Mizuki Nagai

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Plating method and plating apparatus
- Patent number 12,221,714
- Issue date Feb 11, 2025
- Ebara Corporation
- Ryuya Koizumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method, insoluble anode for plating, and plating apparatus
- Patent number 12,157,951
- Issue date Dec 3, 2024
- Ebara Corporation
- Hiroyuki Kanda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus
- Patent number 11,725,297
- Issue date Aug 15, 2023
- Ebara Corporation
- Naoki Shimomura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Regulation plate, anode holder, and substrate holder
- Patent number 11,686,009
- Issue date Jun 27, 2023
- Ebara Corporation
- Naoki Shimomura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method and plating apparatus
- Patent number 11,566,339
- Issue date Jan 31, 2023
- Ebara Corporation
- Yusuke Tamari
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of plating, apparatus for plating, and non-volatile storage...
- Patent number 11,542,629
- Issue date Jan 3, 2023
- Ebara Corporation
- Mizuki Nagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and cleaning method in electroplating appa...
- Patent number 11,492,721
- Issue date Nov 8, 2022
- Ebara Corporation
- Kazuhito Tsuji
- B08 - CLEANING
Information Patent Grant
Method for determining location of power feeding point in electropl...
- Patent number 11,319,642
- Issue date May 3, 2022
- Ebara Corporation
- Mitsuhiro Shamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method and plating apparatus
- Patent number 11,286,577
- Issue date Mar 29, 2022
- Ebara Corporation
- Ryuya Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holder and plating device
- Patent number 11,280,020
- Issue date Mar 22, 2022
- Ebara Corporation
- Naoki Shimomura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Regulation plate, anode holder, and substrate holder
- Patent number 11,268,207
- Issue date Mar 8, 2022
- Ebara Corporation
- Naoki Shimomura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating method
- Patent number 11,066,755
- Issue date Jul 20, 2021
- Ebara Corporation
- Naoki Shimomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holder, a method for holding a substrate with a substrate...
- Patent number 11,037,791
- Issue date Jun 15, 2021
- Ebara Corporation
- Mizuki Nagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method and plating apparatus
- Patent number 10,941,504
- Issue date Mar 9, 2021
- Ebara Corporation
- Yusuke Tamari
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for determining location of power feeding point in electropl...
- Patent number 10,934,630
- Issue date Mar 2, 2021
- Ebara Corporation
- Mitsuhiro Shamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating device, plating method, substrate holder, resistance measur...
- Patent number 10,676,838
- Issue date Jun 9, 2020
- Ebara Corporation
- Mizuki Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method and plating apparatus
- Patent number 10,648,099
- Issue date May 12, 2020
- Ebara Corporation
- Ryuya Koizumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus, plating method, and recording medium
- Patent number 10,633,757
- Issue date Apr 28, 2020
- Ebara Corporation
- Masashi Shimoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of adjusting plating apparatus, and measuring apparatus
- Patent number 10,487,415
- Issue date Nov 26, 2019
- Ebara Corporation
- Jumpei Fujikata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method and plating apparatus
- Patent number 10,294,580
- Issue date May 21, 2019
- Ebara Corporation
- Yusuke Tamari
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder, a method for holding a substrate with a substrate...
- Patent number 10,115,598
- Issue date Oct 30, 2018
- Ebara Corporation
- Mizuki Nagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of adjusting plating apparatus, and measuring apparatus
- Patent number 10,100,424
- Issue date Oct 16, 2018
- Ebara Corporation
- Jumpei Fujikata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating method
- Patent number 10,047,454
- Issue date Aug 14, 2018
- Ebara Corporation
- Yuji Araki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating method
- Patent number 9,376,758
- Issue date Jun 28, 2016
- Ebara Corporation
- Shingo Yasuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating method
- Patent number 8,784,636
- Issue date Jul 22, 2014
- Ebara Corporation
- Mizuki Nagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating method
- Patent number 7,736,474
- Issue date Jun 15, 2010
- Ebara Corporation
- Keiichi Kurashina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus and plating method
- Patent number 7,553,400
- Issue date Jun 30, 2009
- Ebara Corporation
- Mizuki Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method and plating apparatus
- Patent number 7,479,213
- Issue date Jan 20, 2009
- Ebara Corporation
- Mizuki Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus for substrate
- Patent number 7,311,809
- Issue date Dec 25, 2007
- Ebara Corporation
- Keiichi Kurashina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate plating method and apparatus
- Patent number 7,033,463
