Naoto Ishida

Person

Ogakishi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 9,433,106
- Issue date Aug 30, 2016
- Ibiden Co., Ltd.
- Naoto Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board for mounting semiconductor element
- Patent number 9,374,903
- Issue date Jun 21, 2016
- Ibiden Co., Ltd.
- Naoki Katsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,185,799
- Issue date Nov 10, 2015
- Ibiden Co., Ltd.
- Naoto Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,048,229
- Issue date Jun 2, 2015
- Ibiden Co., Ltd.
- Naoto Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 8,742,553
- Issue date Jun 3, 2014
- Ibiden Co., Ltd.
- Naoto Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed circuit board and manufacturing method thereof
- Patent number 8,148,643
- Issue date Apr 3, 2012
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a multilayered printed circuit board
- Patent number 7,832,098
- Issue date Nov 16, 2010
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayered circuit board
- Patent number 7,415,761
- Issue date Aug 26, 2008
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and manufacturing method therefor
- Patent number 7,222,776
- Issue date May 29, 2007
- Ibiden Co., Ltd.
- Naoto Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed-circuit board and method of manufacture thereof
- Patent number 6,809,415
- Issue date Oct 26, 2004
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and manufacturing method therefor
- Patent number 6,784,374
- Issue date Aug 31, 2004
- Ibiden Co., Ltd.
- Naoto Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of a multilayered printed circuit board having...
- Patent number 6,591,495
- Issue date Jul 15, 2003
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method for manufacturing the same
- Patent number 6,455,783
- Issue date Sep 24, 2002
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board with joining pin and manufacturing method ther...
- Patent number 6,444,924
- Issue date Sep 3, 2002
- Naoto Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting base board having heat slug with slit...
- Patent number 6,232,558
- Issue date May 15, 2001
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for mounting electronic part having conductive projection...
- Patent number 6,201,185
- Issue date Mar 13, 2001
- Ibiden Co., Ltd.
- Naoto Ishida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20150008021
- Publication date Jan 8, 2015
- IBIDEN CO., LTD.
- Naoto Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD FOR MOUNTING SEMICONDUCTOR ELEMENT
- Publication number 20140262447
- Publication date Sep 18, 2014
- IBIDEN CO., LTD.
- Naoki KATSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20140246765
- Publication date Sep 4, 2014
- IBIDEN CO., LTD.
- Naoto ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20140026412
- Publication date Jan 30, 2014
- IBIDEN CO., LTD.
- Naoto ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20130240258
- Publication date Sep 19, 2013
- IBIDEN CO., LTD.
- Naoto ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20130221518
- Publication date Aug 29, 2013
- IBIDEN CO., LTD.
- Naoto ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20120125680
- Publication date May 24, 2012
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20080189943
- Publication date Aug 14, 2008
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20080173473
- Publication date Jul 24, 2008
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and manufacturing method therefor
- Publication number 20050023034
- Publication date Feb 3, 2005
- IBIDEN Co., Ltd.
- Naoto Ishida
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multilayered printed circuit board and manufacturing method therefor
- Publication number 20040025333
- Publication date Feb 12, 2004
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and manufacturing method therefor
- Publication number 20020182903
- Publication date Dec 5, 2002
- Naoto Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayered printed circuit board and manufacturing method therefor
- Publication number 20010042637
- Publication date Nov 22, 2001
- Naohiro Hirose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed-circuit board and method of manufacture thereof
- Publication number 20010002728
- Publication date Jun 7, 2001
- IBIDEN CO., LTD.
- Kiyotaka Tsukada
- H01 - BASIC ELECTRIC ELEMENTS

Naoto Ishida

Person

Patents Grantslast 30 patents

Method for manufacturing printed wiring board

Multilayer printed wiring board for mounting semiconductor element

Printed wiring board

Printed wiring board

Printed wiring board

Multilayered printed circuit board and manufacturing method thereof

Method of manufacturing a multilayered printed circuit board

Method of manufacturing multilayered circuit board

Printed wiring board and manufacturing method therefor

Printed-circuit board and method of manufacture thereof

Printed wiring board and manufacturing method therefor

Manufacturing method of a multilayered printed circuit board having...

Multilayer printed wiring board and method for manufacturing the same

Printed wiring board with joining pin and manufacturing method ther...

Electronic component mounting base board having heat slug with slit...

Substrate for mounting electronic part having conductive projection...

Patents Applicationslast 30 patents

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

MULTILAYER PRINTED WIRING BOARD FOR MOUNTING SEMICONDUCTOR ELEMENT

PRINTED WIRING BOARD

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Printed wiring board and manufacturing method therefor

Multilayered printed circuit board and manufacturing method therefor

Printed wiring board and manufacturing method therefor

Multilayered printed circuit board and manufacturing method therefor

Printed-circuit board and method of manufacture thereof