MICHIMASA TAKAHASHI

Person

OGAKI, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Combined wiring board and method for manufacturing the same
- Patent number 10,004,145
- Issue date Jun 19, 2018
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing combined wiring board
- Patent number 9,844,151
- Issue date Dec 12, 2017
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,750,136
- Issue date Aug 29, 2017
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid wiring board
- Patent number 9,717,151
- Issue date Jul 25, 2017
- Ibiden Co., Ltd.
- Hirotaka Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combined wiring board and method for manufacturing combined wiring...
- Patent number 9,635,765
- Issue date Apr 25, 2017
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combined wiring board
- Patent number 9,603,238
- Issue date Mar 21, 2017
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combined wiring board and method for manufacturing combined wiring...
- Patent number 9,538,663
- Issue date Jan 3, 2017
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid wiring board and method for manufacturing flex-rigid wir...
- Patent number 9,480,173
- Issue date Oct 25, 2016
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 9,425,137
- Issue date Aug 23, 2016
- Ibiden Co., Ltd.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for plug-in board replacement and method for manufacturing m...
- Patent number 9,370,101
- Issue date Jun 14, 2016
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combined wiring board and method for manufacturing the same
- Patent number 9,277,655
- Issue date Mar 1, 2016
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combined wiring board and method for manufacturing the same
- Patent number 9,277,650
- Issue date Mar 1, 2016
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid wiring board and method of manufacturing the same
- Patent number 9,271,405
- Issue date Feb 23, 2016
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multi-piece substrate and multi-piece subs...
- Patent number 9,215,811
- Issue date Dec 15, 2015
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing flex-rigid wiring board
- Patent number 9,084,381
- Issue date Jul 14, 2015
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,066,439
- Issue date Jun 23, 2015
- Ibiden Co., Ltd.
- Hiroshi Segawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,040,837
- Issue date May 26, 2015
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,029,713
- Issue date May 12, 2015
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed circuit board and method for manufacturing the...
- Patent number 9,027,238
- Issue date May 12, 2015
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a multilayered circuit board
- Patent number 8,973,259
- Issue date Mar 10, 2015
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 8,933,556
- Issue date Jan 13, 2015
- Ibiden Co., Ltd.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid wiring board and method of manufacturing the same
- Patent number 8,925,194
- Issue date Jan 6, 2015
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and fabrication method therefor
- Patent number 8,921,705
- Issue date Dec 30, 2014
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed circuit board and method for manufacturing the...
- Patent number 8,912,451
- Issue date Dec 16, 2014
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,908,377
- Issue date Dec 9, 2014
- Ibiden Co., Ltd.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid wiring board and method for manufacturing the same
- Patent number 8,759,687
- Issue date Jun 24, 2014
- Ibiden Co., Ltd.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and manufacturing method of multila...
- Patent number 8,737,087
- Issue date May 27, 2014
- Ibiden Co., Ltd.
- Yasuhiro Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board
- Patent number 8,705,248
- Issue date Apr 22, 2014
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed circuit board and method for manufacturing the...
- Patent number 8,692,132
- Issue date Apr 8, 2014
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing flex-rigid wiring board
- Patent number 8,677,612
- Issue date Mar 25, 2014
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230063719
- Publication date Mar 2, 2023
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170171974
- Publication date Jun 15, 2017
- IBIDEN CO., LTD.
- MICHIMASA TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD
- Publication number 20160095207
- Publication date Mar 31, 2016
- IBIDEN CO., LTD.
- Hirotaka TANIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD
- Publication number 20160066429
- Publication date Mar 3, 2016
- IBIDEN CO., LTD.
- Hirotaka TANIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED WIRING BOARD
- Publication number 20150257269
- Publication date Sep 10, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150245474
- Publication date Aug 27, 2015
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150136454
- Publication date May 21, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150136453
- Publication date May 21, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING FLEX-RIGID WIR...
- Publication number 20150114689
- Publication date Apr 30, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING FLEX-RIGID WIR...
- Publication number 20150114690
- Publication date Apr 30, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING...
- Publication number 20150085461
- Publication date Mar 26, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150083471
- Publication date Mar 26, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150075848
- Publication date Mar 19, 2015
- IBIDEN CO., LTD.
- Nobuyuki NAGANUMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING...
- Publication number 20150055313
- Publication date Feb 26, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND FABRICATION METHOD THEREFOR
- Publication number 20140318848
- Publication date Oct 30, 2014
- IBIDEN CO., LTD.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED WIRING BOARD
- Publication number 20140133110
- Publication date May 15, 2014
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20140131074
- Publication date May 15, 2014
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING...
- Publication number 20140133111
- Publication date May 15, 2014
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PLUG-IN BOARD REPLACEMENT, METHOD FOR MANUFACTURING MULT...
- Publication number 20140063770
- Publication date Mar 6, 2014
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130213694
- Publication date Aug 22, 2013
- IBIDEN CO., LTD.
- Michimasa Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130153269
- Publication date Jun 20, 2013
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD OF MULTILA...
- Publication number 20130112469
- Publication date May 9, 2013
- IBIDEN CO., LTD.
- Yasuhiro WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MULTI-PIECE SUBSTRATE AND MULTI-PIECE SUBS...
- Publication number 20130081857
- Publication date Apr 4, 2013
- MICHIMASA TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF
- Publication number 20130033837
- Publication date Feb 7, 2013
- Sotaro Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130025914
- Publication date Jan 31, 2013
- IBIDEN CO., LTD.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130025925
- Publication date Jan 31, 2013
- IBIDEN CO., LTD.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130014982
- Publication date Jan 17, 2013
- IBIDEN CO., LTD.
- Hiroshi SEGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120291276
- Publication date Nov 22, 2012
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...
- Publication number 20120106108
- Publication date May 3, 2012
- IBIDEN CO., LTD.
- Sotaro ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...
- Publication number 20120077317
- Publication date Mar 29, 2012
- IBIDEN CO., LTD.
- Sotaro ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

