Abstract: Japanese Publication No. 03-095962 published Apr. 22, 1991, Japanese Application No. 01-232392, filed Sep. 7, 1989, of IBIDEN Co., Ltd., and inventor Ishida Naoto, pertains to the Manufacture of Board For Mounting Electronic Parts. |
Abstract: Japanese Publication No. 64-008649 published Jan. 12, 1989, Japanese Application No. 62-164897, filed Jun. 30, 1987, of IBIDEN Co., Ltd., and inventors Yoshimura Satoshi and Takasaki Yoshinori, pertains to a Semiconductor Device. |
Abstract: Japanese Publication No. 08-236911 published Sep. 13, 1996, Japanese Application No. 07-038245, filed Feb. 27, 1995, of NEC Corp., and inventor Saito Masaru, pertains to a Structure Of Ball-Shaped External Connection Terminal. |
Abstract: Japanese Publication No. 07-212021 published Aug. 11, 1995, Japanese Application No. 06-007252, filed Jan. 26, 1994, of Matsushita Electric Works, Ltd., and inventors Hashizume Jiro, Saito Hiroshi and Kuzuhara Kazunari, pertains to a Solder Ball Electrode Forming Method And Solder Microscopic Sphere Positioning Jig Used For The Method. |
Abstract: Japanese Publication No. 08-023047 published Jan. 23, 1996, Japanese Application No. 06-154511, filed Jul. 6, 1994, of Hitachi Cable Ltd., and inventors Kumakura Toyohikio and Onda Mamoru, pertains to BGA Type Semidconductor Device. |