Min-Ying Lin

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package using hybrid-type adhesive
- Patent number 12,040,300
- Issue date Jul 16, 2024
- Airoha Technology Corp.
- Ying-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having discrete antenna device
- Patent number 11,721,882
- Issue date Aug 8, 2023
- Mediatek Inc.
- Fu-Yi Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method for reducing polymer layer...
- Patent number 11,688,728
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing methods of semiconductor image sensor devices
- Patent number 11,189,654
- Issue date Nov 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Ching Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method for reducing polymer layer...
- Patent number 11,081,475
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having discrete antenna device
- Patent number 10,847,869
- Issue date Nov 24, 2020
- Mediatek Inc.
- Fu-Yi Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vehicle light assembly
- Patent number 10,527,253
- Issue date Jan 7, 2020
- TYC Brother Industrial Co., Ltd
- Min-Feng Lin
- F21 - LIGHTING
Information Patent Grant
Image sensor having conductive layer and protective layer
- Patent number 10,497,729
- Issue date Dec 3, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image Sensor Device
- Patent number 10,325,949
- Issue date Jun 18, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chao-Ching Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having etch stop layer and method of formin...
- Patent number 10,186,454
- Issue date Jan 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and fabrication method therefor
- Patent number 10,134,790
- Issue date Nov 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure
- Patent number 10,128,192
- Issue date Nov 13, 2018
- Mediatek Inc.
- Min-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite bond structure in stacked semiconductor structure
- Patent number 10,062,656
- Issue date Aug 28, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chao-Ching Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,050,102
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chao-Ching Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and method for forming the same
- Patent number 10,043,841
- Issue date Aug 7, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chao-Ching Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell and fabricating method thereof
- Patent number 10,038,000
- Issue date Jul 31, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recipe for in-situ gel, and implant, drug delivery system formed th...
- Patent number 9,757,330
- Issue date Sep 12, 2017
- Industrial Technology Research Institute
- Felice Cheng
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Integrated circuit structure and method for reducing polymer layer...
- Patent number 9,583,424
- Issue date Feb 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biomedical composition
- Patent number 9,480,712
- Issue date Nov 1, 2016
- Industrial Technology Research Institute
- Ya-Chin Lo
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Pharmaceutical composition
- Patent number 9,408,917
- Issue date Aug 9, 2016
- Industrial Technology Research Institute
- Maggie J. M. Lu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Sustained release composition and manufacturing method thereof
- Patent number 9,161,943
- Issue date Oct 20, 2015
- Industrial Technology Research Institute
- Jui-Mei Lu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Multi-input voltage-to-frequency conversion circuit
- Patent number 8,981,816
- Issue date Mar 17, 2015
- Kun Shan University
- Min-Chuan Lin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Adhesion between post-passivation interconnect structure and polymer
- Patent number 8,916,972
- Issue date Dec 23, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light unit with light guiding device
- Patent number 8,764,246
- Issue date Jul 1, 2014
- TYC Brother Industrial Co., Ltd
- Min-Feng Lin
- F21 - LIGHTING
Information Patent Grant
Real-time information transmission and reception system
- Patent number 8,723,788
- Issue date May 13, 2014
- Kun Shan University of Technology
- Min-Chuan Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Gear-rolling apparatus
- Patent number 7,827,877
- Issue date Nov 9, 2010
- Foxlink Image Technology Co., Ltd.
- Wei-Fong Lin
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Electroluminescent device with drying film and method for fabricati...
- Patent number 6,762,554
- Issue date Jul 13, 2004
- Opto Tech Corporation
- Jwo-Huei Jou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dual damascene interconnect structure with reduced parasitic capaci...
- Patent number 6,297,554
- Issue date Oct 2, 2001
- United Microelectronics Corp.
- Min-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arc chamber for ion implanter
- Patent number 5,892,232
- Issue date Apr 6, 1999
- Mosel Vitelic Inc.
- Pei-Wei Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling the etch profile of an aperture formed throu...
- Patent number 5,652,172
- Issue date Jul 29, 1997
- Taiwan Semiconductor Manufacturing Company Ltd.
- Peng Yung-Sung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE USING HYBRID-TYPE ADHESIVE
