Michael Kelly

Person

Queen Creek, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with tiered pillar and manufacturing method th...
- Patent number 12,183,594
- Issue date Dec 31, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with front side and back side redistribution...
- Patent number 12,159,823
- Issue date Dec 3, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 12,136,565
- Issue date Nov 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded electronic component package
- Patent number 12,040,305
- Issue date Jul 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with routing patch and conductive interconnec...
- Patent number 11,901,335
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 11,676,941
- Issue date Jun 13, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with front side and back side redistribution...
- Patent number 11,652,038
- Issue date May 16, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded electronic component package
- Patent number 11,646,290
- Issue date May 9, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 11,424,155
- Issue date Aug 23, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with high routing density patch
- Patent number 11,289,451
- Issue date Mar 29, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tiered pillar and manufacturing method th...
- Patent number 11,031,256
- Issue date Jun 8, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded electronic component package
- Patent number 11,031,366
- Issue date Jun 8, 2021
- Amkor Technology Singapore Pte. Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 10,943,858
- Issue date Mar 9, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 10,784,232
- Issue date Sep 22, 2020
- Amkor Technology, Inc.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tiered pillar and manufacturing method th...
- Patent number 10,748,786
- Issue date Aug 18, 2020
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 10,714,378
- Issue date Jul 14, 2020
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with high routing density patch
- Patent number 10,672,740
- Issue date Jun 2, 2020
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 10,497,674
- Issue date Dec 3, 2019
- Amkor Technology, Inc.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded electronic component package
- Patent number 10,424,556
- Issue date Sep 24, 2019
- Amkor Technology, Inc.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 10,312,220
- Issue date Jun 4, 2019
- Amkor Technology, Inc.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 10,283,400
- Issue date May 7, 2019
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tiered pillar and manufacturing method th...
- Patent number 10,256,114
- Issue date Apr 9, 2019
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 10,192,816
- Issue date Jan 29, 2019
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 10,090,234
- Issue date Oct 2, 2018
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with high routing density patch
- Patent number 10,074,630
- Issue date Sep 11, 2018
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 10,032,748
- Issue date Jul 24, 2018
- Amkor Technology, Inc.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component package and fabrication method
- Patent number 10,014,240
- Issue date Jul 3, 2018
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 9,966,300
- Issue date May 8, 2018
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 9,852,976
- Issue date Dec 26, 2017
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with a plurality of redistribution structures hav...
- Patent number 9,818,684
- Issue date Nov 14, 2017
- Amkor Technology, Inc.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038042
- Publication date Jan 30, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20240266324
- Publication date Aug 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20230282560
- Publication date Sep 7, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED ELECTRONIC COMPONENT PACKAGE
- Publication number 20230275061
- Publication date Aug 31, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20230154893
- Publication date May 18, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230040553
- Publication date Feb 9, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20220223563
- Publication date Jul 14, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED ELECTRONIC COMPONENT PACKAGE
- Publication number 20220052016
- Publication date Feb 17, 2022
- Amkor Technology Singapore Holding Pte. Ltd
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TIERED PILLAR AND MANUFACTURING METHOD TH...
- Publication number 20210296139
- Publication date Sep 23, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20210217692
- Publication date Jul 15, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20210020605
- Publication date Jan 21, 2021
- Amkor Technology Singapore Holding Pte. Ltd
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20200411475
- Publication date Dec 31, 2020
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200343129
- Publication date Oct 29, 2020
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TIERED PILLAR AND MANUFACTURING METHOD TH...
- Publication number 20200294815
- Publication date Sep 17, 2020
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20200227385
- Publication date Jul 16, 2020
- Amkor Technology, Inc.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED ELECTRONIC COMPONENT PACKAGE
- Publication number 20190371760
- Publication date Dec 5, 2019
- Amkor Technology, Inc.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190326161
- Publication date Oct 24, 2019
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TIERED PILLAR AND MANUFACTURING METHOD TH...
- Publication number 20190237343
- Publication date Aug 1, 2019
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20190189552
- Publication date Jun 20, 2019
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20190115319
- Publication date Apr 18, 2019
- Amkor Technology, Inc.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20190043829
- Publication date Feb 7, 2019
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TIERED PILLAR AND MANUFACTURING METHOD TH...
- Publication number 20180277394
- Publication date Sep 27, 2018
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20180240744
- Publication date Aug 23, 2018
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20180005987
- Publication date Jan 4, 2018
- Amkor Technology, Inc.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20170271307
- Publication date Sep 21, 2017
- Amkor Technology, Inc.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170263544
- Publication date Sep 14, 2017
- Amkor Technology, Inc.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package and Manufacturing Method Thereof
- Publication number 20170186679
- Publication date Jun 29, 2017
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20170133310
- Publication date May 11, 2017
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor package
- Publication number 20170005070
- Publication date Jan 5, 2017
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED ELECTRONIC COMPONENT PACKAGE
- Publication number 20160351525
- Publication date Dec 1, 2016
- Amkor Technology, Inc.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS

Michael Kelly

Person

Patents Grantslast 30 patents

Semiconductor device with tiered pillar and manufacturing method th...

Semiconductor package with front side and back side redistribution...

Semiconductor device package and manufacturing method thereof

Shielded electronic component package

Semiconductor package with routing patch and conductive interconnec...

Semiconductor package and fabricating method thereof

Semiconductor package with front side and back side redistribution...

Shielded electronic component package

Semiconductor device package and manufacturing method thereof

Semiconductor package with high routing density patch

Semiconductor device with tiered pillar and manufacturing method th...

Shielded electronic component package

Semiconductor package and fabricating method thereof

Semiconductor package and fabricating method thereof

Semiconductor device with tiered pillar and manufacturing method th...

Semiconductor device package and manufacturing method thereof

Semiconductor package with high routing density patch

Semiconductor package and fabricating method thereof

Shielded electronic component package

Semiconductor package and fabricating method thereof

Semiconductor device package and manufacturing method thereof

Semiconductor device with tiered pillar and manufacturing method th...

Semiconductor package and fabricating method thereof

Semiconductor device package and manufacturing method thereof

Semiconductor package with high routing density patch

Semiconductor package and fabricating method thereof

Embedded component package and fabrication method

Semiconductor device package and manufacturing method thereof

Semiconductor package and fabricating method thereof

Electronic device with a plurality of redistribution structures hav...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SHIELDED ELECTRONIC COMPONENT PACKAGE

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

SHIELDED ELECTRONIC COMPONENT PACKAGE

SEMICONDUCTOR DEVICE WITH TIERED PILLAR AND MANUFACTURING METHOD TH...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH TIERED PILLAR AND MANUFACTURING METHOD TH...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SHIELDED ELECTRONIC COMPONENT PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH TIERED PILLAR AND MANUFACTURING METHOD TH...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

SEMICONDUCTOR DEVICE WITH TIERED PILLAR AND MANUFACTURING METHOD TH...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Device Package and Manufacturing Method Thereof

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

Method of manufacturing a semiconductor package

SHIELDED ELECTRONIC COMPONENT PACKAGE