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Fowler "Double Element Bonding Head" Tech Digest No. 12 (Western Electric) Oct. 1968; p. 9. |
IBM TDB, vol. 8, No. 11, Apr. 1966, p. 1469, "Repairing Breaks in Printed Circuits". |
IBM TDB, vol. 11, No. 7, Dec. 1968, p. 876, "Solder Coating Thin Copper Wire". |
IBM TDB, vol. 14, No. 5, Oct. 1971, p. 1359, "Soldering Device". |
IBM TDB, vol. 14, No. 10, Mar. 1972, p. 2915, "Open Conductor Repair for Glass Metal Module". |
IBM TDB, vol. 15, No. 8, Jan. 1973, p. 2423, "Conductive Line Jumper/Repair connection in Glass Metal Module". |
IBM TDB, vol. 16, No. 4, Sep. 1973, p. 1153 "Flexible Circuit Package for Mechanical Thermal Pulse Bonding". |
IBM TDB, vol. 18, No. 12, May 1976, p. 3984, "Individually Controllable Wire Solder Reflow Bonding Tip". |
IBM TDB, vol. 22, No. 9, Feb. 1980, pp. 3986-3987, "Circuit Repair/work of Metalized Polyimide Substrates". |
IBM TDB, vol. 26, No. 12, May 1984, pp. 6244-6245, "Josephson Package Repair". |
IBM TDB, vol. 27, No. 5, Oct. 1984, p. 3401, "Thermo-Compression Bonding |
IBM TDB, vol. 29, No. 2, Jul. 1986, pp. 720-721, "Automatic Soldering Machine for Fine-Wire Connections". |
IBM TDB, vol. 31, No. 2, Jul. 1988, pp. 312-313, "Automated Point-to-Point Soldering Workstation". |
IBM TDB, vol. 31, No. 6, Nov. 1988, pp. 236-237, "Equal Force Planarity Device". |
IBM TDB, vol. 32, No. 4A, Sep. 1989, pp. 429-430, "Ablative Cleaning of Bonding Surfaces". |
Micro-Swiss/Bonding Tools and Production Accessories, 1980, "Tailless Ball and Wedge Bonding Cycle", Ultrasonic Bonding Wedges; Die Collets. |
Bonding Tools, 1977, pp. 18-21, "Part Two: Bonding Wedges" Gaiser Tool Company. |
"Thermocompression Bonding Manual", 1976, pp. 4-11, Gaiser Tool Company. |
U.S. patent application Ser. No. 07/725,415 filed on Jul. 1, 1990 entitled "Localized Soldering Station Using State Changing Medium". |
Technical Digest No. 20 (Western Electric), Oct. 1970, pp. 7-8, "Multidirectional Ultrasonic Wire Bonding Tip", Avedissian. |
Technical Digest No. 12 (Western Electric), Oct. 1968, p. 9, Fowler, W. H., "Double Bonding Head". |