Michael D. Turner

Person

San Antonio, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for bonding semiconductor wafers
- Patent number 9,418,830
- Issue date Aug 16, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Jeffrey D. Hanna
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reducing microelectromechanical systems stiction by formation of a...
- Patent number 9,108,842
- Issue date Aug 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Michael D. Turner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Shallow trench isolation for SOI structures combining sidewall spac...
- Patent number 8,766,362
- Issue date Jul 1, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Konstantin V. Loiko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shallow trench isolation for SOI structures combining sidewall spac...
- Patent number 8,236,638
- Issue date Aug 7, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Konstantin V. Loiko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving the wafer-to-wafer thickness uniformity of sili...
- Patent number 8,084,088
- Issue date Dec 27, 2011
- GLOBALFOUNDRIES Inc.
- Katja Huy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dual plasma treatment barrier film to reduce low-k damage
- Patent number 7,763,538
- Issue date Jul 27, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Michael D. Turner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor structure utilizing spacer removal...
- Patent number 7,713,801
- Issue date May 11, 2010
- Vishal P. Trivedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep STI trench and SOI undercut enabling STI oxide stressor
- Patent number 7,678,665
- Issue date Mar 16, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Michael D. Turner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming an electronic device including a semiconductor l...
- Patent number 7,670,895
- Issue date Mar 2, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Toni D. Van Gompel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming electronic device including a densified nitride...
- Patent number 7,528,078
- Issue date May 5, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Toni D. Van Gompel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming an electronic device including a layer formed us...
- Patent number 7,491,622
- Issue date Feb 17, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Michael D. Turner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having trench isolation for differential stres...
- Patent number 7,288,447
- Issue date Oct 30, 2007
- Jian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor structure with dual trench for optimized stress effect a...
- Patent number 7,276,406
- Issue date Oct 2, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Jian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for elimination of excessive field oxide recess for thin Si SOI
- Patent number 7,037,857
- Issue date May 2, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Toni D. Van Gompel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation trench
- Patent number 6,979,627
- Issue date Dec 27, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Choh-Fei Yeap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device having a low K dielectric
- Patent number 6,903,004
- Issue date Jun 7, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Gregory S. Spencer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR BONDING SEMICONDUCTOR WAFERS
- Publication number 20150380235
- Publication date Dec 31, 2015
- JEFFREY D. HANNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING MICROELECTROMECHANICAL SYSTEMS STICTION BY FORMATION OF A...
- Publication number 20150021717
- Publication date Jan 22, 2015
- Michael D. Turner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SHALLOW TRENCH ISOLATION FOR SOI STRUCTURES COMBINING SIDEWALL SPAC...
- Publication number 20140299935
- Publication date Oct 9, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Konstantin V. Loiko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHALLOW TRENCH ISOLATION FOR SOI STRUCTURES COMBINING SIDEWALL SPAC...
- Publication number 20120273889
- Publication date Nov 1, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Konstantin V. Loiko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shallow trench isolation for SOI structures combining sidewall spac...
- Publication number 20080261361
- Publication date Oct 23, 2008
- Freescale Semiconductor, Inc.
- Konstantin V. Loiko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR STRUCTURE UTILIZING SPACER REMOVAL...
- Publication number 20080242094
- Publication date Oct 2, 2008
- Vishal P. Trivedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deep STI trench and SOI undercut enabling STI oxide stressor
- Publication number 20080220617
- Publication date Sep 11, 2008
- Freescale Semiconductor, Inc.
- Michael D. Turner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STRAINING A SEMICONDUCTOR DEVICE
- Publication number 20070298623
- Publication date Dec 27, 2007
- Gregory S. Spencer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process of forming electronic device including a densified nitride...
- Publication number 20070264839
- Publication date Nov 15, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Toni D. Van Gompel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device including a semiconductor layer and another layer...
- Publication number 20070246793
- Publication date Oct 25, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Toni D. Van Gompel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process of forming an electronic device including a layer formed us...
- Publication number 20070249160
- Publication date Oct 25, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Michael D. Turner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device including a semiconductor layer and a sidewall sp...
- Publication number 20070249127
- Publication date Oct 25, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Rode R. Mora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a stressor structure
- Publication number 20070224772
- Publication date Sep 27, 2007
- Freescale Semiconductor, Inc.
- Mark D. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual plasma treatment barrier film to reduce low-k damage
- Publication number 20070161229
- Publication date Jul 12, 2007
- Freescale Semiconductor, Inc.
- Michael D. Turner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device including a trench field isolation region and a p...
- Publication number 20060261436
- Publication date Nov 23, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Michael D. Turner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having trench isolation for differential stres...
- Publication number 20060157783
- Publication date Jul 20, 2006
- Jian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistor structure with dual trench for optimized stress effect a...
- Publication number 20060091461
- Publication date May 4, 2006
- Jian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation trench
- Publication number 20050242403
- Publication date Nov 3, 2005
- Choh-Fei Yeap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR DEVICE HAVING A LOW K DIELECTRIC
- Publication number 20050130405
- Publication date Jun 16, 2005
- Gregory S. Spencer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for elimination of excessive field oxide reces...
- Publication number 20050130359
- Publication date Jun 16, 2005
- Toni D. Van Gompel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of improving the wafer-to-wafer thickness uniformity of sili...
- Publication number 20050026434
- Publication date Feb 3, 2005
- Katja Huy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Michael D. Turner

