Min Yu Chan

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged microelectronic components
- Patent number 9,418,872
- Issue date Aug 16, 2016
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged image sensing microelectronic devices including a lead and...
- Patent number 6,882,021
- Issue date Apr 19, 2005
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating thin integrated circuit units
- Patent number 6,468,831
- Issue date Oct 22, 2002
- Texas Instruments Incorporated
- Chew Weng Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for adhering and sealing a silicon chip in an integrated cir...
- Patent number 6,387,729
- Issue date May 14, 2002
- Texas Instruments Incorporated
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 6,365,833
- Issue date Apr 2, 2002
- Texas Instruments Incorporated
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked double sided integrated circuit package
- Patent number 6,274,929
- Issue date Aug 14, 2001
- Texas Instruments Incorporated
- Chew Weng Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulate resin LOC package and method of fabrication
- Patent number 6,236,107
- Issue date May 22, 2001
- Texas Instruments Incorporated
- Min Yu Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device testing and burn-in methodology
- Patent number 6,218,202
- Issue date Apr 17, 2001
- Texas Instruments Incorporated
- Chee Kiang Yew
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit package and flat plate molding process for integ...
- Patent number 6,177,723
- Issue date Jan 23, 2001
- Texas Instruments Incorporated
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin stacked integrated circuit device
- Patent number 6,137,164
- Issue date Oct 24, 2000
- Texas Instruments Incorporated
- Chee Klang Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for adhering and sealing a silicon chip in an integrated cir...
- Patent number 6,087,203
- Issue date Jul 11, 2000
- Texas Instruments Incorporated
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip size integrated circuit package
- Patent number 6,049,129
- Issue date Apr 11, 2000
- Texas Instruments Incorporated
- Chee Kiang Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slotted lead for a semiconductor device
- Patent number 6,040,623
- Issue date Mar 21, 2000
- Texas Instruments Incorporated
- Min Yu Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible pin location integrated circuit package
- Patent number 5,952,611
- Issue date Sep 14, 1999
- Texas Instruments Incorporated
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of attachment of a semiconductor slotted lead to a substrate
- Patent number 5,647,124
- Issue date Jul 15, 1997
- Texas Instruments Incorporated
- Min Yu Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered lead frame assembly for integrated circuits
- Patent number 5,461,255
- Issue date Oct 24, 1995
- Texas Instruments Incorporated
- Min Y Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame having an outlet with a larger cross sectional area than...
- Patent number 5,293,065
- Issue date Mar 8, 1994
- Texas Instruments, Incorporated
- Min Y. Chan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED MICROELECTRONIC COMPONENTS
- Publication number 20140141544
- Publication date May 22, 2014
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged microelectronic devices and methods of packaging microelec...
- Publication number 20040238909
- Publication date Dec 2, 2004
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for adhering and sealing a silicon chip in an integrated cir...
- Publication number 20020001882
- Publication date Jan 3, 2002
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin integrated circuit unit
- Publication number 20020000648
- Publication date Jan 3, 2002
- Chew Weng Leong
- H01 - BASIC ELECTRIC ELEMENTS

Min Yu Chan

Person

Patents Grantslast 30 patents

Packaged microelectronic components

Packaged image sensing microelectronic devices including a lead and...

Method of fabricating thin integrated circuit units

Method for adhering and sealing a silicon chip in an integrated cir...

Integrated circuit package

Stacked double sided integrated circuit package

Encapsulate resin LOC package and method of fabrication

Semiconductor device testing and burn-in methodology

Integrated circuit package and flat plate molding process for integ...

Thin stacked integrated circuit device

Method for adhering and sealing a silicon chip in an integrated cir...

Chip size integrated circuit package

Slotted lead for a semiconductor device

Flexible pin location integrated circuit package

Method of attachment of a semiconductor slotted lead to a substrate

Multi-layered lead frame assembly for integrated circuits

Lead frame having an outlet with a larger cross sectional area than...

Patents Applicationslast 30 patents

PACKAGED MICROELECTRONIC COMPONENTS

Packaged microelectronic devices and methods of packaging microelec...

Method for adhering and sealing a silicon chip in an integrated cir...

Thin integrated circuit unit