Miguel Angel Jimarez

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for controlling molding compound geometry around a semicondu...
- Patent number 8,912,051
- Issue date Dec 16, 2014
- Amkor Technology, Inc.
- Ahmer Syed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed die overmolded flip chip package and fabrication method
- Patent number 8,847,372
- Issue date Sep 30, 2014
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed die overmolded flip chip package and fabrication method
- Patent number 8,541,260
- Issue date Sep 24, 2013
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed die overmolded flip chip package and fabrication method
- Patent number 8,476,748
- Issue date Jul 2, 2013
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed die overmolded flip chip package
- Patent number 8,368,194
- Issue date Feb 5, 2013
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed die overmolded flip chip package method
- Patent number 8,207,022
- Issue date Jun 26, 2012
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed die overmolded flip chip package and fabrication method
- Patent number 7,898,093
- Issue date Mar 1, 2011
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming printed circuit card
- Patent number 7,353,590
- Issue date Apr 8, 2008
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a plated microvia interconnect
- Patent number 7,328,506
- Issue date Feb 12, 2008
- International Business Machines Corporation
- Miguel A. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making an electronic package
- Patent number 7,278,207
- Issue date Oct 9, 2007
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
X-ray alignment system for fabricating electronic chips
- Patent number 7,270,478
- Issue date Sep 18, 2007
- International Business Machines Corporation
- Miguel Angel Jimarez
- G01 - MEASURING TESTING
Information Patent Grant
Stress reduction in flip-chip PBGA packaging by utilizing segmented...
- Patent number 6,989,607
- Issue date Jan 24, 2006
- International Business Machines Corporation
- Krishna Darbha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming printed circuit card
- Patent number 6,986,198
- Issue date Jan 17, 2006
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making an electronic package
- Patent number 6,961,995
- Issue date Nov 8, 2005
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip C4 extension structure and process
- Patent number 6,955,982
- Issue date Oct 18, 2005
- International Business Machines Corporation
- Miguel A. Jimarez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reduction of chip carrier flexing during thermal cycling
- Patent number 6,818,972
- Issue date Nov 16, 2004
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a chip assembly
- Patent number 6,757,967
- Issue date Jul 6, 2004
- International Business Machines Corporation
- Lisa J. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip C4 extension structure and process
- Patent number 6,756,680
- Issue date Jun 29, 2004
- International Business Machines Corporation
- Miguel A. Jimarez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two signal one power plane circuit board
- Patent number 6,750,405
- Issue date Jun 15, 2004
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip C4 extension structure and process
- Patent number 6,664,637
- Issue date Dec 16, 2003
- International Business Machines Corporation
- Miguel Angel Jimarez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress reduction in flip-chip PBGA packaging by utilizing segmented...
- Patent number 6,639,302
- Issue date Oct 28, 2003
- International Business Machines Corporation
- Krishna Darbha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for joining two substrates with a low melt sol...
- Patent number 6,583,517
- Issue date Jun 24, 2003
- International Business Machines Corporation
- Miguel A. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making an encapsulated semiconductor chip module
- Patent number 6,558,981
- Issue date May 6, 2003
- International Business Machines Corporation
- Miguel A. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of chip carrier flexing during thermal cycling
- Patent number 6,528,179
- Issue date Mar 4, 2003
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of attaching a conformal chip carrier to a flip chip
- Patent number 6,524,888
- Issue date Feb 25, 2003
- International Business Machines Corporation
- David N. Cokely
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface metal balancing to reduce chip carrier flexing
- Patent number 6,497,943
- Issue date Dec 24, 2002
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate having plated microvia interconnects and method for formin...
- Patent number 6,492,600
- Issue date Dec 10, 2002
- International Business Machines Corporation
- Miguel A. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant layer for encapsulated columns
- Patent number 6,486,415
- Issue date Nov 26, 2002
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
I/C chip assembly
- Patent number 6,407,334
- Issue date Jun 18, 2002
- International Business Machines Corporation
- Lisa J. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture for attaching a conformal chip carrier to a flip chip
- Patent number 6,337,509
- Issue date Jan 8, 2002
- International Business Machines Corporation
- David N. Cokely
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
X-Ray Alignment System For Fabricating Electronic Chips
- Publication number 20080043909
- Publication date Feb 21, 2008
- International Business Machines Corporation
- Miguel Angel Jimarez
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR FORMING A PLATED MICROVIA INTERCONNECT
- Publication number 20080017410
- Publication date Jan 24, 2008
- Miguel A. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making an electronic package
- Publication number 20070278654
- Publication date Dec 6, 2007
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming printed circuit card
- Publication number 20060005383
- Publication date Jan 12, 2006
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making an electronic package
- Publication number 20050250249
- Publication date Nov 10, 2005
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
X-ray alignment system for fabricating electronic chips
- Publication number 20050194427
- Publication date Sep 8, 2005
- International Business Machines Corporation
- Miguel Angel Jimarez
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Two signal one power plane circuit board
- Publication number 20040134685
- Publication date Jul 15, 2004
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip C4 extension structure and process
- Publication number 20040094842
- Publication date May 20, 2004
- Miguel A. Jimarez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
X-ray alignment system for fabricaing electronic chips
- Publication number 20040032931
- Publication date Feb 19, 2004
- International Business Machines Corporation
- Miguel Angel Jimarez
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Stress reduction in flip-chip PBGA packaging by utilizing segmented...
- Publication number 20040021205
- Publication date Feb 5, 2004
- Krishna Darbha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS REDUCTION IN FLIP-CHIP PBGA PACKAGING BY UTILIZING SEGMENTED...
- Publication number 20030178649
- Publication date Sep 25, 2003
- International Business Machines Corporation
- Krishna Darbha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminate having plated microvia interconnects and method for formin...
- Publication number 20030102158
- Publication date Jun 5, 2003
- Miguel A. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reduction of chip carrier flexing during thermal cycling
- Publication number 20030034566
- Publication date Feb 20, 2003
- Lisa J. Jimarez
- B32 - LAYERED PRODUCTS
Information Patent Application
Compliant layer for encapsulated columns
- Publication number 20030020150
- Publication date Jan 30, 2003
- International Business Machines Corporation
- Lisa J. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
I/C chip assembly and method of forming same
- Publication number 20020108768
- Publication date Aug 15, 2002
- International Business Machines Corporation
- Lisa J. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for assembling a conformal chip carrier to a f...
- Publication number 20020096746
- Publication date Jul 25, 2002
- International Business Machines Corporation
- David N. Cokely
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compliant layer for encapsulated cloumns
- Publication number 20020092676
- Publication date Jul 18, 2002
- Lisa J. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
I/C CHIP ASSEMBLY
- Publication number 20020062970
- Publication date May 30, 2002
- International Business Machines Corporation
- Lisa J. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making an encapsulated semiconductor chip module
- Publication number 20010026959
- Publication date Oct 4, 2001
- Miguel A. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ASSEMBLING A CONFORMAL CHIP CARRIER TO A F...
- Publication number 20010019174
- Publication date Sep 6, 2001
- DAVID N. COKELY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip C4 extension structure and process
- Publication number 20010018230
- Publication date Aug 30, 2001
- International Business Machines Corporation
- Miguel A. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip C4 extension structure and process
- Publication number 20010005047
- Publication date Jun 28, 2001
- Miguel Angel Jimarez
- H01 - BASIC ELECTRIC ELEMENTS