Person

Patents Grantslast 30 patents

Methods for bonding semiconductor wafers

Reducing microelectromechanical systems stiction by formation of a...

Shallow trench isolation for SOI structures combining sidewall spac...

Shallow trench isolation for SOI structures combining sidewall spac...

Method of improving the wafer-to-wafer thickness uniformity of sili...

Dual plasma treatment barrier film to reduce low-k damage

Method of making a semiconductor structure utilizing spacer removal...

Deep STI trench and SOI undercut enabling STI oxide stressor

Process of forming an electronic device including a semiconductor l...

Process of forming electronic device including a densified nitride...

Process of forming an electronic device including a layer formed us...

Semiconductor device having trench isolation for differential stres...

Transistor structure with dual trench for optimized stress effect a...

Method for elimination of excessive field oxide recess for thin Si SOI

Isolation trench

Method of making a semiconductor device having a low K dielectric

Patents Applicationslast 30 patents

METHODS FOR BONDING SEMICONDUCTOR WAFERS

REDUCING MICROELECTROMECHANICAL SYSTEMS STICTION BY FORMATION OF A...

SHALLOW TRENCH ISOLATION FOR SOI STRUCTURES COMBINING SIDEWALL SPAC...

SHALLOW TRENCH ISOLATION FOR SOI STRUCTURES COMBINING SIDEWALL SPAC...

Shallow trench isolation for SOI structures combining sidewall spac...

METHOD OF MAKING A SEMICONDUCTOR STRUCTURE UTILIZING SPACER REMOVAL...

Deep STI trench and SOI undercut enabling STI oxide stressor

METHOD FOR STRAINING A SEMICONDUCTOR DEVICE

Process of forming electronic device including a densified nitride...

Electronic device including a semiconductor layer and another layer...

Process of forming an electronic device including a layer formed us...

Electronic device including a semiconductor layer and a sidewall sp...

Method for forming a stressor structure

Dual plasma treatment barrier film to reduce low-k damage

Electronic device including a trench field isolation region and a p...

Semiconductor device having trench isolation for differential stres...

Transistor structure with dual trench for optimized stress effect a...

Isolation trench

METHOD OF MAKING A SEMICONDUCTOR DEVICE HAVING A LOW K DIELECTRIC

Method and apparatus for elimination of excessive field oxide reces...

Method of improving the wafer-to-wafer thickness uniformity of sili...