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Mozafar MAGHSOUDNIA
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San Jose, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
3D integration using Al—Ge eutectic bond interconnect
Patent number
10,651,151
Issue date
May 12, 2020
Invensense, Inc.
Peter Smeys
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Assembly and packaging of MEMS device
Patent number
10,472,231
Issue date
Nov 12, 2019
Invensense, Inc.
Brian H. Kim
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
3D integration using Al—Ge eutectic bond interconnect
Patent number
9,754,922
Issue date
Sep 5, 2017
Invensense, Inc.
Peter Smeys
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
MEMS sensor integrated with a flip chip
Patent number
9,611,137
Issue date
Apr 4, 2017
Invensense, Inc.
Peter Smeys
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Assembly and packaging of MEMS device
Patent number
9,508,663
Issue date
Nov 29, 2016
Invensense, Inc.
Brian H. Kim
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Transistor with spatially integrated schottky diode
Patent number
7,808,223
Issue date
Oct 5, 2010
Netlogic Microsystems, Inc.
Sandeep Khanna
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
I.C. thin film resistor stabilization method
Patent number
6,365,482
Issue date
Apr 2, 2002
Analog Devices, Inc.
Mozafar Maghsoudnia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
I. C. thin film processing and protection method
Patent number
6,090,678
Issue date
Jul 18, 2000
Analog Devices, Inc.
Mozafar Maghsoudnia
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ASSEMBLY AND PACKAGING OF MEMS DEVICE
Publication number
20190308874
Publication date
Oct 10, 2019
InvenSense, Inc.
Brian H. Kim
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
INTEGRATED PACKAGE CONTAINING MEMS ACOUSTIC SENSOR AND PRESSURE SENSOR
Publication number
20170334714
Publication date
Nov 23, 2017
InvenSense, Inc.
Jia Gao
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
3D INTEGRATION USING Al-Ge EUTECTIC BOND INTERCONNECT
Publication number
20170330863
Publication date
Nov 16, 2017
InvenSense, Inc.
Peter Smeys
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASSEMBLY AND PACKAGING OF MEMS DEVICE
Publication number
20170044007
Publication date
Feb 16, 2017
InvenSense, Inc.
Brian H. Kim
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
3D INTEGRATION USING Al-Ge EUTECTIC BOND INTERCONNECT
Publication number
20160233197
Publication date
Aug 11, 2016
InvenSense, Inc.
Peter Smeys
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMS SENSOR INTEGRATED WITH A FLIP CHIP
Publication number
20160060100
Publication date
Mar 3, 2016
InvenSense, Inc.
Peter SMEYS
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
ASSEMBLY AND PACKAGING OF MEMS DEVICE
Publication number
20150028432
Publication date
Jan 29, 2015
Brian H. Kim
B81 - MICRO-STRUCTURAL TECHNOLOGY