Michael D. Goodner

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Antireflective coatings for via fill and photolithography applicati...
- Patent number 8,992,806
- Issue date Mar 31, 2015
- Honeywell International Inc.
- Bo Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Forming semiconductor structures
- Patent number 8,513,111
- Issue date Aug 20, 2013
- Intel Corporation
- Robert P. Meagley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method buffer coating having a physical mixture of high toughness p...
- Patent number 8,104,172
- Issue date Jan 31, 2012
- Intel Corporation
- Michael D. Goodner
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Antireflective coatings for via fill and photolithography applicati...
- Patent number 8,053,159
- Issue date Nov 8, 2011
- Honeywell International Inc.
- Bo Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Pixelated photoresists
- Patent number 8,003,293
- Issue date Aug 23, 2011
- Intel Corporation
- Robert P. Meagley
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Silicon-doped carbon dielectrics
- Patent number 7,790,630
- Issue date Sep 7, 2010
- Intel Corporation
- Michael D. Goodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffer coating having a physical mixture of high toughness polymer...
- Patent number 7,732,936
- Issue date Jun 8, 2010
- Intel Corporation
- Michael D. Goodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing porous dielectric materials
- Patent number 7,658,975
- Issue date Feb 9, 2010
- Intel Corporation
- Grant Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoactive resist capping layer
- Patent number 7,615,337
- Issue date Nov 10, 2009
- Intel Corporation
- Robert P. Meagley
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of forming air gaps in a dielectric material using a sacrifi...
- Patent number 7,595,555
- Issue date Sep 29, 2009
- Intel Corporation
- James S. Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite photoresist for modifying die-side bumps
- Patent number 7,585,615
- Issue date Sep 8, 2009
- Intel Corporation
- Kurt Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to modulate etch rate in SLAM
- Patent number 7,572,732
- Issue date Aug 11, 2009
- Intel Corporation
- Michael D. Goodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-k dielectric layer formed from aluminosilicate precursors
- Patent number 7,563,727
- Issue date Jul 21, 2009
- Intel Corporation
- Michael D. Goodner
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sealing porous dielectric materials
- Patent number 7,560,165
- Issue date Jul 14, 2009
- Intel Corporation
- Grant Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a silicon nitride film
- Patent number 7,470,450
- Issue date Dec 30, 2008
- Intel Corporation
- Michael L. McSwiney
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formation of interconnect structures by removing sacrificial materi...
- Patent number 7,466,025
- Issue date Dec 16, 2008
- Intel Corporation
- Michael D. Goodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal ion separation from aqueous solutions using photoswitchable i...
- Patent number 7,452,728
- Issue date Nov 18, 2008
- Intel Corporation
- Bob E. Leet
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Healing detrimental bonds in deposited materials
- Patent number 7,439,179
- Issue date Oct 21, 2008
- Intel Corporation
- Michael D. Goodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic-framework zeolite interlayer dielectrics
- Patent number 7,365,375
- Issue date Apr 29, 2008
- Intel Corporation
- Michael D. Goodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
UV-activated dielectric layer
- Patent number 7,358,597
- Issue date Apr 15, 2008
- Intel Corporation
- Michael D. Goodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive dielectric layer
- Patent number 7,344,972
- Issue date Mar 18, 2008
- Intel Corporation
- Michael D. Goodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using zeolites to improve the mechanical strength of low-k interlay...
- Patent number 7,303,989
- Issue date Dec 4, 2007
- Intel Corporation
- Boyan Boyanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of air gaps in an interconnect structure using a thin per...
- Patent number 7,294,568
- Issue date Nov 13, 2007
- Intel Corporation
- Michael D. Goodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered films formed by controlled phase segregation
- Patent number 7,241,707
- Issue date Jul 10, 2007
- Intel Corporation
- Robert P. Meagley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy harvesting molecules and photoresist technology
- Patent number 7,235,344
- Issue date Jun 26, 2007
- Intel Corporation
- Robert P. Meagley
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stacked device underfill and a method of fabrication
- Patent number 7,180,180
- Issue date Feb 20, 2007
- Intel Corporation
- Grant M. Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a dielectric layer using porogens
- Patent number 7,169,715
- Issue date Jan 30, 2007
- Intel Corporation
- Andrew W. Ott
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Polymer sacrificial light absorbing structure and method
- Patent number 7,157,755
- Issue date Jan 2, 2007
- Intel Corporation
- Michael D. Goodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a dielectric layer using a hydrocarbon-containing precursor
- Patent number 7,138,158
- Issue date Nov 21, 2006
- Intel Corporation
- Robert P. Meagley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low-temperature silicon nitride deposition
- Patent number 7,125,582
- Issue date Oct 24, 2006
- Intel Corporation
