Michael Berger

Person

Gardiner, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Polyimide compositions and use thereof in ceramic product defect re...
- Patent number 7,608,295
- Issue date Oct 27, 2009
- International Business Machines Corporation
- Krishna G Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electronic package repair process
- Patent number 7,294,909
- Issue date Nov 13, 2007
- International Business Machines Corporation
- Jon A. Casey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Materials and method to seal vias in silicon substrates
- Patent number 7,199,450
- Issue date Apr 3, 2007
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package repair process
- Patent number 6,916,670
- Issue date Jul 12, 2005
- International Business Machines Corporation
- Jon A. Casey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
UV-curable compositions and method of use thereof in microelectronics
- Patent number 6,682,872
- Issue date Jan 27, 2004
- International Business Machines Corporation
- Krishna G. Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Mechanical attachment means used as electrical connection
- Patent number 6,287,126
- Issue date Sep 11, 2001
- International Business Machines Corporation
- Michael Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aryl Cyanate and/or diepoxide and tetrahydropyranyl-protected hydro...
- Patent number 6,114,450
- Issue date Sep 5, 2000
- International Business Corporation
- Krishna Gandhi Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Aryl cyanate and/or diepoxide and hydroxymethylated phenolic or hyd...
- Patent number 5,955,543
- Issue date Sep 21, 1999
- International Business Machines Corporation
- Krishna Gandhi Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polymer sealants/adhesives and use thereof in electronic package as...
- Patent number 5,773,561
- Issue date Jun 30, 1998
- International Business Machines Corporation
- Krishna Gandhi Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Solvent-free epoxy based adhesives for semiconductor chip attachmen...
- Patent number 5,700,581
- Issue date Dec 23, 1997
- International Business Machines Corporation
- Krishna G. Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Contact sensor-based microdispensing tool
- Patent number 5,507,872
- Issue date Apr 16, 1996
- International Business Machines Corporation
- Annette B. Antenucci
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Structure for repairing semiconductor substrates
- Patent number 5,493,076
- Issue date Feb 20, 1996
- International Business Machines Corporation
- James M. Levite
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for repairing semiconductor substrates
- Patent number 5,446,961
- Issue date Sep 5, 1995
- International Business Machines Corporation
- James M. Levite
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for making simultaneous electrical connections
- Patent number 5,288,007
- Issue date Feb 22, 1994
- International Business Machine Corporation
- Mario J. Interrante
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods for making simultaneous electrical connections
- Patent number 5,193,732
- Issue date Mar 16, 1993
- International Business Machines Corporation
- Mario J. Interrante
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
POLYIMIDE COMPOSITIONS AND USE THEREOF IN CERAMIC PRODUCT DEFECT RE...
- Publication number 20070154631
- Publication date Jul 5, 2007
- International Business Machines Corporation
- Krishna G. Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MATERIALS AND METHOD TO SEAL VIAS IN SILICON SUBSTRATES
- Publication number 20060255480
- Publication date Nov 16, 2006
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic package repair process
- Publication number 20050176255
- Publication date Aug 11, 2005
- Jon A. Casey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic package repair process
- Publication number 20040148765
- Publication date Aug 5, 2004
- International Business Machines Corporation
- Jon A. Casey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Polyimide compositions and use thereof in ceramic product defect re...
- Publication number 20040132900
- Publication date Jul 8, 2004
- International Business Machines Corporation
- Krishna G. Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
UV-curable compositions and method of use thereof in microelectronics
- Publication number 20030138733
- Publication date Jul 24, 2003
- International Business Machines Corporation
- Krishna G. Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Michael Berger

Person

Patents Grantslast 30 patents

Polyimide compositions and use thereof in ceramic product defect re...

Electronic package repair process

Materials and method to seal vias in silicon substrates

Electronic package repair process

UV-curable compositions and method of use thereof in microelectronics

Mechanical attachment means used as electrical connection

Aryl Cyanate and/or diepoxide and tetrahydropyranyl-protected hydro...

Aryl cyanate and/or diepoxide and hydroxymethylated phenolic or hyd...

Polymer sealants/adhesives and use thereof in electronic package as...

Solvent-free epoxy based adhesives for semiconductor chip attachmen...

Contact sensor-based microdispensing tool

Structure for repairing semiconductor substrates

Method for repairing semiconductor substrates

Apparatus and methods for making simultaneous electrical connections

Apparatus and methods for making simultaneous electrical connections

Patents Applicationslast 30 patents

POLYIMIDE COMPOSITIONS AND USE THEREOF IN CERAMIC PRODUCT DEFECT RE...

MATERIALS AND METHOD TO SEAL VIAS IN SILICON SUBSTRATES

Electronic package repair process

Electronic package repair process

Polyimide compositions and use thereof in ceramic product defect re...

UV-curable compositions and method of use thereof in microelectronics