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Naohiro Shoda
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Wappingers Falls, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor workpiece processing apparatus and method
Patent number
6,406,545
Issue date
Jun 18, 2002
Kabushiki Kaisha Toshiba
Naohiro Shoda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a shallow trench isolation structure for a...
Patent number
6,150,072
Issue date
Nov 21, 2000
Siemens Microelectronics, Inc.
Naohiro Shoda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor wafer temperature measurement and control thereof usi...
Patent number
5,992,046
Issue date
Nov 30, 1999
Siemens Aktiengesellschaft
Peter Weigand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming an interconnect
Patent number
5,950,099
Issue date
Sep 7, 1999
Kabushiki Kaisha Toshiba
Naohiro Shoda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor wafer temperature measurement and control thereof usi...
Patent number
5,937,541
Issue date
Aug 17, 1999
Siemens Aktiengesellschaft
Peter Weigand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming studs and interconnects in a multi-layered semic...
Patent number
5,689,140
Issue date
Nov 18, 1997
Kabushiki Kaisha Toshiba
Naohiro Shoda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming studs and interconnects in a multi-layered semico...
Patent number
5,529,953
Issue date
Jun 25, 1996
Toshiba America Electronic Components, Inc.
Naohiro Shoda
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR WORKPIECE PROCESSING APPARATUS AND METHOD
Publication number
20010008172
Publication date
Jul 19, 2001
NAOHIRO SHODA
H01 - BASIC ELECTRIC ELEMENTS