- Issue date Apr 25, 2006
- Ebara Corporation
- Akihisa Hongo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20240254648
- Publication date Aug 1, 2024
- EBARA CORPORATION
- Yusui GOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20240209542
- Publication date Jun 27, 2024
- EBARA CORPORATION
- Kazuhito TSUJI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20240183057
- Publication date Jun 6, 2024
- EBARA CORPORATION
- Shigeyuki NAKAHAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20230203701
- Publication date Jun 29, 2023
- EBARA CORPORATION
- Ryuya KOIZUMI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ANODE HOLDER, AND PLATING APPARATUS
- Publication number 20220307153
- Publication date Sep 29, 2022
- EBARA CORPORATION
- Hiroyuki Kanda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD, INSOLUBLE ANODE FOR PLATING, AND PLATING APPARATUS
- Publication number 20220228285
- Publication date Jul 21, 2022
- EBARA CORPORATION
- Hiroyuki Kanda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PLATING, APPARATUS FOR PLATING, AND NON-VOLATILE STORAGE...
- Publication number 20220186398
- Publication date Jun 16, 2022
- EBARA CORPORATION
- Mizuki Nagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20220170175
- Publication date Jun 2, 2022
- EBARA CORPORATION
- Ryuya Koizumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
REGULATION PLATE, ANODE HOLDER, AND SUBSTRATE HOLDER
- Publication number 20220154363
- Publication date May 19, 2022
- EBARA CORPORATION
- Naoki SHIMOMURA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20220119981
- Publication date Apr 21, 2022
- EBARA CORPORATION
- Naoki Shimomura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20210391190
- Publication date Dec 16, 2021
- Hirotaka Ohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20210164125
- Publication date Jun 3, 2021
- EBARA CORPORATION
- Yusuke TAMARI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR DETERMINING LOCATION OF POWER FEEDING POINT IN ELECTROPL...
- Publication number 20210148000
- Publication date May 20, 2021
- EBARA CORPORATION
- Mitsuhiro SHAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING METHOD, PLATING APPARATUS, ANODE HOLDER
- Publication number 20210071312
- Publication date Mar 11, 2021
- EBARA CORPORATION
- Naoki SHIMOMURA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER AND PLATING DEVICE
- Publication number 20210054521
- Publication date Feb 25, 2021
- EBARA CORPORATION
- Naoki SHIMOMURA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20210040641
- Publication date Feb 11, 2021
- EBARA CORPORATION
- Mizuki NAGAI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20200232115
- Publication date Jul 23, 2020
- EBARA CORPORATION
- Ryuya Koizumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
REGULATION PLATE, ANODE HOLDER, AND SUBSTRATE HOLDER
- Publication number 20200157702
- Publication date May 21, 2020
- EBARA CORPORATION
- Naoki SHIMOMURA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20190390360
- Publication date Dec 26, 2019
- EBARA CORPORATION
- Naoki SHIMOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING APPARATUS, PLATING METHOD, AND RECORDING MEDIUM
- Publication number 20190309436
- Publication date Oct 10, 2019
- EBARA CORPORATION
- Masashi SHIMOYAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20190233967
- Publication date Aug 1, 2019
- EBARA CORPORATION
- Yusuke TAMARI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ANODE UNIT OF ELECTROPLATING APPARATUS, ELECTROPLATING APPARATUS IN...
- Publication number 20190161884
- Publication date May 30, 2019
- EBARA CORPORATION
- Naoto TAKAHASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR DETERMINING LOCATION OF POWER FEEDING POINT IN ELECTROPL...
- Publication number 20190153610
- Publication date May 23, 2019
- EBARA CORPORATION
- Mitsuhiro SHAMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER, A METHOD FOR HOLDING A SUBSTRATE WITH A SUBSTRATE...
- Publication number 20190027366
- Publication date Jan 24, 2019
- EBARA CORPORATION
- Mizuki Nagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF ADJUSTING PLATING APPARATUS, AND MEASURING APPARATUS
- Publication number 20180371636
- Publication date Dec 27, 2018
- EBARA CORPORATION
- Jumpei FUJIKATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND CLEANING METHOD IN ELECTROPLATING APPA...
- Publication number 20180291521
- Publication date Oct 11, 2018
- EBARA CORPORATION
- Kazuhito TSUJI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD
- Publication number 20180282895
- Publication date Oct 4, 2018
- EBARA CORPORATION
- Yohei WAKUDA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20180266009
- Publication date Sep 20, 2018
- EBARA CORPORATION
- Ryuya KOIZUMI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING DEVICE, PLATING METHOD, SUBSTRATE HOLDER, RESISTANCE MEASUR...
- Publication number 20180209062
- Publication date Jul 26, 2018
- EBARA CORPORATION
- Mizuki NAGAI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF ADJUSTING PLATING APPARATUS, AND MEASURING APPARATUS
- Publication number 20160369422
- Publication date Dec 22, 2016
- EBARA CORPORATION
- Jumpei FUJIKATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Mizuki Nagai

