Michael Z. Su

Person

Round Rock, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 12,094,853
- Issue date Sep 17, 2024
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 11,469,212
- Issue date Oct 11, 2022
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with identification system
- Patent number 10,290,606
- Issue date May 14, 2019
- Advanced Micro Devices, Inc.
- Michael Alfano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with beyond reticle field conductor pads
- Patent number 9,806,014
- Issue date Oct 31, 2017
- Advanced Micro Devices, Inc.
- Michael S. Alfano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor workpiece with selective backside metallization
- Patent number 9,793,239
- Issue date Oct 17, 2017
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with thermal interface tape
- Patent number 9,627,281
- Issue date Apr 18, 2017
- Advanced Micro Device, Inc.
- Seth Prejean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor chips packaging
- Patent number 9,449,907
- Issue date Sep 20, 2016
- Advanced Micro Devices, Inc.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 9,437,561
- Issue date Sep 6, 2016
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor chips with thermal management
- Patent number 9,385,055
- Issue date Jul 5, 2016
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip device with polymeric filler trench
- Patent number 8,866,276
- Issue date Oct 21, 2014
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor chip device with thermal management circuit b...
- Patent number 8,796,842
- Issue date Aug 5, 2014
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip device with solder diffusion protection
- Patent number 8,759,962
- Issue date Jun 24, 2014
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power cycling test arrangement
- Patent number 8,749,254
- Issue date Jun 10, 2014
- Advanced Micro Devices, Inc.
- Michael Z. Su
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor workpiece with backside metallization and methods of...
- Patent number 8,723,314
- Issue date May 13, 2014
- Advanced Micro Devices, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of stacked semiconductor chips with electrically...
- Patent number 8,704,353
- Issue date Apr 22, 2014
- Advanced Micro Devices, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip device with underfill
- Patent number 8,691,626
- Issue date Apr 8, 2014
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor chip with supportive terminal...
- Patent number 8,647,974
- Issue date Feb 11, 2014
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having offset vias
- Patent number 8,624,404
- Issue date Jan 7, 2014
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip device with polymeric filler trench
- Patent number 8,617,926
- Issue date Dec 31, 2013
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip device with liquid thermal interface material
- Patent number 8,574,965
- Issue date Nov 5, 2013
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor chip device with thermal management
- Patent number 8,472,190
- Issue date Jun 25, 2013
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing and assembling semiconductor chips with off...
- Patent number 8,394,672
- Issue date Mar 12, 2013
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with reinforcing through-silicon-vias
- Patent number 8,338,961
- Issue date Dec 25, 2012
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip device with solder diffusion protection
- Patent number 8,299,633
- Issue date Oct 30, 2012
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with protective scribe structure
- Patent number 8,293,581
- Issue date Oct 23, 2012
- GLOBALFOUNDRIES Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connection structure with stress reduction arrangement f...
- Patent number 8,293,636
- Issue date Oct 23, 2012
- GLOBALFOUNDRIES, INC.
- Thomas Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with reinforcing through-silicon-vias
- Patent number 8,193,039
- Issue date Jun 5, 2012
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a filled trench structure and methods f...
- Patent number 8,174,131
- Issue date May 8, 2012
- GLOBALFOUNDRIES Inc.
- Zhen Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having stress relief layers and methods for f...
- Patent number 7,977,160
- Issue date Jul 12, 2011
- GLOBALFOUNDRIES, INC.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with reinforcement layer and method of making th...
- Patent number 7,897,433
- Issue date Mar 1, 2011
- Advanced Micro Devices, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Co-Packaging Assembly and Method for Attaching Photonic Dies/Module...
- Publication number 20240337799
- Publication date Oct 10, 2024
- Chipletz, Inc.
- Siddharth Ravichandran
- G02 - OPTICS
Information Patent Application
Low-Equivalent-Series-Resistance Capacitors with Solid-State Curren...
- Publication number 20240258041
- Publication date Aug 1, 2024
- Chipletz, Inc.
- Siddharth Ravichandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Prevention, Cessation, Detection, and Moni...
