Mon-Nam Ho

Person

Chu-Pei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Image sensor package structure with casing including a vent without...
- Patent number 8,847,146
- Issue date Sep 30, 2014
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package structure with large air cavity
- Patent number 8,390,087
- Issue date Mar 5, 2013
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for molding image sensor package structure and...
- Patent number 8,093,674
- Issue date Jan 10, 2012
- Kingpak Technology, Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor module with air escape hole and a method for manufactu...
- Patent number 7,554,599
- Issue date Jun 30, 2009
- Kingpak Technology, Inc.
- Hsiu wen Tu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor module with a protection layer and a method for manufa...
- Patent number 7,423,334
- Issue date Sep 9, 2008
- Kingpak Technology Inc.
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure of image sensor and method for packaging the same
- Patent number 6,737,720
- Issue date May 18, 2004
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package structure of image sensor
- Patent number 6,627,983
- Issue date Sep 30, 2003
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for a photosensitive chip
- Patent number 6,590,269
- Issue date Jul 8, 2003
- Kingpak Technology Inc.
- Jason Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module card and a method for manufacturing the same
- Patent number 6,565,008
- Issue date May 20, 2003
- Kingpak Technology Inc.
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package structure of image sensor
- Patent number 6,559,539
- Issue date May 6, 2003
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked structure of an image sensor and method for manufacturing t...
- Patent number 6,521,881
- Issue date Feb 18, 2003
- Kingpak Technology Inc.
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure for an integrated circuit package and method fo...
- Patent number 6,489,572
- Issue date Dec 3, 2002
- Kingpak Technology Inc.
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD FOR MOLDING IMAGE SENSOR PACKAGE STRUCTURE AND...
- Publication number 20110024861
- Publication date Feb 3, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE STRUCTURE WITH LARGE AIR CAVITY
- Publication number 20110024862
- Publication date Feb 3, 2011
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE STRUCTURE
- Publication number 20110024610
- Publication date Feb 3, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package structure and method for manufacturing the same
- Publication number 20080067334
- Publication date Mar 20, 2008
- Jason Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package
- Publication number 20080036025
- Publication date Feb 14, 2008
- Chung Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package structure and method for manufacturing the same
- Publication number 20070241272
- Publication date Oct 18, 2007
- Jason Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor module with air escape hole and a method for manufactu...
- Publication number 20070206109
- Publication date Sep 6, 2007
- Hsiu wen Tu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Image sensor module package
- Publication number 20070138586
- Publication date Jun 21, 2007
- Chung Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package
- Publication number 20070138585
- Publication date Jun 21, 2007
- Chung Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor with a compound structure
- Publication number 20070108544
- Publication date May 17, 2007
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor module with a protection layer and a method for manufa...
- Publication number 20070108577
- Publication date May 17, 2007
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor module structure and a method for manufacturing the same
- Publication number 20070096280
- Publication date May 3, 2007
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package structure
- Publication number 20070090284
- Publication date Apr 26, 2007
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor structure
- Publication number 20030116817
- Publication date Jun 26, 2003
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked structure of a ball grid array (BGA) integrated circuit pac...
- Publication number 20030116846
- Publication date Jun 26, 2003
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE CARD AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20030071129
- Publication date Apr 17, 2003
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked structure of an image sensor and method for manufacturing t...
- Publication number 20020148946
- Publication date Oct 17, 2002
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE FOR AN INTEGRATED CIRCUIT PACKAGE AND METHOD FO...
- Publication number 20020096360
- Publication date Jul 25, 2002
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging structure of image sensors and method for packaging the same
- Publication number 20020096763
- Publication date Jul 25, 2002
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package structure of image sensor
- Publication number 20020096729
- Publication date Jul 25, 2002
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package structure of image sensor
- Publication number 20020096730
- Publication date Jul 25, 2002
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging structure of image sensor and method for packaging the same
- Publication number 20020096758
- Publication date Jul 25, 2002
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure of an integrated circuit
- Publication number 20020096747
- Publication date Jul 25, 2002
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package structure of image sensor
- Publication number 20020096753
- Publication date Jul 25, 2002
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of a photosensor and method for packaging the same
- Publication number 20020060287
- Publication date May 23, 2002
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable integrated circuit
- Publication number 20020043709
- Publication date Apr 18, 2002
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Image sensor package structure with casing including a vent without...

Image sensor package structure with large air cavity

Manufacturing method for molding image sensor package structure and...

Image sensor module with air escape hole and a method for manufactu...

Image sensor module with a protection layer and a method for manufa...

Packaging structure of image sensor and method for packaging the same

Stacked package structure of image sensor

Package structure for a photosensitive chip

Module card and a method for manufacturing the same

Stacked package structure of image sensor

Stacked structure of an image sensor and method for manufacturing t...

Substrate structure for an integrated circuit package and method fo...

Patents Applicationslast 30 patents

MANUFACTURING METHOD FOR MOLDING IMAGE SENSOR PACKAGE STRUCTURE AND...

IMAGE SENSOR PACKAGE STRUCTURE WITH LARGE AIR CAVITY

IMAGE SENSOR PACKAGE STRUCTURE

Image sensor package structure and method for manufacturing the same

Image sensor package

Image sensor package structure and method for manufacturing the same

Image sensor module with air escape hole and a method for manufactu...

Image sensor module package

Image sensor package

Image sensor with a compound structure

Image sensor module with a protection layer and a method for manufa...

Image sensor module structure and a method for manufacturing the same

Image sensor package structure

Image sensor structure

Stacked structure of a ball grid array (BGA) integrated circuit pac...

MODULE CARD AND A METHOD FOR MANUFACTURING THE SAME

Stacked structure of an image sensor and method for manufacturing t...

SUBSTRATE STRUCTURE FOR AN INTEGRATED CIRCUIT PACKAGE AND METHOD FO...

Packaging structure of image sensors and method for packaging the same

Stacked package structure of image sensor

Stacked package structure of image sensor

Packaging structure of image sensor and method for packaging the same

Package structure of an integrated circuit

Stacked package structure of image sensor

Structure of a photosensor and method for packaging the same

Stackable integrated circuit