Mike Morianz

Person

Graz, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Component carrier with embedded semiconductor component and embedde...
- Patent number 12,245,377
- Issue date Mar 4, 2025
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for contacting and rewiring an electronic component embedded...
- Patent number 11,570,904
- Issue date Jan 31, 2023
- AT&S Austria Technologie & Systemtechnik
- Wolfgang Schrittwieser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with embedded semiconductor component and embedde...
- Patent number 11,495,513
- Issue date Nov 8, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,324,122
- Issue date May 3, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a printed circuit board structure
- Patent number 11,172,576
- Issue date Nov 9, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic layer as carrier for component embedded in cavity of compo...
- Patent number 11,058,004
- Issue date Jul 6, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mike Morianz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for contacting and rewiring an electronic component embedded...
- Patent number 10,645,816
- Issue date May 5, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wolfgang Schrittwieser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor track with enlargement-free transition between conductor...
- Patent number 10,356,904
- Issue date Jul 16, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellshaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Efficient heat removal from component carrier with embedded diode
- Patent number 10,332,818
- Issue date Jun 25, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mike Morianz
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Printed circuit board
- Patent number 10,321,558
- Issue date Jun 11, 2019
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Nikolai Haslebner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure
- Patent number 10,219,384
- Issue date Feb 26, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a circuit board consisting of a plurality of c...
- Patent number 9,226,390
- Issue date Dec 29, 2015
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Nikolai Haslebner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for integrating an electronic component into a printed circu...
- Patent number 8,789,271
- Issue date Jul 29, 2014
- AT & S Austria Technologies & Systemtechnik Aktiengesellschaft
- Günther Weichslberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Component Carrier With Electronic Components and Thermally Conducti...
- Publication number 20240014142
- Publication date Jan 11, 2024
- Mike Morianz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Embedded Semiconductor Component and Embedde...
- Publication number 20230055435
- Publication date Feb 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes STAHR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Having at Least a Part Formed as a Three-Dimensio...
- Publication number 20220190464
- Publication date Jun 16, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20210112666
- Publication date Apr 15, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Embedded Semiconductor Component and Embedde...
- Publication number 20200312737
- Publication date Oct 1, 2020
- AT&S Austria Technology & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Contacting and Rewiring an Electronic Component Embedded...
- Publication number 20200305286
- Publication date Sep 24, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wolfgang Schrittwieser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductor Track With Enlargement-Free Transition Between Conductor...
- Publication number 20190306983
- Publication date Oct 3, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metallic Layer as Carrier For Component Embedded in Cavity of Compo...
- Publication number 20190246501
- Publication date Aug 8, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mike Morianz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Board Structure
- Publication number 20190150288
- Publication date May 16, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier Having at Least a Part Formed as a Three-Dimensio...
- Publication number 20190110366
- Publication date Apr 11, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Efficient Heat Removal From Component Carrier With Embedded Diode
- Publication number 20180211899
- Publication date Jul 26, 2018
- Mike MORIANZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Board Structure
- Publication number 20170164481
- Publication date Jun 8, 2017
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductor Track With Enlargement-Free Transition Between Conductor...
- Publication number 20170094795
- Publication date Mar 30, 2017
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Contacting and Rewiring an Electronic Component Embedded...
- Publication number 20160183383
- Publication date Jun 23, 2016
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wolfgang Schrittwieser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A CIRCUIT BOARD CONSISTING OF A PLURALITY OF C...
- Publication number 20160105953
- Publication date Apr 14, 2016
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Nikolai HASLEBNER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCU...
- Publication number 20140307403
- Publication date Oct 16, 2014
- Günther Weichslberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A CIRCUIT BOARD CONSISTING OF A PLURALITY OF C...
- Publication number 20130176692
- Publication date Jul 11, 2013
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENG
- Nikolai Haslebner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INTEGRATING AT LEAST ONE ELECTRONIC COMPONENT INTO A PRI...
- Publication number 20110069448
- Publication date Mar 24, 2011
- Günther Weichslberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical subassembly and use thereof
- Publication number 20060139831
- Publication date Jun 29, 2006
- Philipp Huemer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Mike Morianz

Person

Patents Grantslast 30 patents

Component carrier with embedded semiconductor component and embedde...

Method for contacting and rewiring an electronic component embedded...

Component carrier with embedded semiconductor component and embedde...

Component carrier and method of manufacturing the same

Method for producing a printed circuit board structure

Metallic layer as carrier for component embedded in cavity of compo...

Method for contacting and rewiring an electronic component embedded...

Conductor track with enlargement-free transition between conductor...

Efficient heat removal from component carrier with embedded diode

Printed circuit board

Circuit board structure

Method for producing a circuit board consisting of a plurality of c...

Method for integrating an electronic component into a printed circu...

Patents Applicationslast 30 patents

Component Carrier With Electronic Components and Thermally Conducti...

Component Carrier With Embedded Semiconductor Component and Embedde...

Component Carrier Having at Least a Part Formed as a Three-Dimensio...

Component Carrier and Method of Manufacturing the Same

Component Carrier With Embedded Semiconductor Component and Embedde...

Method for Contacting and Rewiring an Electronic Component Embedded...

Conductor Track With Enlargement-Free Transition Between Conductor...

Metallic Layer as Carrier For Component Embedded in Cavity of Compo...

Circuit Board Structure

Component Carrier Having at Least a Part Formed as a Three-Dimensio...

Efficient Heat Removal From Component Carrier With Embedded Diode

Circuit Board Structure

Conductor Track With Enlargement-Free Transition Between Conductor...

Method for Contacting and Rewiring an Electronic Component Embedded...

METHOD FOR PRODUCING A CIRCUIT BOARD CONSISTING OF A PLURALITY OF C...

METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCU...

METHOD FOR PRODUCING A CIRCUIT BOARD CONSISTING OF A PLURALITY OF C...

METHOD FOR INTEGRATING AT LEAST ONE ELECTRONIC COMPONENT INTO A PRI...

Electrical subassembly and use thereof