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Murali Abburi
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Santa Clara, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Staged aluminum deposition process for filling vias
Patent number
6,660,135
Issue date
Dec 9, 2003
Applied Materials, Inc.
Sang-Ho Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Target for use in magnetron sputtering of nickel for forming metall...
Patent number
6,521,107
Issue date
Feb 18, 2003
Applied Materials, Inc.
Murali Abburi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Target for use in magnetron sputtering of nickel for forming metall...
Patent number
6,472,867
Issue date
Oct 29, 2002
Applied Materials, Inc.
Murali Abburi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Manufacture of target for use in magnetron sputtering of nickel and...
Patent number
6,436,207
Issue date
Aug 20, 2002
Applied Material, Inc.
Murali Abburi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method of enhancing hardness of sputter deposited copper films
Patent number
6,391,163
Issue date
May 21, 2002
Applied Materials, Inc.
Vikram Pavate
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Staged aluminum deposition process for filling vias
Patent number
6,352,620
Issue date
Mar 5, 2002
Applied Materials, Inc.
Sang-Ho Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper target for sputter deposition
Patent number
6,139,701
Issue date
Oct 31, 2000
Applied Materials, Inc.
Vikram Pavate
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Target for use in magnetron sputtering of nickel for forming metall...
Patent number
6,086,725
Issue date
Jul 11, 2000
Applied Materials, Inc.
Murali Abburi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
Information
Patent Application
Target for use in magnetron sputtering of nickel for forming metall...
Publication number
20030015420
Publication date
Jan 23, 2003
Murali Abburi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method of metallization using a nickel-vanadium layer
Publication number
20020093101
Publication date
Jul 18, 2002
Subramoney Iyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of enhancing hardness of sputter deposited copper films
Publication number
20020088716
Publication date
Jul 11, 2002
Vikram Pavate
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Staged aluminum deposition process for filling vias
Publication number
20020064952
Publication date
May 30, 2002
Sang-Ho Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STAGED ALUMINUM DEPOSITION PROCESS FOR FILLING VIAS
Publication number
20010047932
Publication date
Dec 6, 2001
APPLIED MATERIALS, INC.
SANG-HO YU
H01 - BASIC ELECTRIC ELEMENTS