- Michael L. McSwiney
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Buffer coating having a physical mixture of high toughness polymer...
- Publication number 20100210072
- Publication date Aug 19, 2010
- Intel Corporation
- Michael D. Goodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE, METHOD OF MANF...
- Publication number 20090133908
- Publication date May 28, 2009
- Michael D. Goodner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Photodefinable buffer coating materials
- Publication number 20080054416
- Publication date Mar 6, 2008
- Michael D. Goodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite photoresist for modifying die-side bumps
- Publication number 20080026318
- Publication date Jan 31, 2008
- Kurt Schultz
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Methods of internal stress reduction in dielectric films with chemi...
- Publication number 20070123059
- Publication date May 31, 2007
- Michael G. Haverty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming a dielectric layer using a hydrocarbon-containing precursor
- Publication number 20070032675
- Publication date Feb 8, 2007
- Robert P. Meagley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Healing detrimental bonds in deposited materials
- Publication number 20060292707
- Publication date Dec 28, 2006
- Michael D. Goodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming semiconductor structures
- Publication number 20060255432
- Publication date Nov 16, 2006
- Robert P. Meagley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon-doped carbon dielectrics
- Publication number 20060226516
- Publication date Oct 12, 2006
- Intel Corporation
- Michael D. Goodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming boron-doped and fluorine-doped organosilicate gla...
- Publication number 20060222864
- Publication date Oct 5, 2006
- George A. Antonelli
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Reducing internal film stress in dielectric film
- Publication number 20060220251
- Publication date Oct 5, 2006
- Grant Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Organic-framework zeolite interlayer dielectrics
- Publication number 20060214303
- Publication date Sep 28, 2006
- Intel Corporation
- Michael D. Goodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to modulate etch rate in SLAM
- Publication number 20060205221
- Publication date Sep 14, 2006
- Michael D. Goodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered films formed by controlled phase segregation
- Publication number 20060183348
- Publication date Aug 17, 2006
- Robert P. Meagley
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method of forming air gaps in a dielectric material using a sacrifi...
- Publication number 20060138663
- Publication date Jun 29, 2006
- James S. Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selectively growing a polymeric material on a semiconductor substrate
- Publication number 20060118922
- Publication date Jun 8, 2006
- Michael D. Goodner
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Using zeolites to improve the mechanical strength of low-k interlay...
- Publication number 20060108687
- Publication date May 25, 2006
- Boyan Boyanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-k dielectric layer formed from aluminosilicate precursors
- Publication number 20060097359
- Publication date May 11, 2006
- Michael D. Goodner
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Pixelated photoresists
- Publication number 20060068318
- Publication date Mar 30, 2006
- Robert P. Meagley
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Electronic devices with molecular sieve layers
- Publication number 20060068190
- Publication date Mar 30, 2006
- Intel Corporation
- Michael D. Goodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Precursors for film formation
- Publication number 20060063394
- Publication date Mar 23, 2006
- Michael L. McSwiney
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Controlling resist profiles through substrate modification
- Publication number 20060057506
- Publication date Mar 16, 2006
- Michael D. Goodner
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Photoactive resist capping layer
- Publication number 20060046206
- Publication date Mar 2, 2006
- Robert P. Meagley
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Formation of air gaps in an interconnect structure using a thin per...
- Publication number 20060040492
- Publication date Feb 23, 2006
- Michael D. Goodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Energy harvesting molecules and photoresist technology
- Publication number 20060003253
- Publication date Jan 5, 2006
- Robert P. Meagley
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Porous ceramic materials as low-k films in semiconductor devices
- Publication number 20050287787
- Publication date Dec 29, 2005
- Grant M. Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate imprinting techniques
- Publication number 20050260790
- Publication date Nov 24, 2005
- Michael D. Goodner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal ion separation from aqueous solutions using photoswitchable i...
- Publication number 20050258107
- Publication date Nov 24, 2005
- Bob E. Leet
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Photosensitive dielectric layer
- Publication number 20050239281
- Publication date Oct 27, 2005
- Michael D. Goodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming air gaps in a dielectric material using a sacrifi...
- Publication number 20050230836
- Publication date Oct 20, 2005
- James S. Clarke
- H01 - BASIC ELECTRIC ELEMENTS

