Muhannad S. Bakir

Person

Atlanta, GA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming stacked integrated circuits using selective ther...
- Patent number 12,027,488
- Issue date Jul 2, 2024
- The Regents of the University of California
- Mike Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically flexible interconnects, methods of making the same, an...
- Patent number 10,636,731
- Issue date Apr 28, 2020
- Georgia Tech Research Corporation
- Muhannad S. Bakir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed-signal substrate with integrated through-substrate vias
- Patent number 10,330,874
- Issue date Jun 25, 2019
- Georgia Tech Research Corporation
- Paragkumar Thadesar
- G02 - OPTICS
Information Patent Grant
Modular nano and microscale sensors
- Patent number 8,803,509
- Issue date Aug 12, 2014
- Georgia Tech Research Corporation
- Ramasamy Ravindran
- G01 - MEASURING TESTING
Information Patent Grant
Air-gap C4 fluidic I/O interconnects and methods of fabricating same
- Patent number 8,563,365
- Issue date Oct 22, 2013
- Georgia Tech Research Corporation
- Calvin Richard King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3-D ICs equipped with double sided power, coolant, and data features
- Patent number 8,546,930
- Issue date Oct 1, 2013
- Georgia Tech Research Corporation
- Muhannad S. Bakir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3-D ICs with microfluidic interconnects and methods of constructing...
- Patent number 7,928,563
- Issue date Apr 19, 2011
- Georgia Tech Research Corporation
- Muhannad S. Bakir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit interconnects with coaxial conductors
- Patent number 7,798,817
- Issue date Sep 21, 2010
- Georgia Tech Research Corporation
- Paul A. Kohl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High input/output density optoelectronic probe card for wafer-level...
- Patent number 7,554,347
- Issue date Jun 30, 2009
- Georgia Tech Research Corporation
- Tony Mule′
- G01 - MEASURING TESTING
Information Patent Grant
Devices having compliant wafer-level input/output interconnections...
- Patent number 7,468,558
- Issue date Dec 23, 2008
- Georgia Tech Research Corporation
- Muhannad S. Bakir
- G01 - MEASURING TESTING
Information Patent Grant
Microfluidic, optical, and electrical input output interconnects, m...
- Patent number 7,266,267
- Issue date Sep 4, 2007
- Georgia Tech Research Corp.
- Muhannad S. Bakir
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Devices having compliant wafer-level input/output interconnections...
- Patent number 7,135,777
- Issue date Nov 14, 2006
- Georgia Tech Research Corporation
- Muhannad S. Bakir
- G01 - MEASURING TESTING
Information Patent Grant
Devices having compliant wafer-level packages with pillars and meth...
- Patent number 7,132,736
- Issue date Nov 7, 2006
- Georgia Tech Research Corporation
- Muhannad S. Bakir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-mode/function optical and electrical interconnects, methods of...
- Patent number 7,099,525
- Issue date Aug 29, 2006
- Georgia Tech Research Corporation
- Muhannad S. Bakir
- G02 - OPTICS
Information Patent Grant
Guided-wave optical interconnections embedded within a microelectro...
- Patent number 6,954,576
- Issue date Oct 11, 2005
- Georgia Tech Research Corporation
- Tony Mule′
- G02 - OPTICS
Information Patent Grant
Backplane, printed wiring board, and/or multi-chip module-level opt...
- Patent number 6,788,867
- Issue date Sep 7, 2004
- Georgia Tech Research Corp.
- Tony Mule′
- G02 - OPTICS
Information Patent Grant
Guided-wave optical interconnections embedded within a microelectro...
- Patent number 6,785,458
- Issue date Aug 31, 2004
- Georgia Tech Research Corporation
- Tony Mule′
- G02 - OPTICS
Information Patent Grant
Compliant wafer-level packaging devices and methods of fabrication
- Patent number 6,690,081
- Issue date Feb 10, 2004
- Georgia Tech Research Corporation
- Muhannad S. Bakir
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...
- Publication number 20240347502
- Publication date Oct 17, 2024
- The Regents of the University of California
- Mike Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...
- Publication number 20220077104
- Publication date Mar 10, 2022
- The Regents of the University of California
- Mike Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICALLY FLEXIBLE INTERCONNECTS, METHODS OF MAKING THE SAME, AN...
- Publication number 20190006271
- Publication date Jan 3, 2019
- Georgia Tech Research Corporation
- Muhannad S. BAKIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY CURVED MECHANICALLY FLEXIBLE INTERCONNECTS, METHODS OF M...
- Publication number 20180294211
- Publication date Oct 11, 2018
- Georgia Tech Research Corporation
- MUHANNAD S. BAKIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mixed-Signal Substrate with Integrated Through-Substrate Vias
- Publication number 20170223825
- Publication date Aug 3, 2017
- Georgia Tech Research Corporation
- Paragkumar Thadesar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AIR-GAP C4 FLUIDIC I/O INTERCONNECTS AND METHODS OF FABRICATING SAME
- Publication number 20120228779
- Publication date Sep 13, 2012
- Georgia Tech Research Corporation
- Calvin Richard King, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR NANO AND MICROSCALE SENSORS
- Publication number 20110291643
- Publication date Dec 1, 2011
- Georgia Tech Researh Corporation
- RAMASAMY RAVINDRAN
- G01 - MEASURING TESTING
Information Patent Application
3-D ICs EQUIPPED WITH DOUBLE SIDED POWER, COOLANT, AND DATA FEATURES
- Publication number 20100187683
- Publication date Jul 29, 2010
- Georgia Tech Research Corporation
- MUHANNAD S. BAKIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-D ICs WITH MICROFLUIDIC INTERCONNECTS AND METHODS OF CONSTRUCTING...
- Publication number 20090294954
- Publication date Dec 3, 2009
- Georgia Tech Research Corporation
- Muhannad S. Bakir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE INTERCONNECT DEVICES & STRUCTURES
- Publication number 20070105429
- Publication date May 10, 2007
- Georgia Tech Research Corporation
- PAUL A. KOHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Devices having compliant wafer-level input/output interconnections...
- Publication number 20060209519
- Publication date Sep 21, 2006
- Muhannad S. Bakir
- G02 - OPTICS
Information Patent Application
Microfluidic, optical, and electrical input output interconnects, m...
- Publication number 20060104566
- Publication date May 18, 2006
- Muhannad S. Bakir
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Systems and methods for three-dimensional lithography and nano-inde...
- Publication number 20050257709
- Publication date Nov 24, 2005
- Tony Mule
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Guided-wave optical interconnections embedded within a microelectro...
- Publication number 20040264840
- Publication date Dec 30, 2004
- Tony Mule'
- G02 - OPTICS
Information Patent Application
Dual-mode/function optical and electrical interconnects, methods of...
- Publication number 20040184703
- Publication date Sep 23, 2004
- Muhannad S. Bakir
- G02 - OPTICS
Information Patent Application
Curved metal-polymer dual-mode/function optical and electrical inte...
- Publication number 20040184704
- Publication date Sep 23, 2004
- Muhannad S. Bakir
- G02 - OPTICS
Information Patent Application
Backplane, printed wiring board, and/or multi-chip module-level opt...
- Publication number 20040126076
- Publication date Jul 1, 2004
- Tony Mule'
- G02 - OPTICS
Information Patent Application
High input/output density optoelectronic probe card for wafer-level...
- Publication number 20040017215
- Publication date Jan 29, 2004
- Tony Mule
- G02 - OPTICS
Information Patent Application
Devices having compliant wafer-level input/output interconnections...
- Publication number 20030206680
- Publication date Nov 6, 2003
- Georgia Tech Research Corporation
- Muhannad S. Bakir
- G02 - OPTICS
Information Patent Application
Devices having compliant wafer-level packages with pillars and meth...
- Publication number 20030122229
- Publication date Jul 3, 2003
- Muhannad S. Bakir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backplane, printed wiring board, and/or multi-chip module-level opt...
- Publication number 20030012539
- Publication date Jan 16, 2003
- Tony Mule'
- G02 - OPTICS
Information Patent Application
Guided-wave optical interconnections embedded within a microelectro...
- Publication number 20020136481
- Publication date Sep 26, 2002
- Tony Mule'
- G02 - OPTICS

