Michael John Flynn

Person

Waterford, IE

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packages to minimize stress on a semiconductor die
- Patent number 12,027,472
- Issue date Jul 2, 2024
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages to minimize stress on a semiconductor die
- Patent number 11,616,027
- Issue date Mar 28, 2023
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for reducing stress on circuit components
- Patent number 11,417,611
- Issue date Aug 16, 2022
- Analog Devices International Unlimited Company
- Padraig Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Suspended microelectromechanical system (MEMS) devices
- Patent number 10,843,920
- Issue date Nov 24, 2020
- Analog Devices International Unlimited Company
- Kotlanka Rama Krishna
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar processing of suspended microelectromechanical systems (MEMS...
- Patent number 10,800,649
- Issue date Oct 13, 2020
- Analog Devices International Unlimited Company
- Michael John Flynn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Isolator and method of forming an isolator
- Patent number 9,941,565
- Issue date Apr 10, 2018
- Analog Devices Global
- Conor John McLoughlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of trimming a component and a component trimmed by such a me...
- Patent number 9,887,687
- Issue date Feb 6, 2018
- Analog Devices Global
- Seamus Paul Whiston
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE
- Publication number 20240304569
- Publication date Sep 12, 2024
- Analong Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan et al.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE
- Publication number 20230207489
- Publication date Jun 29, 2023
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS FOR REDUCING STRESS ON CIRCUIT COMPONENTS
- Publication number 20220328426
- Publication date Oct 13, 2022
- Analog Devices International Unlimited Company
- Padraig Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS FOR REDUCING STRESS ON CIRCUIT COMPONENTS
- Publication number 20210265281
- Publication date Aug 26, 2021
- Analog Devices International Unlimited Company
- Padraig Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE
- Publication number 20210183790
- Publication date Jun 17, 2021
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSPENDED MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICES
- Publication number 20200283291
- Publication date Sep 10, 2020
- Analog Devices International Unlimited Company
- Kotlanka Rama Krishna
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PLANAR PROCESSING OF SUSPENDED MICROELECTROMECHANICAL SYSTEMS (MEMS...
- Publication number 20180148318
- Publication date May 31, 2018
- ANALOG DEVICES GLOBAL
- Michael John Flynn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ISOLATOR AND METHOD OF FORMING AN ISOLATOR
- Publication number 20170117602
- Publication date Apr 27, 2017
- ANALOG DEVICES GLOBAL
- Conor John McLoughlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRIMMING A COMPONENT AND A COMPONENT TRIMMED BY SUCH A ME...
- Publication number 20160219719
- Publication date Jul 28, 2016
- ANALOG DEVICES GLOBAL
- Seamus Paul Whiston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Michael John Flynn

Person

Patents Grantslast 30 patents

Integrated circuit packages to minimize stress on a semiconductor die

Integrated circuit packages to minimize stress on a semiconductor die

Devices and methods for reducing stress on circuit components

Suspended microelectromechanical system (MEMS) devices

Planar processing of suspended microelectromechanical systems (MEMS...

Isolator and method of forming an isolator

Method of trimming a component and a component trimmed by such a me...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE

INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE

DEVICES AND METHODS FOR REDUCING STRESS ON CIRCUIT COMPONENTS

DEVICES AND METHODS FOR REDUCING STRESS ON CIRCUIT COMPONENTS

INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE

SUSPENDED MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICES

PLANAR PROCESSING OF SUSPENDED MICROELECTROMECHANICAL SYSTEMS (MEMS...

ISOLATOR AND METHOD OF FORMING AN ISOLATOR

METHOD OF TRIMMING A COMPONENT AND A COMPONENT TRIMMED BY SUCH A ME...