Mikio Nishio

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Thin-film semiconductor element and method of producing same
- Patent number 6,812,493
- Issue date Nov 2, 2004
- Matsushita Electric Industrial Co., Ltd.
- Mikio Nishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad for semiconductor wafer and method for polishing semi...
- Patent number 6,099,390
- Issue date Aug 8, 2000
- Matsushita Electronics Corporation
- Mikio Nishio
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for holding substrate to be polished
- Patent number 6,074,289
- Issue date Jun 13, 2000
- Matsushita Electric Industrial Co., Ltd.
- Tomoyasu Murakami
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method and polishing apparatus
- Patent number 6,012,967
- Issue date Jan 11, 2000
- Matsushita Electric Industrial Co., Ltd.
- Mitsunari Satake
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for polishing semiconductor substrate
- Patent number 5,997,385
- Issue date Dec 7, 1999
- Matsushita Electric Industrial Co., Ltd.
- Mikio Nishio
- B24 - GRINDING POLISHING
Information Patent Grant
Alignment chips positioned in the peripheral part of the semiconduc...
- Patent number 5,939,132
- Issue date Aug 17, 1999
- Matsushita Electric Industrial Co., Ltd.
- Toyokazu Fujii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for polishing substrate using resin film or multilayer po...
- Patent number 5,921,853
- Issue date Jul 13, 1999
- Matsushita Electric Industrial Co., Ltd.
- Mikio Nishio
- B24 - GRINDING POLISHING
Information Patent Grant
Mehtod and aparatus for polishing semiconductor substrate
- Patent number 5,868,610
- Issue date Feb 9, 1999
- Matsushita Electric Industrial Co., Ltd.
- Mikio Nishio
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for polishing semiconductor substrate
- Patent number 5,866,480
- Issue date Feb 2, 1999
- Matsushita Electric Industrial Co., Ltd.
- Tomoyasu Murakami
- B24 - GRINDING POLISHING
Information Patent Grant
Electroless plating bath used for forming a wiring of a semiconduct...
- Patent number 5,795,828
- Issue date Aug 18, 1998
- Matsushita Electric Industrial Co., Ltd.
- Masayuki Endo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for holding substrate to be polished and apparatus and me...
- Patent number 5,791,973
- Issue date Aug 11, 1998
- Matsushita Electric Industrial Co., Ltd.
- Mikio Nishio
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for polishing semiconductor substrate
- Patent number 5,769,697
- Issue date Jun 23, 1998
- Matsushita Electric Industrial Co., Ltd.
- Mikio Nishio
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 5,683,921
- Issue date Nov 4, 1997
- Matsushita Electric Industrial Co., Ltd.
- Mikio Nishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless plating bath used for forming a wiring of a semiconduct...
- Patent number 5,645,628
- Issue date Jul 8, 1997
- Matsushita Electric Industrial Co., Ltd.
- Masayuki Endo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal film deposition apparatus and metal film deposition method
- Patent number 5,451,261
- Issue date Sep 19, 1995
- Matsushita Electric Industrial Co., Ltd.
- Toyokazu Fujii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and a method of producing the same
- Patent number 5,223,729
- Issue date Jun 29, 1993
- Matsushita Electric Industrial Co., Ltd.
- Chiaki Kudoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20050224799
- Publication date Oct 13, 2005
- Matsushita Electric Industrial Co., Ltd.
- Shinichi Yamamoto
- G02 - OPTICS
Information Patent Application
Thin-film semiconductor element and method of producing same
- Publication number 20030096463
- Publication date May 22, 2003
- Mikio Nishio
- G02 - OPTICS

Mikio Nishio

Person

Patents Grantslast 30 patents

Thin-film semiconductor element and method of producing same

Polishing pad for semiconductor wafer and method for polishing semi...

Apparatus for holding substrate to be polished

Polishing method and polishing apparatus

Method and apparatus for polishing semiconductor substrate

Alignment chips positioned in the peripheral part of the semiconduc...

Apparatus for polishing substrate using resin film or multilayer po...

Mehtod and aparatus for polishing semiconductor substrate

Method and apparatus for polishing semiconductor substrate

Electroless plating bath used for forming a wiring of a semiconduct...

Apparatus for holding substrate to be polished and apparatus and me...

Method and apparatus for polishing semiconductor substrate

Semiconductor device and method of manufacturing the same

Electroless plating bath used for forming a wiring of a semiconduct...

Metal film deposition apparatus and metal film deposition method

Semiconductor device and a method of producing the same

Patents Applicationslast 30 patents

Semiconductor device and method for fabricating the same

Thin-film semiconductor element and method of producing same