Narendra Singh Mehta

Person

Dallas, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Damage implantation of cap layer
- Patent number 12,154,987
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Mahalingam Nandakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damage implantation of a cap layer
- Patent number 8,859,377
- Issue date Oct 14, 2014
- Texas Instruments Incorporated
- Mahalingam Nandakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly selective liners for semiconductor fabrication
- Patent number 7,838,370
- Issue date Nov 23, 2010
- Texas Instruments Incorporated
- Narendra Singh Mehta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implant damage of layer for easy removal and reduced silicon recess
- Patent number 7,772,094
- Issue date Aug 10, 2010
- Texas Instuments Incorporated
- Mahalingam Nandakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufactured using a non-contact implant metro...
- Patent number 7,696,021
- Issue date Apr 13, 2010
- Texas Instruments Incorporated
- Narendra Singh Mehta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of improving drive currents by employing strain inducing ST...
- Patent number 7,396,728
- Issue date Jul 8, 2008
- Texas Instruments Incorporated
- Ajith Varghese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strain modulation employing process techniques for CMOS technologies
- Patent number 7,384,861
- Issue date Jun 10, 2008
- Texas Instruments Incorporated
- Narendra Singh Mehta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DAMAGE IMPLANTATION OF CAP LAYER
- Publication number 20220102553
- Publication date Mar 31, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Mahalingam Nandakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Damage Implantation of a Cap Layer
- Publication number 20170365715
- Publication date Dec 21, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Mahalingam Nandakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Strain Inducing Sidewall Spacer and a...
- Publication number 20100270622
- Publication date Oct 28, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Mahalingam NANDAKUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Damage Implantation of a Cap Layer
- Publication number 20100252887
- Publication date Oct 7, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Mahalingam Nandakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLANT DAMAGE OF LAYER FOR EASY REMOVAL AND REDUCED SILICON RECESS
- Publication number 20090170277
- Publication date Jul 2, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Mahalingam Nandakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FLASH ANNEALING OF SEMICONDUCTOR DEVICES
- Publication number 20090130864
- Publication date May 21, 2009
- Narendra Singh MEHTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methodology for Reducing Post Burn-In Vmin Drift
- Publication number 20090045472
- Publication date Feb 19, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Srinivasan Chakravarthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Damage Implantation of a Cap Layer
- Publication number 20090004805
- Publication date Jan 1, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Mahalingam Nandakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED POLY STRUCTURE TO REDUCE THE POLY PARTICLE COUNT IN ADVANCE...
- Publication number 20080251864
- Publication date Oct 16, 2008
- Yuanning Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY SELECTIVE LINERS FOR SEMICONDUCTOR FABRICATION
- Publication number 20080217703
- Publication date Sep 11, 2008
- Narendra Singh Mehta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Manufactured Using a Non-Contact Implant Metro...
- Publication number 20080006886
- Publication date Jan 10, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Narendra Singh Mehta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A STRAIN INDUCING SIDEWALL SPACER AND A...
- Publication number 20070196991
- Publication date Aug 23, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Mahalingam Nandakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Strain modulation employing process techniques for CMOS technologies
- Publication number 20070015347
- Publication date Jan 18, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Narendra Singh Mehta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of improving drive currents by employing strain inducing ST...
- Publication number 20070004118
- Publication date Jan 4, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Ajith Varghese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a high carbon content strain inducing f...
- Publication number 20060172556
- Publication date Aug 3, 2006
- TEXAS INSTRUMENTS INCORPORATED
- Wayne A. Bather
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Narendra Singh Mehta

Person

Patents Grantslast 30 patents

Damage implantation of cap layer

Damage implantation of a cap layer

Highly selective liners for semiconductor fabrication

Implant damage of layer for easy removal and reduced silicon recess

Semiconductor device manufactured using a non-contact implant metro...

Methods of improving drive currents by employing strain inducing ST...

Strain modulation employing process techniques for CMOS technologies

Patents Applicationslast 30 patents

DAMAGE IMPLANTATION OF CAP LAYER

Damage Implantation of a Cap Layer

Semiconductor Device Having a Strain Inducing Sidewall Spacer and a...

Damage Implantation of a Cap Layer

IMPLANT DAMAGE OF LAYER FOR EASY REMOVAL AND REDUCED SILICON RECESS

SYSTEMS AND METHODS FOR FLASH ANNEALING OF SEMICONDUCTOR DEVICES

Methodology for Reducing Post Burn-In Vmin Drift

Damage Implantation of a Cap Layer

STACKED POLY STRUCTURE TO REDUCE THE POLY PARTICLE COUNT IN ADVANCE...

HIGHLY SELECTIVE LINERS FOR SEMICONDUCTOR FABRICATION

Semiconductor Device Manufactured Using a Non-Contact Implant Metro...

SEMICONDUCTOR DEVICE HAVING A STRAIN INDUCING SIDEWALL SPACER AND A...

Strain modulation employing process techniques for CMOS technologies

Methods of improving drive currents by employing strain inducing ST...

Semiconductor device having a high carbon content strain inducing f...