die; and encapsulating at least a portion of the lead comprises covering the portion of the lead with the casing without covering the second portion of the lead.
- 33. The method of claim 27 wherein coupling the lead to the image sensor die comprises attaching the lead to the image sensor die with a lead-on-chip tape.
- 34. A method for packaging a microelectronic device, comprising:
positioning a window at an active area of a first side of an image sensor die; mounting a lead to a second side of the image sensor die opposite the first side; electrically coupling a bond-pad on the first side of the image sensor die to the lead; disposing the window, the image sensor die, and the lead in a mold cavity; and injecting a mold compound into the mold cavity to encapsulate at least a portion of the image sensor die.
- 35. The method of claim 34 wherein disposing the window, the image sensor die, and the lead in the mold cavity comprises applying a force to the lead to press the window against a wall of the mold cavity.
- 36. The method of claim 34, further comprising:
removing the window, the image sensor, and the lead from the mold cavity as a unit; forming a ball-pad on the lead; and placing a solder ball on the ball-pad.
- 37. The method of claim 34, further comprising attaching a removable protective covering over the window before disposing the window in the mold cavity.
- 38. The device of claim 11 wherein the radiation transmissive member comprises a window.
Priority Claims (1)
Number |
Date |
Country |
Kind |
200303053-3 |
May 2003 |
SG |
|
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority benefits of Singapore Application No. 200303053-3 filed May 30, 2003, the entirety of which is incorporated herein by reference.