Motoshige Kobayashi

Person

Hyogo-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor chips
- Patent number 8,148,240
- Issue date Apr 3, 2012
- Kabushiki Kaisha Toshiba
- Motoshige Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 7,906,416
- Issue date Mar 15, 2011
- Kabushiki Kaisha Toshiba
- Masanobu Tsuchitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer including a reinforcing flange formed upright at a periphery...
- Patent number 7,737,531
- Issue date Jun 15, 2010
- Kabushiki Kaisha Toshiba
- Yasuharu Sugawara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,488,993
- Issue date Feb 10, 2009
- Kabushiki Kaisha Toshiba
- Kenichi Tokano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High breakdown voltage semiconductor device
- Patent number 6,649,981
- Issue date Nov 18, 2003
- Kabushiki Kaisha Toshiba
- Motoshige Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for manufacturing semiconductor element
- Patent number 6,562,705
- Issue date May 13, 2003
- Kabushiki Kaisha Toshiba
- Takashi Obara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for use in power-switching device and method o...
- Patent number 6,524,894
- Issue date Feb 25, 2003
- Kabushiki Kaisha Toshiba
- Hideki Nozaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110053374
- Publication date Mar 3, 2011
- Kabushiki Kaisha Toshiba
- Motoshige Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER INCLUDING A REINFORCING FLANGE FORMED UPRIGHT AT A PERIPHERY...
- Publication number 20100207249
- Publication date Aug 19, 2010
- KABUSHIKI KAISHA TOSHIBA
- Yasuharu SUGAWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20100203688
- Publication date Aug 12, 2010
- KABUSHIKI KAISHA TOSHIBA
- Motoshige KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR CHIPS
- Publication number 20100048000
- Publication date Feb 25, 2010
- Kabushiki Kaisha Toshiba
- Motoshige Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER AND METHOD FOR MANUFACTURING SAME
- Publication number 20090102020
- Publication date Apr 23, 2009
- Kabushiki Kaisha Toshiba
- Yasuharu SUGAWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20080299686
- Publication date Dec 4, 2008
- Kabushiki Kaisha Toshiba
- Motoshige KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20080296611
- Publication date Dec 4, 2008
- Kabushiki Kaisha Toshiba
- Motoshige KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20080090391
- Publication date Apr 17, 2008
- Kabushiki Kaisha Toshiba
- Masanobu TSUCHITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20050208738
- Publication date Sep 22, 2005
- Kabushiki Kaisha Toshiba
- Kenichi Tokano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20020140035
- Publication date Oct 3, 2002
- Motoshige Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020081784
- Publication date Jun 27, 2002
- Motoshige Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Motoshige Kobayashi

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor chips

Method for manufacturing semiconductor device

Wafer including a reinforcing flange formed upright at a periphery...

Semiconductor device and method of manufacturing the same

High breakdown voltage semiconductor device

Method and apparatus for manufacturing semiconductor element

Semiconductor device for use in power-switching device and method o...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

WAFER INCLUDING A REINFORCING FLANGE FORMED UPRIGHT AT A PERIPHERY...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

METHOD OF MANUFACTURING SEMICONDUCTOR CHIPS

WAFER AND METHOD FOR MANUFACTURING SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device