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Michael Kochanowski

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  • Portland, OR, US
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    VIA HEAT SINK MATERIAL
    • Publication number 20080023840
    • Publication date Jan 31, 2008
    • J. S. Lewis
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    SACRIFICIAL COMPONENT
    • Publication number 20060288567
    • Publication date Dec 28, 2006
    • Intel Corporation
    • Shawn L. Lloyd
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INTEGRATED CIRCUIT PACKAGE SOCKET AND SOCKET CONTACT
    • Publication number 20060216957
    • Publication date Sep 28, 2006
    • Shawn L. Lloyd
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Making electrical connections between a circuit board and an integr...
    • Publication number 20050227509
    • Publication date Oct 13, 2005
    • Shawn L. Lloyd
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Sacrificial component
    • Publication number 20050218516
    • Publication date Oct 6, 2005
    • Shawn L. Lloyd
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Via heat sink material
    • Publication number 20050103826
    • Publication date May 19, 2005
    • J.S. Lewis
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ANTI-TOMBSTONING STRUCTURES AND METHODS OF MANUFACTURE
    • Publication number 20030056975
    • Publication date Mar 27, 2003
    • Intel Corporation
    • Michael Kochanowski
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...