Nagesh Vodrahalli

Person

Los Altos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microwave integrated quantum circuits with cap wafers and their met...
- Patent number 11,770,982
- Issue date Sep 26, 2023
- Rigetti & Co, LLC
- Jayss Daniel Marshall
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory scaling semiconductor device
- Patent number 11,444,062
- Issue date Sep 13, 2022
- SanDisk Technologies LLC
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave integrated quantum circuits with cap wafers and their met...
- Patent number 11,121,301
- Issue date Sep 14, 2021
- Rigetti & Co, Inc.
- Jayss Daniel Marshall
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory scaling semiconductor device
- Patent number 11,094,674
- Issue date Aug 17, 2021
- SanDisk Technologies LLC
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory scaling semiconductor device
- Patent number 11,011,500
- Issue date May 18, 2021
- SanDisk Technologies LLC
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory scaling semiconductor device
- Patent number 11,004,829
- Issue date May 11, 2021
- SanDisk Technologies LLC
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate materials for quantum processors
- Patent number 10,985,308
- Issue date Apr 20, 2021
- Rigetti & Co, Inc.
- Nagesh Vodrahalli
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
TSV semiconductor device including two-dimensional shift
- Patent number 10,811,392
- Issue date Oct 20, 2020
- Western Digital Technologies, Inc.
- Toshiki Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate materials for quantum processors
- Patent number 10,535,809
- Issue date Jan 14, 2020
- Rigetti & Co, Inc.
- Nagesh Vodrahalli
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for testing a flip-chip assembly during manufa...
- Patent number 9,870,959
- Issue date Jan 16, 2018
- Altera Corporation
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for testing integrated circuit die with a part...
- Patent number 9,201,097
- Issue date Dec 1, 2015
- Altera Corporation
- Nagesh Vodrahalli
- G01 - MEASURING TESTING
Information Patent Grant
Electronic assembly apparatus and associated methods
- Patent number 9,040,348
- Issue date May 26, 2015
- Altera Corporation
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for assembling an integrated circuit package having a subst...
- Patent number RE44629
- Issue date Dec 10, 2013
- Intel Corporation
- Suresh Ramalingam
- 029 - Metal working
Information Patent Grant
Method and apparatus to generate and monitor optical signals and co...
- Patent number 8,057,108
- Issue date Nov 15, 2011
- Intel Corporation
- Achintya K. Bhowmik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus to generate and monitor optical signals and co...
- Patent number 7,780,360
- Issue date Aug 24, 2010
- Intel Corporation
- Achintya K. Bhowmik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus to generate and monitor optical signals and co...
- Patent number 7,401,986
- Issue date Jul 22, 2008
- Intel Corporation
- Achintya K. Bhowmik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin polarization mode converters based on liquid crystal mat...
- Patent number 7,174,060
- Issue date Feb 6, 2007
- Intel Corporation
- Nagesh K. Vodrahalli
- G02 - OPTICS
Information Patent Grant
Method and apparatus to generate and monitor optical signals and co...
- Patent number 7,099,360
- Issue date Aug 29, 2006
- Intel Corporation
- Achintya K. Bhowmik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly comprising solderable thermal interface and met...
- Patent number 7,091,063
- Issue date Aug 15, 2006
- Intel Corporation
- Biswajit Sur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance thermal interface curing process for organic flip...
- Patent number 6,982,192
- Issue date Jan 3, 2006
- Intel Corporation
- Nagesh Vodrahalli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra-thin polarization mode converters based on liquid crystal mat...
- Patent number 6,928,200
- Issue date Aug 9, 2005
- Intel Corporation
- Nagesh K. Vodrahalli
- G02 - OPTICS
Information Patent Grant
Crystal-core fiber mode converter for low-loss polarization-insensi...
- Patent number 6,879,743
- Issue date Apr 12, 2005
- Intel Corporation
- Achintya K. Bhowmik
- G02 - OPTICS
Information Patent Grant
Compact optical package with modular optical connector
- Patent number 6,860,642
- Issue date Mar 1, 2005
- Intel Corporation
- Nagesh K. Vodrahalli
- G02 - OPTICS
Information Patent Grant
Polarization-insensitive planar lightwave circuits and method for f...
- Patent number 6,778,750
- Issue date Aug 17, 2004
- Intel Corporation
- Nagesh K. Vodrahalli
- G02 - OPTICS
Information Patent Grant
Electronic assembly comprising solderable thermal interface
- Patent number 6,724,078
- Issue date Apr 20, 2004
- Intel Corporation
- Biswajit Sur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having a substrate vent hole
- Patent number 6,490,166
- Issue date Dec 3, 2002
- Intel Corporation
- Suresh Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for underfilling a controlled collapse chip connection (C4)...
- Patent number 6,331,446
- Issue date Dec 18, 2001
- Intel Corporation
- Duane Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric decal for a substrate of an integrated circuit package