Michael D. Goodner

Person

Patents Grantslast 30 patents

Antireflective coatings for via fill and photolithography applicati...

Forming semiconductor structures

Method buffer coating having a physical mixture of high toughness p...

Antireflective coatings for via fill and photolithography applicati...

Pixelated photoresists

Silicon-doped carbon dielectrics

Buffer coating having a physical mixture of high toughness polymer...

Sealing porous dielectric materials

Photoactive resist capping layer

Method of forming air gaps in a dielectric material using a sacrifi...

Composite photoresist for modifying die-side bumps

Method to modulate etch rate in SLAM

Low-k dielectric layer formed from aluminosilicate precursors

Sealing porous dielectric materials

Forming a silicon nitride film

Formation of interconnect structures by removing sacrificial materi...

Metal ion separation from aqueous solutions using photoswitchable i...

Healing detrimental bonds in deposited materials

Organic-framework zeolite interlayer dielectrics

UV-activated dielectric layer

Photosensitive dielectric layer

Using zeolites to improve the mechanical strength of low-k interlay...

Formation of air gaps in an interconnect structure using a thin per...

Layered films formed by controlled phase segregation

Energy harvesting molecules and photoresist technology

Stacked device underfill and a method of fabrication

Forming a dielectric layer using porogens

Polymer sacrificial light absorbing structure and method

Forming a dielectric layer using a hydrocarbon-containing precursor

Low-temperature silicon nitride deposition

Patents Applicationslast 30 patents

Buffer coating having a physical mixture of high toughness polymer...

INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE, METHOD OF MANF...

Photodefinable buffer coating materials

Composite photoresist for modifying die-side bumps

Methods of internal stress reduction in dielectric films with chemi...

Forming a dielectric layer using a hydrocarbon-containing precursor

Healing detrimental bonds in deposited materials

Forming semiconductor structures

Silicon-doped carbon dielectrics

Method of forming boron-doped and fluorine-doped organosilicate gla...

Reducing internal film stress in dielectric film

Organic-framework zeolite interlayer dielectrics

Method to modulate etch rate in SLAM

Layered films formed by controlled phase segregation

Method of forming air gaps in a dielectric material using a sacrifi...

Selectively growing a polymeric material on a semiconductor substrate

Using zeolites to improve the mechanical strength of low-k interlay...

Low-k dielectric layer formed from aluminosilicate precursors

Pixelated photoresists

Electronic devices with molecular sieve layers

Precursors for film formation

Controlling resist profiles through substrate modification

Photoactive resist capping layer

Formation of air gaps in an interconnect structure using a thin per...

Energy harvesting molecules and photoresist technology

Porous ceramic materials as low-k films in semiconductor devices

Substrate imprinting techniques

Metal ion separation from aqueous solutions using photoswitchable i...

Photosensitive dielectric layer

Method of forming air gaps in a dielectric material using a sacrifi...