Michael Wozniak

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Circuitized substrates utilizing smooth-sided conductive layers as...
- Patent number 8,242,376
- Issue date Aug 14, 2012
- Endicott Interconnect Technologies, Inc.
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized substrates utilizing smooth-sided conductive layers as...
- Patent number 7,838,776
- Issue date Nov 23, 2010
- Endicott Interconnect Technologies, Inc.
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making circuitized substrates utilizing smooth-sided cond...
- Patent number 7,383,629
- Issue date Jun 10, 2008
- Endicott Interconnect Technologies, Inc.
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating method for circuitized substrates
- Patent number 7,169,313
- Issue date Jan 30, 2007
- Endicott Interconnect Technologies, Inc.
- Norman A. Card
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an electronic package possessing controlled im...
- Patent number 6,845,557
- Issue date Jan 25, 2005
- International Business Machines Corporation
- Thomas R. Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of removing holefill residue from a metallic surface of an...
- Patent number 6,776,852
- Issue date Aug 17, 2004
- International Business Machines Corporation
- Christina M. Boyko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper plated PTH barrels and methods for fabricating
- Patent number 6,630,743
- Issue date Oct 7, 2003
- International Business Machines Corporation
- Roy H. Magnuson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine pitch circuitization with filled plated through holes
- Patent number 6,618,940
- Issue date Sep 16, 2003
- International Business Machines Corporation
- Kenneth J. Lubert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing fine-line circuit boards using chemical polishing
- Patent number 6,547,974
- Issue date Apr 15, 2003
- International Business Machines Corporation
- Stanley Michael Albrechta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protection of a plated through hole from chemical attack
- Patent number 6,537,608
- Issue date Mar 25, 2003
- International Business Machines Corporation
- Thomas R. Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for high speed printed wiring boards with multiple differ...
- Patent number 6,469,256
- Issue date Oct 22, 2002
- International Business Machines Corporation
- Thomas R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch circuitization with unfilled plated through holes
- Patent number 6,467,160
- Issue date Oct 22, 2002
- International Business Machines Corporation
- Michael J. Cummings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine pitch circuitization with filled plated through holes
- Patent number 6,291,779
- Issue date Sep 18, 2001
- International Business Machines Corporation
- Kenneth J. Lubert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective seed and plate using permanent resist
- Patent number 6,264,851
- Issue date Jul 24, 2001
- International Business Machines Corporation
- Voya R. Markovich
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of making a circuitized substrate with an aperture
- Patent number 6,221,694
- Issue date Apr 24, 2001
- International Business Machines Corporation
- Anilkumar C. Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection of a plated through hole from chemical attack
- Patent number 6,188,027
- Issue date Feb 13, 2001
- International Business Machines Corporation
- Thomas R. Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of surface finishes for eliminating surface irregularities a...
- Patent number 6,093,335
- Issue date Jul 25, 2000
- International Business Machines Corporation
- Ashwinkumar C. Bhatt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Technique for removing defects from a layer of metal
- Patent number 5,893,983
- Issue date Apr 13, 1999
- International Business Machines Corporation
- John Joseph Konrad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for polishing metal surfaces
- Patent number 5,759,427
- Issue date Jun 2, 1998
- International Business Machines Corporation
- Edward Cibulsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flexible strip structure for a parallel processor and method of fab...
- Patent number 5,489,500
- Issue date Feb 6, 1996
- International Business Machines, Inc.
- John Andrejack
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUITIZED SUBSTRATES UTILIZING SMOOTH-SIDED CONDUCTIVE LAYERS AS...
- Publication number 20100328868
- Publication date Dec 30, 2010
- Endicott Interconnect Technologies, Inc.
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuitized substrates utilizing smooth-sided conductive layers as...
- Publication number 20080259581
- Publication date Oct 23, 2008
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plating method for circuitized substrates
- Publication number 20060255009
- Publication date Nov 16, 2006
- Endicott Interconnect Technologies, Inc.
- Norman A. Card
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuitized substrates utilizing smooth-sided conductive layers as...
- Publication number 20060110898
- Publication date May 25, 2006
- Endicott Interconnect Technologies, Inc.
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Copper plated PTH barrels and methods for fabricating
- Publication number 20030209799
- Publication date Nov 13, 2003
- International Business Machines Corporation
- Roy H. Magnuson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process of removing holefill residue from a metallic surface of an...
- Publication number 20030131870
- Publication date Jul 17, 2003
- Christina M. Boyko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Copper plated PTH barrels and methods for fabricating
- Publication number 20020195716
- Publication date Dec 26, 2002
- International Business Machines Corporation
- Roy H. Magnuson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure for high speed printed wiring boards with multiple differ...
- Publication number 20020189094
- Publication date Dec 19, 2002
- International Business Machines Corporation
- Thomas R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fine pitch circuitization with filled plated through holes
- Publication number 20010050183
- Publication date Dec 13, 2001
- Kenneth J. Lubert
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Protection of a plated through hole from chemical attack
- Publication number 20010000884
- Publication date May 10, 2001
- Thomas R. Miller
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Michael Wozniak

Person

Patents Grantslast 30 patents

Circuitized substrates utilizing smooth-sided conductive layers as...

Circuitized substrates utilizing smooth-sided conductive layers as...

Method of making circuitized substrates utilizing smooth-sided cond...

Plating method for circuitized substrates

Method for producing an electronic package possessing controlled im...

Process of removing holefill residue from a metallic surface of an...

Copper plated PTH barrels and methods for fabricating

Fine pitch circuitization with filled plated through holes

Method of producing fine-line circuit boards using chemical polishing

Protection of a plated through hole from chemical attack

Structure for high speed printed wiring boards with multiple differ...

Fine pitch circuitization with unfilled plated through holes

Fine pitch circuitization with filled plated through holes

Selective seed and plate using permanent resist

Method of making a circuitized substrate with an aperture

Protection of a plated through hole from chemical attack

Method of surface finishes for eliminating surface irregularities a...

Technique for removing defects from a layer of metal

Method and apparatus for polishing metal surfaces

Flexible strip structure for a parallel processor and method of fab...

Patents Applicationslast 30 patents

CIRCUITIZED SUBSTRATES UTILIZING SMOOTH-SIDED CONDUCTIVE LAYERS AS...

Circuitized substrates utilizing smooth-sided conductive layers as...

Plating method for circuitized substrates

Circuitized substrates utilizing smooth-sided conductive layers as...

Copper plated PTH barrels and methods for fabricating

Process of removing holefill residue from a metallic surface of an...

Copper plated PTH barrels and methods for fabricating

Structure for high speed printed wiring boards with multiple differ...

Fine pitch circuitization with filled plated through holes

Protection of a plated through hole from chemical attack