- Patent number 6,248,951
- Issue date Jun 19, 2001
- Intel Corporation
- Venkatesan Murali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density ceramic BGA package and method for making same
- Patent number 6,228,468
- Issue date May 8, 2001
- Nagesh K. Vodrahalli
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method and system for extracting and refining gold from ores
- Patent number 6,090,341
- Issue date Jul 18, 2000
- Hickman; Paul L.
- Nagesh K. Vodrahalli
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Package with Die Stackup and Connection Platform
- Publication number 20240387461
- Publication date Nov 21, 2024
- Western Digital Technologies, Inc.
- Rajitha Indla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Die Stackup and Interposer
- Publication number 20240312916
- Publication date Sep 19, 2024
- Western Digital Technologies, Inc.
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV SEMICONDUCTOR DEVICE INCLUDING INDUCTIVE COMPENSATION LOOPS
- Publication number 20240213151
- Publication date Jun 27, 2024
- Western Digital Technologies, Inc.
- John T. Contreras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NAND DIE WITH WIRE-BOND INDUCTIVE COMPENSATION FOR ALTERED BOND WIR...
- Publication number 20240145424
- Publication date May 2, 2024
- Western Digital Technologies, Inc.
- John Contreras
- G11 - INFORMATION STORAGE
Information Patent Application
NAND DIE WITH RDL FOR ALTERED BOND WIRE BANDWIDTH IN MEMORY DEVICES
- Publication number 20240079318
- Publication date Mar 7, 2024
- Western Digital Technologies, Inc.
- Md. Sayed Mobin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SELECT DIES OF KNOWN THICKNESSES
- Publication number 20230395438
- Publication date Dec 7, 2023
- Western Digital Technologies, Inc.
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY SCALING SEMICONDUCTOR DEVICE
- Publication number 20210249385
- Publication date Aug 12, 2021
- SANDISK TECHNOLOGIES LLC
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY SCALING SEMICONDUCTOR DEVICE
- Publication number 20210104495
- Publication date Apr 8, 2021
- SANDISK TECHNOLOGIES LLC
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY SCALING SEMICONDUCTOR DEVICE
- Publication number 20210104493
- Publication date Apr 8, 2021
- SANDISK TECHNOLOGIES LLC
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY SCALING SEMICONDUCTOR DEVICE
- Publication number 20210104494
- Publication date Apr 8, 2021
- SANDISK TECHNOLOGIES LLC
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV SEMICONDUCTOR DEVICE INCLUDING TWO-DIMENSIONAL SHIFT
- Publication number 20200273844
- Publication date Aug 27, 2020
- Western Digital Technologies, Inc.
- Toshiki Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY APPARATUS AND ASSOCIATED METHODS
- Publication number 20130069230
- Publication date Mar 21, 2013
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY APPARATUS AND ASSOCIATED METHODS
- Publication number 20130071969
- Publication date Mar 21, 2013
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS TO GENERATE AND MONITOR OPTICAL SIGNALS AND CO...
- Publication number 20100296773
- Publication date Nov 25, 2010
- Achintya K. Bhowmik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS TO GENERATE AND MONITOR OPTICAL SIGNALS AND CO...
- Publication number 20080279236
- Publication date Nov 13, 2008
- Achintya K. Bhowmik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus to generate and monitor optical signals and co...
- Publication number 20060285106
- Publication date Dec 21, 2006
- Achintya K. Bhowmik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-thin polarization mode converters based on liquid crystal mat...
- Publication number 20060018585
- Publication date Jan 26, 2006
- Intel Corporation
- Nagesh K. Vodrahalli
- G02 - OPTICS
Information Patent Application
Multiplexing and demultiplexing optical signals
- Publication number 20050141806
- Publication date Jun 30, 2005
- Nagesh K. Vodrahalli
- G02 - OPTICS
Information Patent Application
Electronic assembly comprising solderable thermal interface and met...
- Publication number 20040155329
- Publication date Aug 12, 2004
- Intel Corporation
- Biswajit Sur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus to generate and monitor optical signals and co...
- Publication number 20040151227
- Publication date Aug 5, 2004
- Achintya K. Bhowmik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-thin polarization mode converters based on liquid crystal mat...
- Publication number 20040067001
- Publication date Apr 8, 2004
- Intel Corporation
- Nagesh K. Vodrahalli
- G02 - OPTICS
Information Patent Application
Polarization-insensitive planar lightwave circuits and method for f...
- Publication number 20040001663
- Publication date Jan 1, 2004
- Nagesh K. Vodrahalli
- G02 - OPTICS
Information Patent Application
Compact optical package with modular optical connector
- Publication number 20030174969
- Publication date Sep 18, 2003
- Nagesh K. Vodrahalli
- G02 - OPTICS
Information Patent Application
Crystal-core fiber mode converter for low-loss polarization-insensi...
- Publication number 20030113052
- Publication date Jun 19, 2003
- Achintya K. Bhowmik
- G02 - OPTICS

