Mitsuhisa Watanabe

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assemblies with molded support substrates
- Patent number 12,119,325
- Issue date Oct 15, 2024
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies with molded support substrates
- Patent number 10,998,290
- Issue date May 4, 2021
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor dies with selective capillary under fill
- Patent number 10,607,966
- Issue date Mar 31, 2020
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple semiconductor chips laminated...
- Patent number 10,553,560
- Issue date Feb 4, 2020
- LONGITUDE LICENSING LIMITED
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies with molded support substrates
- Patent number 10,217,719
- Issue date Feb 26, 2019
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor dies with selective capillary under fill
- Patent number 10,083,941
- Issue date Sep 25, 2018
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor dies with selective capillary under fill
- Patent number 9,935,082
- Issue date Apr 3, 2018
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 9,466,546
- Issue date Oct 11, 2016
- PS4 Luxco S.A.R.L.
- Koichi Hatakeyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 9,112,061
- Issue date Aug 18, 2015
- PS4 Luxco S.A.R.L.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having penetration electrode penetrating throu...
- Patent number 8,816,478
- Issue date Aug 26, 2014
- PS4 Luxco S.A.R.L.
- Yoshiharu Kanegae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,810,047
- Issue date Aug 19, 2014
- PS4 Luxco S.A.R.L.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,441,126
- Issue date May 14, 2013
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device provided with wire that electrically connects...
- Patent number 8,217,517
- Issue date Jul 10, 2012
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,203,222
- Issue date Jun 19, 2012
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including mounting and...
- Patent number 7,993,975
- Issue date Aug 9, 2011
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with stacked semiconductor devices
- Patent number 7,969,019
- Issue date Jun 28, 2011
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor apparatus
- Patent number 7,964,962
- Issue date Jun 21, 2011
- Elpidia Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with reduced length interconnect and manufact...
- Patent number 7,812,439
- Issue date Oct 12, 2010
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 7,786,564
- Issue date Aug 31, 2010
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES
- Publication number 20250006697
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES
- Publication number 20210225805
- Publication date Jul 22, 2021
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES
- Publication number 20190148338
- Publication date May 16, 2019
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIES WITH SELECTIVE CAPILLARY UNDER FILL
- Publication number 20180366448
- Publication date Dec 20, 2018
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES
- Publication number 20180294249
- Publication date Oct 11, 2018
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIES WITH SELECTIVE CAPILLARY UNDER FILL
- Publication number 20180182738
- Publication date Jun 28, 2018
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIES WITH SELECTIVE CAPILLARY UNDER FILL
- Publication number 20170186729
- Publication date Jun 29, 2017
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20160035705
- Publication date Feb 4, 2016
- PS4 LUXCO S.A.R.L.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PENETRATION ELECTRODE PENETRATING THROU...
- Publication number 20130181345
- Publication date Jul 18, 2013
- Elpida Memory, Inc.
- Yoshiharu Kanegae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20120126402
- Publication date May 24, 2012
- ELPIDA MEMORY, INC.
- Koichi Hatakeyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR DEVICE
- Publication number 20120119356
- Publication date May 17, 2012
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120118939
- Publication date May 17, 2012
- SUMITOMO BAKELITE CO., LTD.
- Keiyo KUSANAGI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PROVIDED WITH WIRE THAT ELECTRICALLY CONNECTS...
- Publication number 20110006418
- Publication date Jan 13, 2011
- ELPIDA MEMORY, INC.
- Mitsuhisa Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100301468
- Publication date Dec 2, 2010
- ELPIDA MEMORY, INC.
- Mitsuhisa WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20100295167
- Publication date Nov 25, 2010
- ELPIDA MEMORY, INC.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20100252923
- Publication date Oct 7, 2010
- ELPIDA MEMORY, INC.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20100148172
- Publication date Jun 17, 2010
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20100133722
- Publication date Jun 3, 2010
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20100102438
- Publication date Apr 29, 2010
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20090321912
- Publication date Dec 31, 2009
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE INCLUDING SEMICONDUCT...
- Publication number 20090184430
- Publication date Jul 23, 2009
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20090166863
- Publication date Jul 2, 2009
- ELPIDA MEMORY, INC.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR...
- Publication number 20090020873
- Publication date Jan 22, 2009
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20090020874
- Publication date Jan 22, 2009
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR A...
- Publication number 20090014874
- Publication date Jan 15, 2009
- Elpida Memory, Inc.
- Mitsuhisa WATANABE
- H01 - BASIC ELECTRIC ELEMENTS

Mitsuhisa Watanabe

Person

Patents Grantslast 30 patents

Semiconductor device assemblies with molded support substrates

Semiconductor device assemblies with molded support substrates

Stacked semiconductor dies with selective capillary under fill

Semiconductor device having multiple semiconductor chips laminated...

Semiconductor device assemblies with molded support substrates

Stacked semiconductor dies with selective capillary under fill

Stacked semiconductor dies with selective capillary under fill

Semiconductor device and method of forming the same

Semiconductor device and method of forming the same

Semiconductor device having penetration electrode penetrating throu...

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor device provided with wire that electrically connects...

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device including mounting and...

Module with stacked semiconductor devices

Method of manufacturing a semiconductor apparatus

Semiconductor package with reduced length interconnect and manufact...

Semiconductor device and method for manufacturing semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES

SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES

SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES

STACKED SEMICONDUCTOR DIES WITH SELECTIVE CAPILLARY UNDER FILL

SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES

STACKED SEMICONDUCTOR DIES WITH SELECTIVE CAPILLARY UNDER FILL

STACKED SEMICONDUCTOR DIES WITH SELECTIVE CAPILLARY UNDER FILL

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE HAVING PENETRATION ELECTRODE PENETRATING THROU...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR DEVICE

PROCESS AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PROVIDED WITH WIRE THAT ELECTRICALLY CONNECTS...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Semiconductor device

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE INCLUDING SEMICONDUCT...

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR A...