Muhannad S. Bakir

Person

Patents Grantslast 30 patents

Methods of forming stacked integrated circuits using selective ther...

Mechanically flexible interconnects, methods of making the same, an...

Mixed-signal substrate with integrated through-substrate vias

Modular nano and microscale sensors

Air-gap C4 fluidic I/O interconnects and methods of fabricating same

3-D ICs equipped with double sided power, coolant, and data features

3-D ICs with microfluidic interconnects and methods of constructing...

Integrated circuit interconnects with coaxial conductors

High input/output density optoelectronic probe card for wafer-level...

Devices having compliant wafer-level input/output interconnections...

Microfluidic, optical, and electrical input output interconnects, m...

Devices having compliant wafer-level input/output interconnections...

Devices having compliant wafer-level packages with pillars and meth...

Dual-mode/function optical and electrical interconnects, methods of...

Guided-wave optical interconnections embedded within a microelectro...

Backplane, printed wiring board, and/or multi-chip module-level opt...

Guided-wave optical interconnections embedded within a microelectro...

Compliant wafer-level packaging devices and methods of fabrication

Patents Applicationslast 30 patents

METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...

METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...

MECHANICALLY FLEXIBLE INTERCONNECTS, METHODS OF MAKING THE SAME, AN...

VERTICALLY CURVED MECHANICALLY FLEXIBLE INTERCONNECTS, METHODS OF M...

Mixed-Signal Substrate with Integrated Through-Substrate Vias

AIR-GAP C4 FLUIDIC I/O INTERCONNECTS AND METHODS OF FABRICATING SAME

MODULAR NANO AND MICROSCALE SENSORS

3-D ICs EQUIPPED WITH DOUBLE SIDED POWER, COOLANT, AND DATA FEATURES

3-D ICs WITH MICROFLUIDIC INTERCONNECTS AND METHODS OF CONSTRUCTING...

HIGH PERFORMANCE INTERCONNECT DEVICES & STRUCTURES

Devices having compliant wafer-level input/output interconnections...

Microfluidic, optical, and electrical input output interconnects, m...

Systems and methods for three-dimensional lithography and nano-inde...

Guided-wave optical interconnections embedded within a microelectro...

Dual-mode/function optical and electrical interconnects, methods of...

Curved metal-polymer dual-mode/function optical and electrical inte...

Backplane, printed wiring board, and/or multi-chip module-level opt...

High input/output density optoelectronic probe card for wafer-level...

Devices having compliant wafer-level input/output interconnections...

Devices having compliant wafer-level packages with pillars and meth...

Backplane, printed wiring board, and/or multi-chip module-level opt...

Guided-wave optical interconnections embedded within a microelectro...