Michael Stadler

Person

Muenchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method of soldering a semiconductor chip to a chip carrier
- Patent number 12,132,017
- Issue date Oct 29, 2024
- Infineon Technologies AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method for producing a semiconductor...
- Patent number 11,990,405
- Issue date May 21, 2024
- Infineon Technologies AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, metal sheet for use in a semiconductor packa...
- Patent number 11,901,257
- Issue date Feb 13, 2024
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and clip with a die attach
- Patent number 11,869,830
- Issue date Jan 9, 2024
- Infineon Technologies AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a contact clip with a contact region ha...
- Patent number 11,869,865
- Issue date Jan 9, 2024
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip with chip pad and associated solder flux outgassing trench
- Patent number 11,830,835
- Issue date Nov 28, 2023
- Infineon Technologies AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metal clip with a solder volume balan...
- Patent number 11,769,748
- Issue date Sep 26, 2023
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal clip with solder volume balancing reservoir
- Patent number 11,545,459
- Issue date Jan 3, 2023
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method for producing a semiconductor...
- Patent number 11,430,731
- Issue date Aug 30, 2022
- Infineon Technologies AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure with radial spokes for improved s...
- Patent number 11,355,429
- Issue date Jun 7, 2022
- Infineon Technologies AG
- Paul Armand Asentista Calo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating a semiconductor device
- Patent number 11,088,105
- Issue date Aug 10, 2021
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF SOLDERING A SEMICONDUCTOR CHIP TO A CHIP CARRIER
- Publication number 20240055376
- Publication date Feb 15, 2024
- INFINEON TECHNOLOGIES AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES INCLUDING VENT OPENINGS AND ASSOCIATED METHODS
- Publication number 20230420317
- Publication date Dec 28, 2023
- INFINEON TECHNOLOGIES AG
- Michael STADLER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Segmented Leadframe for Flip Chip Attaching a Semiconductor Die Inc...
- Publication number 20230108181
- Publication date Apr 6, 2023
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A METAL CLIP WITH A SOLDER VOLUME BALAN...
- Publication number 20230094794
- Publication date Mar 30, 2023
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CLIP WITH SOLDER VOLUME BALANCING RESERVOIR
- Publication number 20220238475
- Publication date Jul 28, 2022
- INFINEON TECHNOLOGIES AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Arrangement and Method for Producing a Semiconductor...
- Publication number 20220216139
- Publication date Jul 7, 2022
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip with Chip Pad and Associated Solder Flux Outgassing Trench
- Publication number 20220068851
- Publication date Mar 3, 2022
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A CONTACT CLIP WITH A CONTACT REGION HA...
- Publication number 20210358877
- Publication date Nov 18, 2021
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Interconnect Structure with Radial Spokes for Improved S...
- Publication number 20210233839
- Publication date Jul 29, 2021
- Paul Armand Asentista Calo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Arrangement and Method for Producing a Semiconductor...
- Publication number 20200266141
- Publication date Aug 20, 2020
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package, Metal Sheet for Use in a Semiconductor Packa...
- Publication number 20200185301
- Publication date Jun 11, 2020
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Fabricating a Semiconductor Device
- Publication number 20200168575
- Publication date May 28, 2020
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND CLIP WITH A DIE ATTACH
- Publication number 20200152554
- Publication date May 14, 2020
- INFINEON TECHNOLOGIES AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A RECESS AND METHOD OF FABRICATING...
- Publication number 20200051880
- Publication date Feb 13, 2020
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS

Michael Stadler

Person

Patents Grantslast 30 patents

Method of soldering a semiconductor chip to a chip carrier

Semiconductor arrangement and method for producing a semiconductor...

Semiconductor package, metal sheet for use in a semiconductor packa...

Semiconductor package and clip with a die attach

Semiconductor device having a contact clip with a contact region ha...

Chip with chip pad and associated solder flux outgassing trench

Semiconductor device having a metal clip with a solder volume balan...

Metal clip with solder volume balancing reservoir

Semiconductor arrangement and method for producing a semiconductor...

Electrical interconnect structure with radial spokes for improved s...

Semiconductor device and method for fabricating a semiconductor device

Patents Applicationslast 30 patents

METHOD OF SOLDERING A SEMICONDUCTOR CHIP TO A CHIP CARRIER

ELECTRONIC DEVICES INCLUDING VENT OPENINGS AND ASSOCIATED METHODS

Segmented Leadframe for Flip Chip Attaching a Semiconductor Die Inc...

SEMICONDUCTOR DEVICE HAVING A METAL CLIP WITH A SOLDER VOLUME BALAN...

METAL CLIP WITH SOLDER VOLUME BALANCING RESERVOIR

Semiconductor Arrangement and Method for Producing a Semiconductor...

Chip with Chip Pad and Associated Solder Flux Outgassing Trench

SEMICONDUCTOR DEVICE HAVING A CONTACT CLIP WITH A CONTACT REGION HA...

Electrical Interconnect Structure with Radial Spokes for Improved S...

Semiconductor Arrangement and Method for Producing a Semiconductor...

Semiconductor Package, Metal Sheet for Use in a Semiconductor Packa...

Semiconductor Device and Method for Fabricating a Semiconductor Device

SEMICONDUCTOR PACKAGE AND CLIP WITH A DIE ATTACH

SEMICONDUCTOR DEVICE COMPRISING A RECESS AND METHOD OF FABRICATING...