- Publication number 20230136631
- Publication date May 4, 2023
- Airoha Technology Corp.
- Ying-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Structure and Method for Reducing Polymer Layer...
- Publication number 20210351173
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIFUNCTIONAL CLOTH AND MULTIFUNCTIONAL MASK
- Publication number 20210244111
- Publication date Aug 12, 2021
- AMBER NANOTECH CO., LTD.
- Tai-Lung Lai
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE
- Publication number 20210036405
- Publication date Feb 4, 2021
- MEDIATEK INC.
- Fu-Yi Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHODS OF SEMICONDUCTOR IMAGE SENSOR DEVICES
- Publication number 20200312894
- Publication date Oct 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Ching Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMP DEVICE
- Publication number 20200208802
- Publication date Jul 2, 2020
- T.Y.C. Brother Industrial Co., Ltd.
- Min-Feng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMP COVER
- Publication number 20200116328
- Publication date Apr 16, 2020
- T.Y.C. Brother Industrial Co., Ltd.
- Min-Feng LIN
- F21 - LIGHTING
Information Patent Application
ELECTRONIC PACKAGE FOR HIGH-DATA RATE COMMUNICATION APPLICATIONS
- Publication number 20190355697
- Publication date Nov 21, 2019
- MEDIATEK INC.
- Min-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING CONDUCTIVE LAYER AND PROTECTIVE LAYER
- Publication number 20190088692
- Publication date Mar 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE
- Publication number 20190035829
- Publication date Jan 31, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Ching CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING ETCH STOP LAYER AND METHOD OF FORMIN...
- Publication number 20180366369
- Publication date Dec 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND FABRICATION METHOD THEREFOR
- Publication number 20180337203
- Publication date Nov 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VEHICLE LIGHT ASSEMBLY
- Publication number 20180299094
- Publication date Oct 18, 2018
- T.Y.C. Brother Industrial Co., Ltd.
- Min-Feng LIN
- F21 - LIGHTING
Information Patent Application
COMPOSITE BOND STRUCTURE IN STACKED SEMICONDUCTOR STRUCTURE
- Publication number 20180047682
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Ching Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE
- Publication number 20180025985
- Publication date Jan 25, 2018
- MEDIATEK INC.
- Min-Chen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IMAGE SENSOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20170250211
- Publication date Aug 31, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Ching Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170207298
- Publication date Jul 20, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Ching Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Structure and Method for Reducing Polymer Layer...
- Publication number 20170170161
- Publication date Jun 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELL AND FABRICATING METHOD THEREOF
- Publication number 20170084620
- Publication date Mar 23, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD ARRANGMENT DESIGN FOR SEMICONDUCTOR PACKAGE
- Publication number 20160307873
- Publication date Oct 20, 2016
- MEDIATEK INC.
- Ying-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CLEANING CHEMICAL VAPOR DEPOSITION CHAMBER
- Publication number 20150361547
- Publication date Dec 17, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Min-Hui LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BIOMEDICAL COMPOSITION
- Publication number 20150118322
- Publication date Apr 30, 2015
- Industrial Technology Research Institute
- Ya-Chin LO
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
RECIPE FOR IN-SITU GEL, AND IMPLANT, DRUG DELIVERY SYSTEM FORMED TH...
- Publication number 20150111834
- Publication date Apr 23, 2015
- Industrial Technology Research Institute
- Felice CHENG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
OPTICAL STRUCTURE FOR HEADLIGHT
- Publication number 20150098236
- Publication date Apr 9, 2015
- T.Y.C. BROTHER INDUSTRIAL CO., LTD.
- MIN-FENG LIN
- F21 - LIGHTING
Information Patent Application
MULTI-INPUT VOLTAGE-TO-FREQUENCY CONVERSION CIRCUIT
- Publication number 20150048865
- Publication date Feb 19, 2015
- KUN SHAN UNIVERSITY OF TECHNOLOGY
- Min-Chuan LIN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LED LAMP ASSEMBLY AND A CABLE ORGANIZATION DEVICE THEREOF
- Publication number 20150003026
- Publication date Jan 1, 2015
- T.Y.C. Brother Industrial Co., Ltd.
- Min-Feng LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Circuit Structure and Method for Reducing Polymer Layer...
- Publication number 20140346665
- Publication date Nov 27, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion between Post-Passivation Interconnect Structure and Polymer
- Publication number 20140264853
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHARMACEUTICAL COMPOSITION
- Publication number 20140199369
- Publication date Jul 17, 2014
- Maggie J.M. LU
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
LIGHT UNIT WITH LIGHT GUIDING DEVICE
- Publication number 20130329433
- Publication date Dec 12, 2013
- T.Y.C. BROTHER INDUSTRIAL CO., LTD.
- MIN-FENG LIN
- G02 - OPTICS

