Minoru Ametani

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Tape adhering method and tape adhering device
- Patent number 8,440,040
- Issue date May 14, 2013
- Tokyo Seimitsu Co., Ltd.
- Isamu Kawashima
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Surface protection film peeling method and surface protection film...
- Patent number 8,151,856
- Issue date Apr 10, 2012
- Tokyo Seimitsu Co., Ltd.
- Isamu Kawashima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus for attaching a peeling tape
- Patent number 7,757,741
- Issue date Jul 20, 2010
- Tokyo Seimitsu Co., Ltd.
- Minoru Ametani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film separation method and film separation apparatus
- Patent number 7,740,728
- Issue date Jun 22, 2010
- Tokyo Seimitsu Co., Ltd.
- Minoru Ametani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing apparatus
- Patent number 7,563,643
- Issue date Jul 21, 2009
- Tokyo Seimitsu Co., Ltd.
- Minoru Ametani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for peeling surface protective film
- Patent number 7,521,384
- Issue date Apr 21, 2009
- Tokyo Seimitsu Co., Ltd.
- Masaki Kanazawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Dicing tape attaching apparatus and dicing tape attaching method
- Patent number 7,503,365
- Issue date Mar 17, 2009
- Tokyo Seimitsu Co., Ltd.
- Minoru Ametani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece processing device
- Patent number 7,490,650
- Issue date Feb 17, 2009
- Tokyo Seimitsu Co., Ltd.
- Isamu Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape adhering method and tape adhering apparatus
- Patent number 7,438,776
- Issue date Oct 21, 2008
- Tokyo Seimitsu Co., Ltd.
- Kazuo Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film peeling method and film peeling device
- Patent number 7,383,869
- Issue date Jun 10, 2008
- Tokyo Seimitsu Co., Ltd.
- Minoru Ametani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TAPE ADHERING METHOD AND TAPE ADHERING DEVICE
- Publication number 20110024020
- Publication date Feb 3, 2011
- TOKYO SEIMITSU CO., LTD.
- Isamu Kawashima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PEELING TAPE ADHERING METHOD AND PEELING TAPE ADHERING DEVICE
- Publication number 20070284028
- Publication date Dec 13, 2007
- Isamu Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE PROCESSING DEVICE
- Publication number 20070277934
- Publication date Dec 6, 2007
- Isamu Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE ADHERING METHOD AND TAPE ADHERING DEVICE
- Publication number 20070267132
- Publication date Nov 22, 2007
- Isamu Kawashima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SURFACE PROTECTION FILM PEELING METHOD AND SURFACE PROTECTION FILM...
- Publication number 20070269962
- Publication date Nov 22, 2007
- Isamu Kawashima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CASSETTE CONVEYANCE METHOD AND CASSETTE CONVEYANCE APPARATUS
- Publication number 20070262276
- Publication date Nov 15, 2007
- Isamu Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE PROTECTIVE FILM PEELING METHOD AND SURFACE PROTECTIVE FILM...
- Publication number 20070207629
- Publication date Sep 6, 2007
- Minoru Ametani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer processing apparatus
- Publication number 20070187036
- Publication date Aug 16, 2007
- Minoru Ametani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for attaching a peeling tape
- Publication number 20070119543
- Publication date May 31, 2007
- Minoru Ametani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dicing tape attaching apparatus and dicing tape attaching method
- Publication number 20070123000
- Publication date May 31, 2007
- Minoru Ametani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for peeling surface protective film
- Publication number 20070087475
- Publication date Apr 19, 2007
- Masaki Kanazawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Film separation method and film separation apparatus
- Publication number 20070026641
- Publication date Feb 1, 2007
- Minoru Ametani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Film sticking method and film sticking device
- Publication number 20060068566
- Publication date Mar 30, 2006
- Minoru Ametani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Film peeling method and film peeling device
- Publication number 20060011284
- Publication date Jan 19, 2006
- Minoru Ametani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tape adhering method and tape adhering apparatus
- Publication number 20050282362
- Publication date Dec 22, 2005
- Kazuo Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Minoru Ametani

Person

Patents Grantslast 30 patents

Tape adhering method and tape adhering device

Surface protection film peeling method and surface protection film...

Apparatus for attaching a peeling tape

Film separation method and film separation apparatus

Wafer processing apparatus

Method and apparatus for peeling surface protective film

Dicing tape attaching apparatus and dicing tape attaching method

Workpiece processing device

Tape adhering method and tape adhering apparatus

Film peeling method and film peeling device

Patents Applicationslast 30 patents

TAPE ADHERING METHOD AND TAPE ADHERING DEVICE

PEELING TAPE ADHERING METHOD AND PEELING TAPE ADHERING DEVICE

WORKPIECE PROCESSING DEVICE

TAPE ADHERING METHOD AND TAPE ADHERING DEVICE

SURFACE PROTECTION FILM PEELING METHOD AND SURFACE PROTECTION FILM...

CASSETTE CONVEYANCE METHOD AND CASSETTE CONVEYANCE APPARATUS

SURFACE PROTECTIVE FILM PEELING METHOD AND SURFACE PROTECTIVE FILM...

Wafer processing apparatus

Method and apparatus for attaching a peeling tape

Dicing tape attaching apparatus and dicing tape attaching method

Method and apparatus for peeling surface protective film

Film separation method and film separation apparatus

Film sticking method and film sticking device

Film peeling method and film peeling device

Tape adhering method and tape adhering apparatus