Neelam Prabhu-Gaunkar

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package substrate with glass core having vertical power planes for...
- Patent number 12,368,091
- Issue date Jul 22, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic planar spiral and high aspect ratio inductors for power de...
- Patent number 12,347,761
- Issue date Jul 1, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components for millimeter-wave communication
- Patent number 12,255,158
- Issue date Mar 18, 2025
- Intel Corporation
- Neelam Prabhu Gaunkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low leakage thin film capacitors using titanium oxide dielectric wi...
- Patent number 12,255,225
- Issue date Mar 18, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components for millimeter-wave communication
- Patent number 12,166,261
- Issue date Dec 10, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter-wave dielectric waveguide bundle including first and sec...
- Patent number 12,126,068
- Issue date Oct 22, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter-wave dielectric waveguide including an opening of varyin...
- Patent number 12,126,067
- Issue date Oct 22, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic support for millimeter-wave communication including...
- Patent number 12,107,314
- Issue date Oct 1, 2024
- Intel Corporation
- Neelam Prabhu Gaunkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dispersive waveguide crosstalk mitigation
- Patent number 12,088,360
- Issue date Sep 10, 2024
- Intel Corporation
- Henning Braunisch
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Components for millimeter-wave communication
- Patent number 12,021,289
- Issue date Jun 25, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components for millimeter-wave communication
- Patent number 11,955,684
- Issue date Apr 9, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dispersion compensation for electromagnetic waveguides
- Patent number 11,916,604
- Issue date Feb 27, 2024
- Intel Corporation
- Diego Correas-Serrano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVELY TRANSFERRED INDUCTORS WITH ELECTROPLATED MAGNETIC MATERIAL
- Publication number 20250054672
- Publication date Feb 13, 2025
- Intel Corporation
- Veronica Aleman Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER-WAVE DIELECTRIC WAVEGUIDE BUNDLE INCLUDING FIRST AND SEC...
- Publication number 20240429588
- Publication date Dec 26, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH CORE VIA COAXIAL-TYPE INDUCTORS WITH TWO OR MORE MAGNETIC M...
- Publication number 20240371799
- Publication date Nov 7, 2024
- Intel Corporation
- Aleksander ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSCEIVER AND WAVEGUIDE LAUNCHER ARRAY
- Publication number 20240006735
- Publication date Jan 4, 2024
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATE-UP HYBRID STRUCTURES USING MODIFIED GLASS PATTERNING PROCESSES
- Publication number 20230207407
- Publication date Jun 29, 2023
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR WITH INTEGRATED MAGNETICS
- Publication number 20230207493
- Publication date Jun 29, 2023
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL INDUCTOR WITH PLATED HIGH RESISTIVITY AND HIGH PERMEABILITY...
- Publication number 20230207492
- Publication date Jun 29, 2023
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSPENDED STRUCTURES IN GLASS USING MODIFIED GLASS PATTERNING PROCE...
- Publication number 20230207408
- Publication date Jun 29, 2023
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D ARRAYED GLASS-BASED MMWAVE AND THZ STRUCTURES
- Publication number 20230208010
- Publication date Jun 29, 2023
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL INDUCTORS FABRICATED THROUGH A DRILL-LESS VIA PROCESS
- Publication number 20230207404
- Publication date Jun 29, 2023
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDEBAND ANTENNAS IN GLASS THROUGH DIRECT VIA FEEDING AND GLASS STA...
- Publication number 20230208009
- Publication date Jun 29, 2023
- Neelam PRABHU GAUNKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BATTERIES WITHIN GLASS CORES OF PACKAGE SUBSTRATES
- Publication number 20230198058
- Publication date Jun 22, 2023
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY TECHNIQUES FOR GLASS SUBSTRATE WITH HIGH DENSITY SIG...
- Publication number 20230197592
- Publication date Jun 22, 2023
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE FOR INTEGR...
- Publication number 20230197620
- Publication date Jun 22, 2023
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS VIAS AND PLANES WITH REDUCED TAPERING
- Publication number 20230197541
- Publication date Jun 22, 2023
- Intel Corporation
- Veronica STRONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW LOSS MICROSTRIP AND STRIPLINE ROUTING WITH BLIND TRENCH VIAS FO...
- Publication number 20230197646
- Publication date Jun 22, 2023
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL AND GROUND VIAS IN A GLASS CORE TO CONTROL IMPEDANCE
- Publication number 20220416391
- Publication date Dec 29, 2022
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANGLED INTERCONNECT USING GLASS CORE TECHNOLOGY
- Publication number 20220415779
- Publication date Dec 29, 2022
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PACKAGE MAGNETIC SWITCHING USING GLASS CORE TECHNOLOGY
- Publication number 20220406991
- Publication date Dec 22, 2022
- Intel Corporation
- Neelam PRABHU GAUNKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDED GLASS INTERCONNECT DUAL DAMASCENE VIAS
- Publication number 20220406617
- Publication date Dec 22, 2022
- Intel Corporation
- Veronica STRONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH OPTICAL WAVEGUIDE IN A GLASS CORE
- Publication number 20220404568
- Publication date Dec 22, 2022
- Intel Corporation
- Aleksandar ALEKSOV
- G02 - OPTICS
Information Patent Application
GLASS PACKAGE CORE WITH PLANAR STRUCTURES
- Publication number 20220406725
- Publication date Dec 22, 2022
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITORS IN A GLASS SUBSTRATE
- Publication number 20220406523
- Publication date Dec 22, 2022
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF FILTERS AND MULTIPLEXERS MANUFACTURED IN THE CORE OF A PACKAGE S...
- Publication number 20220407199
- Publication date Dec 22, 2022
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT SURFACE TRANSMISSION LINE WAVEGUIDES WITH VERTICAL GROUND P...
- Publication number 20220407202
- Publication date Dec 22, 2022
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTLESS COMMUNICATION USING A WAVEGUIDE EXTENDING THROUGH A SUB...
- Publication number 20220407205
- Publication date Dec 22, 2022
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE COMPONENTS IN A GLASS CORE OF A SUBSTRATE
- Publication number 20220407212
- Publication date Dec 22, 2022
- Intel Corporation
- Neelam PRABHU GAUNKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PACKAGE MMWAVE ANTENNAS AND LAUNCHERS USING GLASS CORE TECHNOLOGY
- Publication number 20220407216
- Publication date Dec 22, 2022
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH GLASS CORE HAVING VERTICAL POWER PLANES FOR...
- Publication number 20220406696
- Publication date Dec 22, 2022
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC PLANAR SPIRAL AND HIGH ASPECT RATIO INDUCTORS FOR POWER DE...
- Publication number 20220406698
- Publication date Dec 22, 2022
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS

