Miguel A. Capote

Person

Carlsbad, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermally conductive adhesive composition and process for device at...
- Patent number 7,888,411
- Issue date Feb 15, 2011
- Creative Electron, Inc.
- Matthew Wrosch
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
- Patent number 6,774,493
- Issue date Aug 10, 2004
- M. A. Capote
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming viaholes in composition of cyanate, bismaleimide, epoxy res...
- Patent number 6,616,984
- Issue date Sep 9, 2003
- Miguel Albert Capote
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
- Patent number 6,566,234
- Issue date May 20, 2003
- Aguila Technologies, Inc.
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
- Patent number 6,518,677
- Issue date Feb 11, 2003
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
- Patent number 6,399,426
- Issue date Jun 4, 2002
- Miguel Albert Capote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
- Patent number 6,335,571
- Issue date Jan 1, 2002
- Miguel Albert Capote
- Miguel Albert Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor flip-chip assembly with pre-applied encapsulating layers
- Patent number 6,297,560
- Issue date Oct 2, 2001
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polmerizable fluxing agents and fluxing adhesive compositions there...
- Patent number 6,132,646
- Issue date Oct 17, 2000
- Miguel Albert Capote
- Zhiming Zhou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
- Patent number 6,121,689
- Issue date Sep 19, 2000
- Miguel Albert Capote
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carboxyl-containing polyunsaturated fluxing adhesive for attaching...
- Patent number 5,985,456
- Issue date Nov 16, 1999
- Capote; Miguel Albert
- Zhiming Zhou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polymerizable fluxing agents and fluxing adhesive compositions ther...
- Patent number 5,985,043
- Issue date Nov 16, 1999
- Miguel Albert Capote
- Zhiming Zhou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive compositions and methods for the preparatio...
- Patent number 5,830,389
- Issue date Nov 3, 1998
- Toranaga Technologies, Inc.
- Miguel Albert Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit
- Patent number 5,716,663
- Issue date Feb 10, 1998
- Toranaga Technologies
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite substrates for preparation of printed circuits
- Patent number 5,565,267
- Issue date Oct 15, 1996
- Toranaga Technologies, Inc.
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite substrates for preparation of printed circuits
- Patent number 5,538,789
- Issue date Jul 23, 1996
- Toranaga Technologies, Inc.
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive compositions and methods for the preparatio...
- Patent number 5,376,403
- Issue date Dec 27, 1994
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Electric field steering cap, steering electrode, and modular config...
- Publication number 20090008733
- Publication date Jan 8, 2009
- Guilherme Cardoso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally conductive adhesive composition and process for device at...
- Publication number 20080207814
- Publication date Aug 28, 2008
- AGUILA TECHNOLOGIES, INC.
- Matthew Wrosch
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermally conductive adhesive composition and process for device at...
- Publication number 20060194920
- Publication date Aug 31, 2006
- Miguel Albert Capote
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor flip-chip package and method for the fabrication thereof
- Publication number 20050218517
- Publication date Oct 6, 2005
- M. A. Capote
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor flip-chip package and method for the fabrication thereof
- Publication number 20030218261
- Publication date Nov 27, 2003
- M. A. Capote
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor flip-chip package and method for the fabrication thereof
- Publication number 20020031868
- Publication date Mar 14, 2002
- Miguel Albert Capote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor flip-chip package and method for the fabrication thereof
- Publication number 20020014703
- Publication date Feb 7, 2002
- Miguel A. Capote
- B32 - LAYERED PRODUCTS
Information Patent Application
High performance cyanate-bismaleimide-epoxy resin compositions for...
- Publication number 20010020071
- Publication date Sep 6, 2001
- Miguel Albert Capote
- H01 - BASIC ELECTRIC ELEMENTS

Miguel A. Capote

Person

Patents Grantslast 30 patents

Thermally conductive adhesive composition and process for device at...

Semiconductor flip-chip package and method for the fabrication thereof

Forming viaholes in composition of cyanate, bismaleimide, epoxy res...

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip assembly with pre-applied encapsulating layers

Polmerizable fluxing agents and fluxing adhesive compositions there...

Semiconductor flip-chip package and method for the fabrication thereof

Carboxyl-containing polyunsaturated fluxing adhesive for attaching...

Polymerizable fluxing agents and fluxing adhesive compositions ther...

Electrically conductive compositions and methods for the preparatio...

Multilayer printed circuit

Composite substrates for preparation of printed circuits

Composite substrates for preparation of printed circuits

Electrically conductive compositions and methods for the preparatio...

Patents Applicationslast 30 patents

Electric field steering cap, steering electrode, and modular config...

Thermally conductive adhesive composition and process for device at...

Thermally conductive adhesive composition and process for device at...

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip package and method for the fabrication thereof

High performance cyanate-bismaleimide-epoxy resin compositions for...