Mitsuru Oida

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Kanagawa-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with multilayer wiring structure formed within...
- Patent number 8,618,657
- Issue date Dec 31, 2013
- Kabushiki Kaisha Toshiba
- Kiichiro Higaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package
- Patent number 7,148,529
- Issue date Dec 12, 2006
- Kabushiki Kaisha Toshiba
- Mitsuru Oida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 6,960,494
- Issue date Nov 1, 2005
- Kabushiki Kaisha Toshiba
- Hiroshi Funakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 6,836,012
- Issue date Dec 28, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Funakura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100032833
- Publication date Feb 11, 2010
- Kabushiki Kaisha Toshiba
- Kiichiro Higaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package and method of manufacturing the same
- Publication number 20050051810
- Publication date Mar 10, 2005
- Kabushiki Kaisha Toshiba
- Hiroshi Funakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20020140062
- Publication date Oct 3, 2002
- Kabushiki Kaisha Toshiba
- Mitsuru Oida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method of manufacturing the same
- Publication number 20020140095
- Publication date Oct 3, 2002
- Kabushiki Kaisha Toshiba
- Hiroshi Funakura
- H01 - BASIC ELECTRIC ELEMENTS