Michael Walk

Person

Mesa, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for manufacturing imprinted substrates
- Patent number 7,637,008
- Issue date Dec 29, 2009
- Intel Corporation
- Thomas S. Dory
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate-imprinting methods
- Patent number 7,594,321
- Issue date Sep 29, 2009
- Intel Corporation
- Thomas S. Dory
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
I/O Architecture for integrated circuit package
- Patent number 7,589,414
- Issue date Sep 15, 2009
- Intel Corporation
- Jiangqi He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages and components thereof formed by substrate-impr...
- Patent number 7,371,975
- Issue date May 13, 2008
- Intel Corporation
- Thomas S. Dory
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for tilted land grid array interconnects on a cor...
- Patent number 7,335,979
- Issue date Feb 26, 2008
- Intel Corporation
- Michael J. Walk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
I/O architecture for integrated circuit package
- Patent number 7,329,946
- Issue date Feb 12, 2008
- Intel Corporation
- Jianqi He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer integrated circuit package
- Patent number 7,245,001
- Issue date Jul 17, 2007
- Intel Corporation
- Boyd L. Coomer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tilted land grid array package and socket, systems, and methods
- Patent number 7,220,132
- Issue date May 22, 2007
- Intel Corporation
- Brent S. Stone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming an imprinting tool
- Patent number 7,186,365
- Issue date Mar 6, 2007
- Intel Corporation
- Michael Walk
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Integrated circuit package with low modulus layer and capacitor/int...
- Patent number 7,042,077
- Issue date May 9, 2006
- Intel Corporation
- Michael J. Walk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer integrated circuit package
- Patent number 6,899,815
- Issue date May 31, 2005
- Intel Corporation
- Boyd L. Coomer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
I/O architecture for integrated circuit package
- Patent number 6,897,556
- Issue date May 24, 2005
- Intel Corporation
- Jianqi He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor with extended surface lands and method of fabrication the...
- Patent number 6,483,692
- Issue date Nov 19, 2002
- Intel Corporation
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer substrate with low inductance capacitive paths
- Patent number 6,477,034
- Issue date Nov 5, 2002
- Intel Corporation
- Kishore K. Chakravorty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package having embedded capacitors and method of fabrica...
- Patent number 6,407,929
- Issue date Jun 18, 2002
- Intel Corporation
- Aaron Dean Hale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly with trench structures and methods of manufacture
- Patent number 6,388,207
- Issue date May 14, 2002
- Intel Corporation
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
I/O ARCHITECTURE FOR INTEGRATED CIRCUIT PACKAGE
- Publication number 20080088009
- Publication date Apr 17, 2008
- Jiangqi He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-IMPRINTING APPARATUS AND METHODS
- Publication number 20080000674
- Publication date Jan 3, 2008
- Intel Corporation
- Thomas S. Dory
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND APPARATUS FOR FORMING AN IMPRINTING TOOL
- Publication number 20070056454
- Publication date Mar 15, 2007
- Intel Corporation
- Michael Walk
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method and apparatus for substrate fabrication
- Publication number 20060172061
- Publication date Aug 3, 2006
- Toshimi Kohmura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device and method for tilted land grid array interconnects on a cor...
- Publication number 20050285255
- Publication date Dec 29, 2005
- Michael J. Walk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tilted land grid array package and socket, systems, and methods
- Publication number 20050287828
- Publication date Dec 29, 2005
- Brent S. Stone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Enhancing epoxy strength using kaolin filler
- Publication number 20050287714
- Publication date Dec 29, 2005
- Michael Walk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package with low modulus layer and capacitor/int...
- Publication number 20050230841
- Publication date Oct 20, 2005
- Michael J. Walk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit die and substrate coupling
- Publication number 20050212105
- Publication date Sep 29, 2005
- Michael J. Walk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
I/O architecture for integrated circuit package
- Publication number 20050145885
- Publication date Jul 7, 2005
- Jianqi He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
I/O architecture for integrated circuit package
- Publication number 20050051906
- Publication date Mar 10, 2005
- Jianqi He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-layer integrated circuit package
- Publication number 20050009353
- Publication date Jan 13, 2005
- Boyd L. Coomer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for forming an imprinting tool
- Publication number 20040247732
- Publication date Dec 9, 2004
- Michael Walk
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Imprinted substrate and methods of manufacture
- Publication number 20040118594
- Publication date Jun 24, 2004
- Intel Corporation
- Thomas S. Dory
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate-imprinting apparatus, methods of manufacture, and product...
- Publication number 20040118604
- Publication date Jun 24, 2004
- Intel Corporation
- Thomas S. Dory
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package for a non-volatile memory device including integrated passi...
- Publication number 20040026715
- Publication date Feb 12, 2004
- Eleanor P. Rabadam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-layer integrated circuit package
- Publication number 20030184987
- Publication date Oct 2, 2003
- Boyd L. Coomer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package for a non-volatile memory device including integrated passi...
- Publication number 20030122173
- Publication date Jul 3, 2003
- Eleanor P. Rabadam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitor with extended surface lands and method of fabrication the...
- Publication number 20020075630
- Publication date Jun 20, 2002
- Intel Corporation
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS

Michael Walk

Person

Patents Grantslast 30 patents

Methods for manufacturing imprinted substrates

Substrate-imprinting methods

I/O Architecture for integrated circuit package

Electronic packages and components thereof formed by substrate-impr...

Device and method for tilted land grid array interconnects on a cor...

I/O architecture for integrated circuit package

Multi-layer integrated circuit package

Tilted land grid array package and socket, systems, and methods

Methods for forming an imprinting tool

Integrated circuit package with low modulus layer and capacitor/int...

Multi-layer integrated circuit package

I/O architecture for integrated circuit package

Capacitor with extended surface lands and method of fabrication the...

Interposer substrate with low inductance capacitive paths

Electronic package having embedded capacitors and method of fabrica...

Electronic assembly with trench structures and methods of manufacture

Patents Applicationslast 30 patents

I/O ARCHITECTURE FOR INTEGRATED CIRCUIT PACKAGE

SUBSTRATE-IMPRINTING APPARATUS AND METHODS

SYSTEM AND APPARATUS FOR FORMING AN IMPRINTING TOOL

Method and apparatus for substrate fabrication

Device and method for tilted land grid array interconnects on a cor...

Tilted land grid array package and socket, systems, and methods

Enhancing epoxy strength using kaolin filler

Integrated circuit package with low modulus layer and capacitor/int...

Integrated circuit die and substrate coupling

I/O architecture for integrated circuit package

I/O architecture for integrated circuit package

Multi-layer integrated circuit package

Method and apparatus for forming an imprinting tool

Imprinted substrate and methods of manufacture

Substrate-imprinting apparatus, methods of manufacture, and product...

Package for a non-volatile memory device including integrated passi...

Multi-layer integrated circuit package

Package for a non-volatile memory device including integrated passi...

Capacitor with extended surface lands and method of fabrication the...