Myoung-Soo Jeon

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Die package for connection to a substrate
- Patent number 7,253,365
- Issue date Aug 7, 2007
- Quantum Leap Packaging, Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic seal
- Patent number 7,135,768
- Issue date Nov 14, 2006
- Silicon Bandwidth Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitor for an integrated circuit and method of manufa...
- Patent number 7,123,465
- Issue date Oct 17, 2006
- Silicon Bandwidth, Inc.
- Stanford W. Crane, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance optoelectronic packaging assembly
- Patent number 7,070,340
- Issue date Jul 4, 2006
- Silicon Bandwidth Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular coaxial electrical interconnect system having a modular fra...
- Patent number 6,905,367
- Issue date Jun 14, 2005
- Silicon Bandwidth, Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device for radio frequency shielding
- Patent number 6,847,115
- Issue date Jan 25, 2005
- Silicon Bandwidth Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package having mesh power and ground planes
- Patent number 6,803,650
- Issue date Oct 12, 2004
- Silicon Bandwidth Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die package for connection to a substrate
- Patent number 6,797,882
- Issue date Sep 28, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro grid array semiconductor die package
- Patent number 6,734,546
- Issue date May 11, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular semiconductor die package and method of manufacturing thereof
- Patent number 6,700,138
- Issue date Mar 2, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- G02 - OPTICS
Information Patent Grant
Semiconductor package
- Patent number 6,603,193
- Issue date Aug 5, 2003
- Silicon Bandwidth Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Decoupling capacitor for an integrated circuit and method of manufa...
- Publication number 20060279904
- Publication date Dec 14, 2006
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Modular coaxial electrical interconnect system and method of making...
- Publication number 20060105636
- Publication date May 18, 2006
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Decoupling capacitor for an integrated circuit and method of manufa...
- Publication number 20060067031
- Publication date Mar 30, 2006
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die package for connection to a substrate
- Publication number 20040232447
- Publication date Nov 25, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- G02 - OPTICS
Information Patent Application
Semiconductor die package having mesh power and ground planes
- Publication number 20040222514
- Publication date Nov 11, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Modular semiconductor die package and method of manufacturing thereof
- Publication number 20040026757
- Publication date Feb 12, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- G02 - OPTICS
Information Patent Application
Modular coaxial electrical interconnect system and method of making...
- Publication number 20040014360
- Publication date Jan 22, 2004
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modular semiconductor die package and method of manufacturing thereof
- Publication number 20030160314
- Publication date Aug 28, 2003
- Stanford W. Crane
- G02 - OPTICS
Information Patent Application
Micro grid array semiconductor die package
- Publication number 20030162319
- Publication date Aug 28, 2003
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20030042582
- Publication date Mar 6, 2003
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20030042596
- Publication date Mar 6, 2003
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High performance optoelectronic packaging assembly
- Publication number 20030044130
- Publication date Mar 6, 2003
- Stanford W. Crane
- G02 - OPTICS
Information Patent Application
Hermetic seal
- Publication number 20030042598
- Publication date Mar 6, 2003
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die package having mesh power and ground planes
- Publication number 20020117751
- Publication date Aug 29, 2002
- Silicon Bandwidth, Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS

Myoung-Soo Jeon

Person

Patents Grantslast 30 patents

Die package for connection to a substrate

Hermetic seal

Decoupling capacitor for an integrated circuit and method of manufa...

High performance optoelectronic packaging assembly

Modular coaxial electrical interconnect system having a modular fra...

Packaged semiconductor device for radio frequency shielding

Semiconductor die package having mesh power and ground planes

Die package for connection to a substrate

Micro grid array semiconductor die package

Modular semiconductor die package and method of manufacturing thereof

Semiconductor package

Patents Applicationslast 30 patents

Decoupling capacitor for an integrated circuit and method of manufa...

Modular coaxial electrical interconnect system and method of making...

Decoupling capacitor for an integrated circuit and method of manufa...

Die package for connection to a substrate

Semiconductor die package having mesh power and ground planes

Modular semiconductor die package and method of manufacturing thereof

Modular coaxial electrical interconnect system and method of making...

Modular semiconductor die package and method of manufacturing thereof

Micro grid array semiconductor die package

Semiconductor package

Semiconductor package

High performance optoelectronic packaging assembly

Hermetic seal

Semiconductor die package having mesh power and ground planes