- Publication number 20240120293
- Publication date Apr 11, 2024
- Chipletz, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Assembly and Method of Attaching Multi-Height Dies/Modules...
- Publication number 20230411174
- Publication date Dec 21, 2023
- Chipletz, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductors Embedded in Package Substrate and Board and Method and Sy...
- Publication number 20230395305
- Publication date Dec 7, 2023
- Chipletz, Inc.
- Siddharth Ravichandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Package Vertical Interconnect and Method of Making Same
- Publication number 20230343687
- Publication date Oct 26, 2023
- Chipletz, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTEGRATED CAPACITORS
- Publication number 20230290746
- Publication date Sep 14, 2023
- CHIPLETZ, INC.
- Michael SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
- Publication number 20230031099
- Publication date Feb 2, 2023
- ADVANCED MICRO DEVICES, INC.
- BRYAN BLACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH BEYOND RETICLE FIELD CONDUCTOR PADS
- Publication number 20170213787
- Publication date Jul 27, 2017
- Michael S. Alfano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA CAPACITOR
- Publication number 20170092712
- Publication date Mar 30, 2017
- Joseph R. Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WORKPIECE WITH SELECTIVE BACKSIDE METALLIZATION
- Publication number 20170092616
- Publication date Mar 30, 2017
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
- Publication number 20160365335
- Publication date Dec 15, 2016
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR CHIPS PACKAGING
- Publication number 20150279773
- Publication date Oct 1, 2015
- Advanced Micro Devices, Inc.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH POLYMERIC FILLER TRENCH
- Publication number 20140103506
- Publication date Apr 17, 2014
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH IDENTIFICATION SYSTEM
- Publication number 20130341783
- Publication date Dec 26, 2013
- Michael Alfano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE WITH ONBOARD TEST STRUCTURE
- Publication number 20130342231
- Publication date Dec 26, 2013
- Michael Alfano
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING OFFSET VIAS
- Publication number 20130341802
- Publication date Dec 26, 2013
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT OF STACKED SEMICONDUCTOR CHIPS WITH ELECTRICALLY...
- Publication number 20130256872
- Publication date Oct 3, 2013
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT
- Publication number 20130256895
- Publication date Oct 3, 2013
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKING WITH COUPLED ELECTRICAL INTERCONNECTS TO ALIGN PROXIMI...
- Publication number 20130256913
- Publication date Oct 3, 2013
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WORKPIECE WITH BACKSIDE METALLIZATION AND METHODS OF...
- Publication number 20130221517
- Publication date Aug 29, 2013
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH OFFSET PADS
- Publication number 20130161814
- Publication date Jun 27, 2013
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER FOR MULTIPLE CHIP SYSTEMS
- Publication number 20130147028
- Publication date Jun 13, 2013
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH SOLDER DIFFUSION PROTECTION
- Publication number 20130049229
- Publication date Feb 28, 2013
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH SUPPORTIVE TERMINAL PAD
- Publication number 20120241985
- Publication date Sep 27, 2012
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REINFORCING THROUGH-SILICON-VIAS
- Publication number 20120205791
- Publication date Aug 16, 2012
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR CHIPS PACKAGING
- Publication number 20120193788
- Publication date Aug 2, 2012
- Advanced Micro Devices, Inc.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CYCLING TEST ARRANGEMENT
- Publication number 20120119767
- Publication date May 17, 2012
- Advanced Micro Devices, Inc.
- Michael Z. SU
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH LIQUID THERMAL INTERFACE MATERIAL
- Publication number 20120098119
- Publication date Apr 26, 2012
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR CHIP DEVICE WITH THERMAL MANAGEMENT
- Publication number 20120075807
- Publication date Mar 29, 2012
- Gamal Refai-Ahmed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Michael Z. Su

Person

Patents Grantslast 30 patents

Semiconductor chip with redundant thru-silicon-vias

Semiconductor chip with redundant thru-silicon-vias

Interposer with identification system

Interposer with beyond reticle field conductor pads

Semiconductor workpiece with selective backside metallization

Semiconductor chip with thermal interface tape

Stacked semiconductor chips packaging

Semiconductor chip with redundant thru-silicon-vias

Stacked semiconductor chips with thermal management

Semiconductor chip device with polymeric filler trench

Stacked semiconductor chip device with thermal management circuit b...

