Navas Khan Oratti Kalandar

Person

Subang Jaya, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor sensor with gel filled cavity
- Patent number 9,476,788
- Issue date Oct 25, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Navas Khan Oratti Kalandar
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming pillar bump
- Patent number 9,209,147
- Issue date Dec 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having power distribution using bond wires
- Patent number 9,196,598
- Issue date Nov 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Shailesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-use substrate for integrated circuit
- Patent number 9,190,355
- Issue date Nov 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Weng Hoong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar bump and flip chip package using same
- Patent number 9,159,682
- Issue date Oct 13, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-formed via array for integrated circuit package
- Patent number 9,064,718
- Issue date Jun 23, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Kesvakumar V. C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die ball grid array package
- Patent number 9,034,694
- Issue date May 19, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid lead frame and ball grid array package
- Patent number 8,987,881
- Issue date Mar 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Seng Kiong Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffened semiconductor die package
- Patent number 8,945,989
- Issue date Feb 3, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Kesvakumar V. C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with power bar for semiconductor device
- Patent number 8,933,547
- Issue date Jan 13, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jia Lin Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making surface mount stacked semiconductor devices
- Patent number 8,853,058
- Issue date Oct 7, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Kesvakumar V. C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount semiconductor device with solder ball reinforcement f...
- Patent number 8,836,098
- Issue date Sep 16, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Norazham Mohd Sukemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistributed contacts
- Patent number 8,810,020
- Issue date Aug 19, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffened semiconductor die package
- Patent number 8,772,913
- Issue date Jul 8, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Kesvakumar V. C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible substrate with crimping interconnection
- Patent number 8,698,288
- Issue date Apr 15, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming stacked die package using redistributed chip pack...
- Patent number 8,669,140
- Issue date Mar 11, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Kesvakumar V. C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor die with power rail pads
- Patent number 8,643,189
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-USE SUBSTRATE FOR INTEGRATED CIRCUIT
- Publication number 20150303137
- Publication date Oct 22, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Weng Hoong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SENSOR WITH GEL FILLED CAVITY
- Publication number 20150300905
- Publication date Oct 22, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Navas Khan Oratti Kalandar
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH PACKAGE-LEVEL DECOUPLING CAPACITORS FORME...
- Publication number 20150221592
- Publication date Aug 6, 2015
- Chetan Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME BASED SEMICONDUCTOR DEVICE WITH POWER BARS
- Publication number 20150206769
- Publication date Jul 23, 2015
- Kesvakumar V.C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMICONDUCTOR DEVICE WITH DIE TOP POWER CONNECTIONS
- Publication number 20150187728
- Publication date Jul 2, 2015
- Kesvakumar V.C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR DIE GRID ARRAY PACKAGE
- Publication number 20150115420
- Publication date Apr 30, 2015
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP AND FLIP CHIP PACKAGE USING SAME
- Publication number 20150069603
- Publication date Mar 12, 2015
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SENSOR DEVICE AND ASSEMBLY METHOD
- Publication number 20150054099
- Publication date Feb 26, 2015
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LEAD FRAME AND BALL GRID ARRAY PACKAGE
- Publication number 20150014834
- Publication date Jan 15, 2015
- Seng Kiong Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT SPREADER AND THERMAL SHEET
- Publication number 20140374891
- Publication date Dec 25, 2014
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENED SEMICONDUCTOR DIE PACKAGE
- Publication number 20140302641
- Publication date Oct 9, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Kesvakumar V.C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND METHOD
- Publication number 20140263584
- Publication date Sep 18, 2014
- Jia Lin Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH LOW STAND-OFF INTERCONNECTIONS BETWEEN...
- Publication number 20140231977
- Publication date Aug 21, 2014
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DIE WITH POWER RAIL PADS
- Publication number 20140021621
- Publication date Jan 23, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SURFACE MOUNT STACKED SEMICONDUCTOR DEVICES
- Publication number 20130344656
- Publication date Dec 26, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Kesvakumar V.C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTED CONTACTS
- Publication number 20130341796
- Publication date Dec 26, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS

Navas Khan Oratti Kalandar

Person

Patents Grantslast 30 patents

Semiconductor sensor with gel filled cavity

Method of forming pillar bump

Semiconductor device having power distribution using bond wires

Multi-use substrate for integrated circuit

Copper pillar bump and flip chip package using same

Pre-formed via array for integrated circuit package

Embedded die ball grid array package

Hybrid lead frame and ball grid array package

Stiffened semiconductor die package

Lead frame with power bar for semiconductor device

Method of making surface mount stacked semiconductor devices

Surface mount semiconductor device with solder ball reinforcement f...

Semiconductor device with redistributed contacts

Stiffened semiconductor die package

Flexible substrate with crimping interconnection

Method of forming stacked die package using redistributed chip pack...

Packaged semiconductor die with power rail pads

Patents Applicationslast 30 patents

MULTI-USE SUBSTRATE FOR INTEGRATED CIRCUIT

SEMICONDUCTOR SENSOR WITH GEL FILLED CAVITY

SEMICONDUCTOR DEVICE WITH PACKAGE-LEVEL DECOUPLING CAPACITORS FORME...

LEAD FRAME BASED SEMICONDUCTOR DEVICE WITH POWER BARS

EMICONDUCTOR DEVICE WITH DIE TOP POWER CONNECTIONS

SENSOR DIE GRID ARRAY PACKAGE

COPPER PILLAR BUMP AND FLIP CHIP PACKAGE USING SAME

PRESSURE SENSOR DEVICE AND ASSEMBLY METHOD

HYBRID LEAD FRAME AND BALL GRID ARRAY PACKAGE

SEMICONDUCTOR DEVICE WITH HEAT SPREADER AND THERMAL SHEET

STIFFENED SEMICONDUCTOR DIE PACKAGE

WIRE BONDING APPARATUS AND METHOD

SEMICONDUCTOR PACKAGES WITH LOW STAND-OFF INTERCONNECTIONS BETWEEN...

PACKAGED SEMICONDUCTOR DIE WITH POWER RAIL PADS

METHOD OF MAKING SURFACE MOUNT STACKED SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE WITH REDISTRIBUTED CONTACTS