Claims
- 1. An electrical component assembly, comprising:
a substrate having a plurality of pads on a first surface thereof; an integrated circuit chip having an encapsulant pre-coated on an active surface thereof, the encapsulant having a plurality of holes therethrough filled with an electrically conductive material that extends from contacts on the active surface aligned with the holes through the encapsulant to the plurality of pads on the substrate.
- 2. The electrical component assembly of claim 1 wherein the electrically conductive material in the plurality of holes are discrete solder bumps pre-assembled on the integrated circuit chip.
- 3. The electrical component assembley of claim 1 further comprising a layer of flux adhesive between a subassembly comprising the encapsulant and the electrically conductive material and the substrate.
- 4. The electrical component assembly of claim 1 wherein the electrically conductive material in the plurality of holes comprises electrically conductive adhesive.
- 5. The electrical component assembly of claim 1 wherein a first portion of the pre-coated encapsulant and the electrically conductive material are located on the integrated circuit chip and a second portion is located on the substrate.
- 6. The electrical component assembly of claim 5 wherein the first portion comprises a filler which produces a reduced coefficient of thermal expansion and increased modulus in the encapsulant.
- 7. The electrical component assembly of claim 6 wherein the second portion is an adhesive material with solder fluxing properties.
- 8. The electrical component assembly of claim 1 wherein a first portion of the pre-coated encapsulant and the electrically conductive material are located on the integrated circuit chip and a second portion is coated on the first portion.
- 9. The electrical component assembly of claim 1 wherein the pre-coated encapsulant includes a polymer layer that can be remelted after assembly of the electrical component assembly to allow removal of the integrated circuit chip for repair or replacement.
- 10. The electrical component assembly of claim 1 wherein the pre-coated encapsulant includes a printed circuit layer having electrical circuitry thereon.
- 11. The electrical component assembly of claim 1 wherein the encapsulant and electrically conductive material are compliant so as to expand or contract laterally without cracking or delamination upon heating or cooling of the integrated circuit chip and the substrate.
- 12. An electrical component assembly, comprising:
an integrated circuit chip having a plurality of pads on an active surface thereof; a substrate having an encapsulant pre-coated on a first surface thereof, the encapsulant having a plurality of holes therethrough filled with an electrically conductive material that extends from contacts on the first surface aligned with the holes through the encapsulant to the plurality of pads on the integrated circuit chip.
- 13. The electrical component assembly of claim 12 wherein the electrically conductive material in the plurality of holes are discrete solder bumps pre-assembled on the substrate.
- 14. The electrical component assembley of claim 12 further comprising a layer of flux adhesive between a subassembly comprising the encapsulant and the electrically conductive material and the integrated circuit chip.
- 15. The electrical component assembly of claim 12 wherein the electrically conductive material in the plurality of holes comprises electrically conductive adhesive.
- 16. The electrical component assembly of claim 12 wherein a first portion of the pre-coated encapsulant and the electrically conductive material are located on the substrate and a second portion is located on the integrated circuit chip.
- 17. The electrical component assembly of claim 16 wherein the first portion comprises a filler which produces a reduced coefficient of thermal expansion and increased modulus in the encapsulant.
- 18. The electrical component assembly of claim 17 wherein the second portion is an adhesive material with solder fluxing properties.
- 19. The electrical component assembly of claim 12 wherein a first portion of the pre-coated encapsulant and the electrically conductive material are located on the substrate and a second portion is coated on the first portion.
- 20. The electrical component assembly of claim 12 wherein the pre-coated encapsulant includes a polymer layer that can be remelted after assembly of the electrical component assembly to allow removal of the integrated circuit chip for repair or replacement.
- 21. The electrical component assembly of claim 12 wherein the pre-coated encapsulant includes a printed circuit layer having electrical circuitry thereon.
- 22. The electrical component assembly of claim 12 wherein the encapsulant and electrically conductive material are compliant so as to expand or contract laterally without cracking or delamination upon heating or cooling of the integrated circuit chip and the substrate.
- 23. A method for making an electrical component assembly, comprising the steps of:
coating an active surface of an integrated circuit chip with an encapsulant; producing holes in the encapsulant to expose contact pads on the active surface of the integrated circuit chip; filling the holes with an electrically conductive material; placing the integrated circuit chip on a substrate with the encapsulant located between the integrated circuit chip and the substrate; curing the encapsulant; and reflowing the electrically conductive material in order to attach the integrated circuit chip to the substrate.
- 24. The method of claim 23 further comprising the step of:
coating a surface of the encapsulant which faces the substrate with a flux adhesive.
- 25. The method of claim 23 wherein the filling step comprises filling the holes with molten solder.
- 26. The method of claim 23 wherein the filling step comprises filling the holes with electrically conductive adhesive.
- 27. The method of claim 23 wherein the coating step comprises including a polymer layer in the encapsulant that can be remelted after assembly of the electrical component assembly to allow removal of the integrated circuit chip for repair or replacement.
- 28. The method of claim 23 wherein the coating step comprises including a printed circuit layer having electrical circuitry thereon.
- 29. A method for making an electrical component assembly, comprising the steps of:
coating a substrate with an encapsulant; producing holes in the encapsulant to expose contact pads on the substrate; filling the holes with an electrically conductive material; placing an integrated circuit chip on a substrate with the encapsulant located between the integrated circuit chip and the substrate; curing the encapsulant; and reflowing the electrically conductive material in order to attach the integrated circuit chip to the substrate.
- 30. The method of claim 29 further comprising the step of:
coating a surface of the encapsulant which faces the integrated circuit chip with a flux adhesive.
- 31. The method of claim 29 wherein the filling step comprises filling the holes with molten solder.