Miguel Angel Jimarez

Person

Patents Grantslast 30 patents

Method for controlling molding compound geometry around a semicondu...

Exposed die overmolded flip chip package and fabrication method

Exposed die overmolded flip chip package and fabrication method

Exposed die overmolded flip chip package and fabrication method

Exposed die overmolded flip chip package

Exposed die overmolded flip chip package method

Exposed die overmolded flip chip package and fabrication method

Method of forming printed circuit card

Method for forming a plated microvia interconnect

Method of making an electronic package

X-ray alignment system for fabricating electronic chips

Stress reduction in flip-chip PBGA packaging by utilizing segmented...

Method of forming printed circuit card

Method of making an electronic package

Flip chip C4 extension structure and process

Reduction of chip carrier flexing during thermal cycling

Method of forming a chip assembly

Flip chip C4 extension structure and process

Two signal one power plane circuit board

Flip chip C4 extension structure and process

Stress reduction in flip-chip PBGA packaging by utilizing segmented...

Method and structure for joining two substrates with a low melt sol...

Method for making an encapsulated semiconductor chip module

Reduction of chip carrier flexing during thermal cycling

Method of attaching a conformal chip carrier to a flip chip

Surface metal balancing to reduce chip carrier flexing

Laminate having plated microvia interconnects and method for formin...

Compliant layer for encapsulated columns

I/C chip assembly

Fixture for attaching a conformal chip carrier to a flip chip

Patents Applicationslast 30 patents

X-Ray Alignment System For Fabricating Electronic Chips

METHOD FOR FORMING A PLATED MICROVIA INTERCONNECT

Method of making an electronic package

Method of forming printed circuit card

Method of making an electronic package

X-ray alignment system for fabricating electronic chips

Two signal one power plane circuit board

Flip chip C4 extension structure and process

X-ray alignment system for fabricaing electronic chips

Stress reduction in flip-chip PBGA packaging by utilizing segmented...

STRESS REDUCTION IN FLIP-CHIP PBGA PACKAGING BY UTILIZING SEGMENTED...

Laminate having plated microvia interconnects and method for formin...

Reduction of chip carrier flexing during thermal cycling

Compliant layer for encapsulated columns

I/C chip assembly and method of forming same

Method and apparatus for assembling a conformal chip carrier to a f...

Compliant layer for encapsulated cloumns

I/C CHIP ASSEMBLY

Method for making an encapsulated semiconductor chip module

METHOD AND APPARATUS FOR ASSEMBLING A CONFORMAL CHIP CARRIER TO A F...

Flip chip C4 extension structure and process

Flip chip C4 extension structure and process