Min-Ying Lin

Person

Patents Grantslast 30 patents

Semiconductor package using hybrid-type adhesive

Semiconductor package having discrete antenna device

Integrated circuit structure and method for reducing polymer layer...

Manufacturing methods of semiconductor image sensor devices

Integrated circuit structure and method for reducing polymer layer...

Semiconductor package having discrete antenna device

Vehicle light assembly

Image sensor having conductive layer and protective layer

Image Sensor Device

Semiconductor structure having etch stop layer and method of formin...

Image sensor and fabrication method therefor

Fan-out package structure

Composite bond structure in stacked semiconductor structure

Semiconductor device and manufacturing method thereof

Image sensor device and method for forming the same

Memory cell and fabricating method thereof

Recipe for in-situ gel, and implant, drug delivery system formed th...

Integrated circuit structure and method for reducing polymer layer...

Biomedical composition

Pharmaceutical composition

Sustained release composition and manufacturing method thereof

Multi-input voltage-to-frequency conversion circuit

Adhesion between post-passivation interconnect structure and polymer

Light unit with light guiding device

Real-time information transmission and reception system

Gear-rolling apparatus

Electroluminescent device with drying film and method for fabricati...

Dual damascene interconnect structure with reduced parasitic capaci...

Arc chamber for ion implanter

Method for controlling the etch profile of an aperture formed throu...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE USING HYBRID-TYPE ADHESIVE

Integrated Circuit Structure and Method for Reducing Polymer Layer...

MULTIFUNCTIONAL CLOTH AND MULTIFUNCTIONAL MASK

SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE

MANUFACTURING METHODS OF SEMICONDUCTOR IMAGE SENSOR DEVICES

LAMP DEVICE

LAMP COVER

ELECTRONIC PACKAGE FOR HIGH-DATA RATE COMMUNICATION APPLICATIONS

IMAGE SENSOR HAVING CONDUCTIVE LAYER AND PROTECTIVE LAYER

IMAGE SENSOR DEVICE

SEMICONDUCTOR STRUCTURE HAVING ETCH STOP LAYER AND METHOD OF FORMIN...

IMAGE SENSOR AND FABRICATION METHOD THEREFOR

VEHICLE LIGHT ASSEMBLY

COMPOSITE BOND STRUCTURE IN STACKED SEMICONDUCTOR STRUCTURE

FAN-OUT PACKAGE STRUCTURE

SEMICONDUCTOR IMAGE SENSOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Integrated Circuit Structure and Method for Reducing Polymer Layer...

MEMORY CELL AND FABRICATING METHOD THEREOF

BONDING PAD ARRANGMENT DESIGN FOR SEMICONDUCTOR PACKAGE

METHOD AND APPARATUS FOR CLEANING CHEMICAL VAPOR DEPOSITION CHAMBER

BIOMEDICAL COMPOSITION

RECIPE FOR IN-SITU GEL, AND IMPLANT, DRUG DELIVERY SYSTEM FORMED TH...

OPTICAL STRUCTURE FOR HEADLIGHT

MULTI-INPUT VOLTAGE-TO-FREQUENCY CONVERSION CIRCUIT

LED LAMP ASSEMBLY AND A CABLE ORGANIZATION DEVICE THEREOF

Integrated Circuit Structure and Method for Reducing Polymer Layer...

Adhesion between Post-Passivation Interconnect Structure and Polymer

PHARMACEUTICAL COMPOSITION

LIGHT UNIT WITH LIGHT GUIDING DEVICE