- 32. The method of claim 29 wherein the filling step comprises filling the holes with electrically conductive adhesive.
- 33. The method of claim 29 wherein the coating step comprises including a polymer layer in the encapsulant that can be remelted after assembly of the electrical component assembly to allow removal of the integrated circuit chip for repair or replacement.
- 34. The method of claim 29 wherein the coating step comprises including a printed circuit layer having electrical circuitry thereon.
- 35. A method for making an electrical component assembly, comprising the steps of:
coating an active surface of an integrated circuit chip having discrete solder bumps thereon with an encapsulant; placing the integrated circuit chip on a substrate with the encapsulant located between the integrated circuit chip and the substrate; curing the encapsulant; and reflowing the solder bumps in order to attach the integrated circuit chip to the substrate.
- 36. The method of claim 35 further comprising the step of:
coating a surface of the encapsulant which faces the substrate with a flux adhesive.
- 37. The method of claim 35 wherein the coating step comprises including a polymer layer in the encapsulant that can be remelted after assembly of the electrical component assembly to allow removal of the integrated circuit chip for repair or replacement.
- 38. The method of claim 35 wherein the coating step comprises including a printed circuit layer having electrical circuitry thereon.
- 39. A method for making an electrical component assembly, comprising the steps of:
coating a substrate having discrete solder bumps thereon with an encapsulant; placing an integrated circuit chip on a substrate with the encapsulant located between the integrated circuit chip and the substrate; curing the encapsulant; and reflowing the solder bumps in order to attach the integrated circuit chip to the substrate.
- 40. The method of claim 39 further comprising the step of:
coating a surface of the encapsulant which faces the integrated circuit chip with a flux adhesive.
- 41. The method of claim 39 wherein the coating step comprises including a polymer layer in the encapsulant that can be remelted after assembly of the electrical component assembly to allow removal of the integrated circuit chip for repair or replacement.
- 42. The method of claim 39 wherein the coating step comprises including a printed circuit layer having electrical circuitry thereon.
- 43. A method for making an electrical component assembly, comprising the steps of:
coating an active surface of an integrated circuit chip having discrete solder bumps thereon with a first portion of an encapsulant; coating a substrate with a second portion of the encapsulant; placing the integrated circuit chip on the substrate with the first and second encapsulant portions located between the integrated circuit chip and the substrate; curing the first and second encapsulant portions; and reflowing the solder bumps in order to attach the integrated circuit chip to the substrate.
- 44. The method of claim 43 further comprising the step of filling the first encapsulant with a filler material to produce a reduced coefficient of thermal expansion and increased modulus.
- 45. The method of claim 43 further comprising the steps of:
orienting the integrated circuit chip having the first portion of the encapsulant thereon at an angle with respect to the substrate having the second portion of the encapsulant thereon; placing the integrated circuit chip with that orientation in to contact with the substrate; and pivoting the integrated circuit chip about a first point of contact until the integrated circuit chip is generally parallel to the substrate so as to expel gas from between the integrated circuit chip and the substrate.
- 46. The method of claim 43 wherein the coating step comprises including a polymer layer in the first portion of the encapsulant that can be remelted after assembly of the electrical component assembly to allow removal of the integrated circuit chip for repair or replacement.
- 47. The method of claim 43 wherein the coating step comprises including a printed circuit layer having electrical circuitry thereon.
- 48. A method for making an electrical component assembly, comprising the steps of:
coating an active surface of an integrated circuit-chip having discrete solder bumps thereon with a first portion of an encapsulant; coating the first portion of encapsulant with a second portion of the encapsulant; placing the integrated circuit chip on the substrate with the first and second encapsulant portions located between the integrated circuit chip and the substrate; curing the first and second encapsulant portions; and reflowing the solder bumps in order to attach the integrated circuit chip to the substrate.
- 49. The method of claim 48 further comprising the step of filling the first encapsulant with a filler material to produce a reduced coefficient of thermal expansion and increased modulus.
- 50. The method of claim 48 further comprising the steps of:
orienting the integrated circuit chip having the first portion and the second portion of the encapsulant thereon at an angle with respect to the substrate; placing the integrated circuit chip with that orientation in to contact with the S substrate; and pivoting the integrated circuit chip about a first point of contact until the integrated circuit chip is generally parallel to the substrate so as to expel gas from between the integrated circuit chip and the substrate.
- 51. The method of claim 48 wherein the coating step comprises including a polymer layer in the first portion of the encapsulant that can be remelted after assembly of the electrical component assembly to allow removal of the integrated circuit chip for repair or replacement.
- 52. The method of claim 48 wherein the coating step comprises including a printed circuit layer having electrical circuitry thereon.
Parent Case Info
[0001] This application claims the benefit of U.S. Provisional Application Nos. 60/053,407, filed Jul. 21, 1997, and 60/056,043, filed Sep. 2, 1997, and incorporates herein the disclosures of those applications in their entirety.
Government Interests
[0002] The U.S. Government has a paid-up license in this invention and the right in limited circumstances to require the patent owner to license others on reasonable terms as provided for by the terms of contract no. N00164-96-C-0089 awarded by Defense Advanced Research Projects Agency.
Provisional Applications (2)
|
Number |
Date |
Country |
|
60053407 |
Jul 1997 |
US |
|
60056043 |
Sep 1997 |
US |
Divisions (1)
|
Number |
Date |
Country |
Parent |
09120172 |
Jul 1998 |
US |
Child |
09662642 |
Sep 2000 |
US |
Continuations (1)
|
Number |
Date |
Country |
Parent |
09662642 |
Sep 2000 |
US |
Child |
10390603 |
Mar 2003 |
US |