Michael Wise

Person

Larangeville, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-layer electrode and method of forming the same
- Patent number 7,319,270
- Issue date Jan 15, 2008
- Infineon Technologies AG
- Jingyu Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion layer for Pt on SiO2
- Patent number 7,270,884
- Issue date Sep 18, 2007
- Infineon Technologies AG
- Jingyu Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TEOS assisted oxide CMP process
- Patent number 7,091,103
- Issue date Aug 15, 2006
- International Business Machines Corporation
- Jochen Beintner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep isolation trenches
- Patent number 6,821,865
- Issue date Nov 23, 2004
- Infineon Technologies AG
- Michael Wise
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating transistors having damascene formed gate con...
- Patent number 6,812,092
- Issue date Nov 2, 2004
- Infineon Technologies
- Mihel Seitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer Pt electrode for DRAM and FRAM with high K dielectric m...
- Patent number 6,794,705
- Issue date Sep 21, 2004
- Infineon Technologies AG
- Jingyu Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with diamond-like carbon layer as a polish-sto...
- Patent number 6,696,759
- Issue date Feb 24, 2004
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recess Pt structure for high k stacked capacitor in DRAM and FRAM,...
- Patent number 6,596,580
- Issue date Jul 22, 2003
- Infineon Technologies AG
- Jingyu Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for improved isolation in trench storage cells
- Patent number 6,437,401
- Issue date Aug 20, 2002
- Infineon Technologies AG
- Jack A. Mandelman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse processing using dielectric planarization pillars
- Patent number 6,420,216
- Issue date Jul 16, 2002
- International Business Machines Corporation
- Larry Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for chemical mechanical planarization (CMP) o...
- Patent number 6,379,222
- Issue date Apr 30, 2002
- Siemens Aktiengesellschaft
- Michael Lester Wise
- B24 - GRINDING POLISHING
Information Patent Grant
Diamond as a polish-stop layer for chemical-mechanical planarizatio...
- Patent number 6,348,395
- Issue date Feb 19, 2002
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for chemical mechanical planarization (CMP) o...
- Patent number 6,020,262
- Issue date Feb 1, 2000
- Siemens Aktiengesellschaft
- Michael Lester Wise
- B24 - GRINDING POLISHING
Information Patent Grant
Mitigation of CMP-induced BPSG surface damage by an integrated anne...
- Patent number 5,915,175
- Issue date Jun 22, 1999
- Siemens Aktiengesellschaft
- Michael L. Wise
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multi-layer electrode and method of forming the same
- Publication number 20050023590
- Publication date Feb 3, 2005
- Jingyu Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion layer for Pt on SiO2
- Publication number 20040197576
- Publication date Oct 7, 2004
- Infineon Technologies North America Corp.
- Jingyu Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion layer for Pt on SiO2
- Publication number 20040197984
- Publication date Oct 7, 2004
- Infineon Technologies North America Corp.
- Jingyu Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED DEEP ISOLATION TRENCHES
- Publication number 20040126986
- Publication date Jul 1, 2004
- Michael Wise
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEOS assisted oxide CMP process
- Publication number 20040110380
- Publication date Jun 10, 2004
- International Business Machines Corporation
- Jochen Beintner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating transistors having damascene formed gate con...
- Publication number 20040033659
- Publication date Feb 19, 2004
- Mihel Seitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Recess Pt structure for high k stacked capacitor in DRAM and FRAM,...
- Publication number 20030077858
- Publication date Apr 24, 2003
- Jingyu Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-layer Pt electrode for DRAM and FRAM with high K dielectric m...
- Publication number 20020084481
- Publication date Jul 4, 2002
- Jingyu Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diamond as a polish-stop layer for chemical-mechanical planarizatio...
- Publication number 20020048959
- Publication date Apr 25, 2002
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED METHODS AND APPARATUS FOR CHEMICAL MECHANICAL PLANARIZATIO...
- Publication number 20010046831
- Publication date Nov 29, 2001
- WISE ET AL
- MICHAEL LESTER WISE
- B24 - GRINDING POLISHING

Michael Wise

Person

Patents Grantslast 30 patents

Multi-layer electrode and method of forming the same

Adhesion layer for Pt on SiO2

TEOS assisted oxide CMP process

Deep isolation trenches

Method for fabricating transistors having damascene formed gate con...

Multi-layer Pt electrode for DRAM and FRAM with high K dielectric m...

Semiconductor device with diamond-like carbon layer as a polish-sto...

Recess Pt structure for high k stacked capacitor in DRAM and FRAM,...

Structure and method for improved isolation in trench storage cells

Fuse processing using dielectric planarization pillars

Methods and apparatus for chemical mechanical planarization (CMP) o...

Diamond as a polish-stop layer for chemical-mechanical planarizatio...

Methods and apparatus for chemical mechanical planarization (CMP) o...

Mitigation of CMP-induced BPSG surface damage by an integrated anne...

Patents Applicationslast 30 patents

Multi-layer electrode and method of forming the same

Adhesion layer for Pt on SiO2

Adhesion layer for Pt on SiO2

IMPROVED DEEP ISOLATION TRENCHES

TEOS assisted oxide CMP process

Method for fabricating transistors having damascene formed gate con...

Recess Pt structure for high k stacked capacitor in DRAM and FRAM,...

Multi-layer Pt electrode for DRAM and FRAM with high K dielectric m...

Diamond as a polish-stop layer for chemical-mechanical planarizatio...

IMPROVED METHODS AND APPARATUS FOR CHEMICAL MECHANICAL PLANARIZATIO...