Nagesh Vodrahalli

Person

Patents Grantslast 30 patents

Microwave integrated quantum circuits with cap wafers and their met...

Memory scaling semiconductor device

Microwave integrated quantum circuits with cap wafers and their met...

Memory scaling semiconductor device

Memory scaling semiconductor device

Memory scaling semiconductor device

Substrate materials for quantum processors

TSV semiconductor device including two-dimensional shift

Substrate materials for quantum processors

Method and apparatus for testing a flip-chip assembly during manufa...

Method and apparatus for testing integrated circuit die with a part...

Electronic assembly apparatus and associated methods

Process for assembling an integrated circuit package having a subst...

Method and apparatus to generate and monitor optical signals and co...

Method and apparatus to generate and monitor optical signals and co...

Method and apparatus to generate and monitor optical signals and co...

Ultra-thin polarization mode converters based on liquid crystal mat...

Method and apparatus to generate and monitor optical signals and co...

Electronic assembly comprising solderable thermal interface and met...

High performance thermal interface curing process for organic flip...

Ultra-thin polarization mode converters based on liquid crystal mat...

Crystal-core fiber mode converter for low-loss polarization-insensi...

Compact optical package with modular optical connector

Polarization-insensitive planar lightwave circuits and method for f...

Electronic assembly comprising solderable thermal interface

Integrated circuit package having a substrate vent hole

Process for underfilling a controlled collapse chip connection (C4)...

Dielectric decal for a substrate of an integrated circuit package

High density ceramic BGA package and method for making same

Method and system for extracting and refining gold from ores

Patents Applicationslast 30 patents

Semiconductor Device Package with Die Stackup and Connection Platform

Semiconductor Device Package with Die Stackup and Interposer

TSV SEMICONDUCTOR DEVICE INCLUDING INDUCTIVE COMPENSATION LOOPS

NAND DIE WITH WIRE-BOND INDUCTIVE COMPENSATION FOR ALTERED BOND WIR...

NAND DIE WITH RDL FOR ALTERED BOND WIRE BANDWIDTH IN MEMORY DEVICES

SEMICONDUCTOR DEVICE INCLUDING SELECT DIES OF KNOWN THICKNESSES

MEMORY SCALING SEMICONDUCTOR DEVICE

MEMORY SCALING SEMICONDUCTOR DEVICE

MEMORY SCALING SEMICONDUCTOR DEVICE

MEMORY SCALING SEMICONDUCTOR DEVICE

TSV SEMICONDUCTOR DEVICE INCLUDING TWO-DIMENSIONAL SHIFT

ELECTRONIC ASSEMBLY APPARATUS AND ASSOCIATED METHODS

ELECTRONIC ASSEMBLY APPARATUS AND ASSOCIATED METHODS

METHOD AND APPARATUS TO GENERATE AND MONITOR OPTICAL SIGNALS AND CO...

METHOD AND APPARATUS TO GENERATE AND MONITOR OPTICAL SIGNALS AND CO...

Method and apparatus to generate and monitor optical signals and co...

Ultra-thin polarization mode converters based on liquid crystal mat...

Multiplexing and demultiplexing optical signals

Electronic assembly comprising solderable thermal interface and met...

Method and apparatus to generate and monitor optical signals and co...

Ultra-thin polarization mode converters based on liquid crystal mat...

Polarization-insensitive planar lightwave circuits and method for f...

Compact optical package with modular optical connector

Crystal-core fiber mode converter for low-loss polarization-insensi...