Neelam Prabhu-Gaunkar

Person

Patents Grantslast 30 patents

Package substrate with glass core having vertical power planes for...

Magnetic planar spiral and high aspect ratio inductors for power de...

Components for millimeter-wave communication

Low leakage thin film capacitors using titanium oxide dielectric wi...

Components for millimeter-wave communication

Millimeter-wave dielectric waveguide bundle including first and sec...

Millimeter-wave dielectric waveguide including an opening of varyin...

Microelectronic support for millimeter-wave communication including...

Dispersive waveguide crosstalk mitigation

Components for millimeter-wave communication

Components for millimeter-wave communication

Dispersion compensation for electromagnetic waveguides

Patents Applicationslast 30 patents

SELECTIVELY TRANSFERRED INDUCTORS WITH ELECTROPLATED MAGNETIC MATERIAL

MILLIMETER-WAVE DIELECTRIC WAVEGUIDE BUNDLE INCLUDING FIRST AND SEC...

THROUGH CORE VIA COAXIAL-TYPE INDUCTORS WITH TWO OR MORE MAGNETIC M...

STACKED TRANSCEIVER AND WAVEGUIDE LAUNCHER ARRAY

PLATE-UP HYBRID STRUCTURES USING MODIFIED GLASS PATTERNING PROCESSES

INDUCTOR WITH INTEGRATED MAGNETICS

COAXIAL INDUCTOR WITH PLATED HIGH RESISTIVITY AND HIGH PERMEABILITY...

SUSPENDED STRUCTURES IN GLASS USING MODIFIED GLASS PATTERNING PROCE...

3D ARRAYED GLASS-BASED MMWAVE AND THZ STRUCTURES

COAXIAL INDUCTORS FABRICATED THROUGH A DRILL-LESS VIA PROCESS

WIDEBAND ANTENNAS IN GLASS THROUGH DIRECT VIA FEEDING AND GLASS STA...

EMBEDDED BATTERIES WITHIN GLASS CORES OF PACKAGE SUBSTRATES

POWER DELIVERY TECHNIQUES FOR GLASS SUBSTRATE WITH HIGH DENSITY SIG...

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE FOR INTEGR...

GLASS VIAS AND PLANES WITH REDUCED TAPERING

LOW LOSS MICROSTRIP AND STRIPLINE ROUTING WITH BLIND TRENCH VIAS FO...

SIGNAL AND GROUND VIAS IN A GLASS CORE TO CONTROL IMPEDANCE

ANGLED INTERCONNECT USING GLASS CORE TECHNOLOGY

IN-PACKAGE MAGNETIC SWITCHING USING GLASS CORE TECHNOLOGY

DUAL SIDED GLASS INTERCONNECT DUAL DAMASCENE VIAS

PACKAGE WITH OPTICAL WAVEGUIDE IN A GLASS CORE

GLASS PACKAGE CORE WITH PLANAR STRUCTURES

CAPACITORS IN A GLASS SUBSTRATE

RF FILTERS AND MULTIPLEXERS MANUFACTURED IN THE CORE OF A PACKAGE S...

COMPACT SURFACE TRANSMISSION LINE WAVEGUIDES WITH VERTICAL GROUND P...

CONTACTLESS COMMUNICATION USING A WAVEGUIDE EXTENDING THROUGH A SUB...

MILLIMETER WAVE COMPONENTS IN A GLASS CORE OF A SUBSTRATE

IN-PACKAGE MMWAVE ANTENNAS AND LAUNCHERS USING GLASS CORE TECHNOLOGY

PACKAGE SUBSTRATE WITH GLASS CORE HAVING VERTICAL POWER PLANES FOR...

MAGNETIC PLANAR SPIRAL AND HIGH ASPECT RATIO INDUCTORS FOR POWER DE...