MICHIMASA TAKAHASHI

Person

Patents Grantslast 30 patents

Combined wiring board and method for manufacturing the same

Method for manufacturing combined wiring board

Wiring board and method for manufacturing the same

Flex-rigid wiring board

Combined wiring board and method for manufacturing combined wiring...

Combined wiring board

Combined wiring board and method for manufacturing combined wiring...

Flex-rigid wiring board and method for manufacturing flex-rigid wir...

Wiring board

Method for plug-in board replacement and method for manufacturing m...

Combined wiring board and method for manufacturing the same

Combined wiring board and method for manufacturing the same

Flex-rigid wiring board and method of manufacturing the same

Method for manufacturing multi-piece substrate and multi-piece subs...

Method for manufacturing flex-rigid wiring board

Wiring board and method for manufacturing the same

Wiring board and method for manufacturing the same

Printed wiring board and method for manufacturing the same

Multilayered printed circuit board and method for manufacturing the...

Method for manufacturing a multilayered circuit board

Wiring board

Flex-rigid wiring board and method of manufacturing the same

Wiring board and fabrication method therefor

Multilayered printed circuit board and method for manufacturing the...

Wiring board and method for manufacturing the same

Flex-rigid wiring board and method for manufacturing the same

Multilayer printed wiring board and manufacturing method of multila...

Multilayer printed circuit board

Multilayered printed circuit board and method for manufacturing the...

Method for manufacturing flex-rigid wiring board

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING WIRING SUBSTRATE

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

FLEX-RIGID WIRING BOARD

FLEX-RIGID WIRING BOARD

COMBINED WIRING BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING FLEX-RIGID WIR...

FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING FLEX-RIGID WIR...

COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING...

COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING...

WIRING BOARD AND FABRICATION METHOD THEREFOR

COMBINED WIRING BOARD

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING...

METHOD FOR PLUG-IN BOARD REPLACEMENT, METHOD FOR MANUFACTURING MULT...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD OF MULTILA...

METHOD FOR MANUFACTURING MULTI-PIECE SUBSTRATE AND MULTI-PIECE SUBS...

MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...

MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...