Semiconductor chip device with solder diffusion protection

Power cycling test arrangement

Semiconductor workpiece with backside metallization and methods of...

Thermal management of stacked semiconductor chips with electrically...

Semiconductor chip device with underfill

Method of fabricating a semiconductor chip with supportive terminal...

Integrated circuit package having offset vias

Semiconductor chip device with polymeric filler trench

Semiconductor chip device with liquid thermal interface material

Stacked semiconductor chip device with thermal management

Method of manufacturing and assembling semiconductor chips with off...

Semiconductor chip with reinforcing through-silicon-vias

Semiconductor chip device with solder diffusion protection

Semiconductor chip with protective scribe structure

Conductive connection structure with stress reduction arrangement f...

Semiconductor chip with reinforcing through-silicon-vias

Semiconductor device having a filled trench structure and methods f...

Semiconductor devices having stress relief layers and methods for f...

Semiconductor chip with reinforcement layer and method of making th...

Patents Applicationslast 30 patents

Co-Packaging Assembly and Method for Attaching Photonic Dies/Module...

Low-Equivalent-Series-Resistance Capacitors with Solid-State Curren...

Method and Apparatus for Prevention, Cessation, Detection, and Moni...

Package Assembly and Method of Attaching Multi-Height Dies/Modules...

Inductors Embedded in Package Substrate and Board and Method and Sy...

Through Package Vertical Interconnect and Method of Making Same

SEMICONDUCTOR PACKAGE WITH INTEGRATED CAPACITORS

SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS

INTERPOSER WITH BEYOND RETICLE FIELD CONDUCTOR PADS

VIA CAPACITOR

SEMICONDUCTOR WORKPIECE WITH SELECTIVE BACKSIDE METALLIZATION

SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS

STACKED SEMICONDUCTOR CHIPS PACKAGING

SEMICONDUCTOR CHIP DEVICE WITH POLYMERIC FILLER TRENCH

INTERPOSER WITH IDENTIFICATION SYSTEM

SEMICONDUCTOR SUBSTRATE WITH ONBOARD TEST STRUCTURE

INTEGRATED CIRCUIT PACKAGE HAVING OFFSET VIAS

THERMAL MANAGEMENT OF STACKED SEMICONDUCTOR CHIPS WITH ELECTRICALLY...

STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT

DIE STACKING WITH COUPLED ELECTRICAL INTERCONNECTS TO ALIGN PROXIMI...

SEMICONDUCTOR WORKPIECE WITH BACKSIDE METALLIZATION AND METHODS OF...

SEMICONDUCTOR CHIP WITH OFFSET PADS

HEAT SPREADER FOR MULTIPLE CHIP SYSTEMS

SEMICONDUCTOR CHIP DEVICE WITH SOLDER DIFFUSION PROTECTION

SEMICONDUCTOR CHIP WITH SUPPORTIVE TERMINAL PAD

SEMICONDUCTOR CHIP WITH REINFORCING THROUGH-SILICON-VIAS

STACKED SEMICONDUCTOR CHIPS PACKAGING

POWER CYCLING TEST ARRANGEMENT

SEMICONDUCTOR CHIP DEVICE WITH LIQUID THERMAL INTERFACE MATERIAL

STACKED SEMICONDUCTOR CHIP DEVICE WITH THERMAL MANAGEMENT