Person

Patents Grantslast 30 patents

Plating method and plating apparatus

Plating method, insoluble anode for plating, and plating apparatus

Plating apparatus

Regulation plate, anode holder, and substrate holder

Plating method and plating apparatus

Method of plating, apparatus for plating, and non-volatile storage...

Electroplating apparatus and cleaning method in electroplating appa...

Method for determining location of power feeding point in electropl...

Plating method and plating apparatus

Substrate holder and plating device

Regulation plate, anode holder, and substrate holder

Plating apparatus and plating method

Substrate holder, a method for holding a substrate with a substrate...

Plating method and plating apparatus

Method for determining location of power feeding point in electropl...

Plating device, plating method, substrate holder, resistance measur...

Plating method and plating apparatus

Plating apparatus, plating method, and recording medium

Method of adjusting plating apparatus, and measuring apparatus

Plating method and plating apparatus

Substrate holder, a method for holding a substrate with a substrate...

Method of adjusting plating apparatus, and measuring apparatus

Plating apparatus and plating method

Electroplating method

Plating apparatus and plating method

Plating apparatus and plating method

Plating apparatus and plating method

Plating method and plating apparatus

Plating apparatus for substrate

Substrate plating method and apparatus

Patents Applicationslast 30 patents

PLATING APPARATUS AND PLATING METHOD

PLATING METHOD AND PLATING APPARATUS

PLATING APPARATUS

PLATING APPARATUS AND PLATING METHOD

ANODE HOLDER, AND PLATING APPARATUS

PLATING METHOD, INSOLUBLE ANODE FOR PLATING, AND PLATING APPARATUS

METHOD OF PLATING, APPARATUS FOR PLATING, AND NON-VOLATILE STORAGE...

PLATING METHOD AND PLATING APPARATUS

REGULATION PLATE, ANODE HOLDER, AND SUBSTRATE HOLDER

PLATING APPARATUS

SUBSTRATE PROCESSING APPARATUS

PLATING METHOD AND PLATING APPARATUS

METHOD FOR DETERMINING LOCATION OF POWER FEEDING POINT IN ELECTROPL...

PLATING METHOD, PLATING APPARATUS, ANODE HOLDER

SUBSTRATE HOLDER AND PLATING DEVICE

PLATING APPARATUS AND PLATING METHOD

PLATING METHOD AND PLATING APPARATUS

REGULATION PLATE, ANODE HOLDER, AND SUBSTRATE HOLDER

PLATING APPARATUS AND PLATING METHOD

PLATING APPARATUS, PLATING METHOD, AND RECORDING MEDIUM

PLATING METHOD AND PLATING APPARATUS

ANODE UNIT OF ELECTROPLATING APPARATUS, ELECTROPLATING APPARATUS IN...

METHOD FOR DETERMINING LOCATION OF POWER FEEDING POINT IN ELECTROPL...

SUBSTRATE HOLDER, A METHOD FOR HOLDING A SUBSTRATE WITH A SUBSTRATE...

METHOD OF ADJUSTING PLATING APPARATUS, AND MEASURING APPARATUS

ELECTROPLATING APPARATUS AND CLEANING METHOD IN ELECTROPLATING APPA...

PLATING METHOD

PLATING METHOD AND PLATING APPARATUS

PLATING DEVICE, PLATING METHOD, SUBSTRATE HOLDER, RESISTANCE MEASUR...

METHOD OF ADJUSTING PLATING APPARATUS, AND MEASURING APPARATUS