Nirmal K. Sharma

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sensor and method of providing a sensor
- Patent number 9,228,860
- Issue date Jan 5, 2016
- Allegro Microsystems, LLC
- Nirmal Sharma
- G01 - MEASURING TESTING
Information Patent Grant
Methods and apparatus for flip-chip-on-lead semiconductor package
- Patent number 8,785,250
- Issue date Jul 22, 2014
- Allegro Microsystems, LLC
- Nirmal Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic field sensors and methods for fabricating the magnetic fie...
- Patent number 8,486,755
- Issue date Jul 16, 2013
- Allegro Microsystems, LLC
- Virgil Ararao
- G01 - MEASURING TESTING
Information Patent Grant
Magnetic field sensors and methods for fabricating the magnetic fie...
- Patent number 8,461,677
- Issue date Jun 11, 2013
- Allegro Microsystems, LLC
- Virgil Ararao
- G01 - MEASURING TESTING
Information Patent Grant
Methods for multi-stage molding of integrated circuit package
- Patent number 8,143,169
- Issue date Mar 27, 2012
- Allegro Microsystems, Inc.
- Raymond W. Engel
- G01 - MEASURING TESTING
Information Patent Grant
Methods and apparatus for multi-stage molding of integrated circuit...
- Patent number 7,816,772
- Issue date Oct 19, 2010
- Allegro Microsystems, Inc.
- Raymond W. Engel
- G01 - MEASURING TESTING
Information Patent Grant
Methods and apparatus for Flip-Chip-On-Lead semiconductor package
- Patent number 7,361,531
- Issue date Apr 22, 2008
- Allegro Microsystems, Inc.
- Nirmal Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor
- Patent number 6,995,315
- Issue date Feb 7, 2006
- Allegro Microsystems, Inc.
- Nirmal Sharma
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit package with thermal path layers incorporating s...
- Patent number 4,731,701
- Issue date Mar 15, 1988
- Fairchild Semiconductor Corporation
- Marco K. Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR PASSIVE ATTACHMENT OF COMPONENTS FOR INTE...
- Publication number 20200355525
- Publication date Nov 12, 2020
- ALLEGRO MICROSYSTEMS, LLC
- William P. Taylor
- G01 - MEASURING TESTING
Information Patent Application
Methods and Apparatus for Passive Attachment of Components for Inte...
- Publication number 20150285874
- Publication date Oct 8, 2015
- Allegro Microsystems, LLC
- William P. Taylor
- G01 - MEASURING TESTING
Information Patent Application
Magnetic Field Sensors and Methods for Fabricating the Magnetic Fie...
- Publication number 20130264667
- Publication date Oct 10, 2013
- ALLEGRO MICROSYSTEMS, INC.
- Virgil Ararao
- G01 - MEASURING TESTING
Information Patent Application
Magnetic Field Sensors and Methods for Fabricating the Magnetic Fie...
- Publication number 20130267043
- Publication date Oct 10, 2013
- ALLEGRO MICROSYSTEMS, INC.
- Virgil Ararao
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND APPARATUS FOR PASSIVE ATTACHMENT OF COMPONENTS FOR INTE...
- Publication number 20120086090
- Publication date Apr 12, 2012
- ALLEGRO MICROSYSTEMS, INC.
- Nirmal Sharma
- G01 - MEASURING TESTING
Information Patent Application
Magnetic Field Sensors and Methods for Fabricating the Magnetic Fie...
- Publication number 20120013333
- Publication date Jan 19, 2012
- ALLEGRO MICROSYSTEMS, INC.
- Virgil Ararao
- G01 - MEASURING TESTING
Information Patent Application
METHODS FOR MULTI-STAGE MOLDING OF INTEGRATED CIRCUIT PACKAGE
- Publication number 20100330708
- Publication date Dec 30, 2010
- ALLEGRO MICROSYSTEMS, INC.
- Raymond W. Engel
- G01 - MEASURING TESTING
Information Patent Application
Magnetic Field Sensors and Methods for Fabricating the Magnetic Fie...
- Publication number 20100141249
- Publication date Jun 10, 2010
- Virgil Ararao
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND APPARATUS FOR MULTI-STAGE MOLDING OF INTEGRATED CIRCUIT...
- Publication number 20080237818
- Publication date Oct 2, 2008
- Raymond W. Engel
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND APPARATUS FOR FLIP-CHIP-ON-LEAD SEMICONDUCTOR PACKAGE
- Publication number 20080230879
- Publication date Sep 25, 2008
- Nirmal Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PASSIVE ATTACHMENT OF COMPONENTS FOR INTE...
- Publication number 20080013298
- Publication date Jan 17, 2008
- Nirmal Sharma
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CURRENT SENSOR
- Publication number 20070279053
- Publication date Dec 6, 2007
- William P. Taylor
- G01 - MEASURING TESTING
Information Patent Application
Methods and apparatus for Flip-Chip-On-Lead semiconductor package
- Publication number 20070099348
- Publication date May 3, 2007
- Nirmal Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT SENSOR
- Publication number 20060219436
- Publication date Oct 5, 2006
- William P Taylor
- G01 - MEASURING TESTING
Information Patent Application
Current sensor
- Publication number 20050248336
- Publication date Nov 10, 2005
- Nirmal Sharma
- G01 - MEASURING TESTING

Nirmal K. Sharma

Person

Patents Grantslast 30 patents

Sensor and method of providing a sensor

Methods and apparatus for flip-chip-on-lead semiconductor package

Magnetic field sensors and methods for fabricating the magnetic fie...

Magnetic field sensors and methods for fabricating the magnetic fie...

Methods for multi-stage molding of integrated circuit package

Methods and apparatus for multi-stage molding of integrated circuit...

Methods and apparatus for Flip-Chip-On-Lead semiconductor package

Current sensor

Integrated circuit package with thermal path layers incorporating s...

Patents Applicationslast 30 patents

METHODS AND APPARATUS FOR PASSIVE ATTACHMENT OF COMPONENTS FOR INTE...

Methods and Apparatus for Passive Attachment of Components for Inte...

Magnetic Field Sensors and Methods for Fabricating the Magnetic Fie...

Magnetic Field Sensors and Methods for Fabricating the Magnetic Fie...

METHODS AND APPARATUS FOR PASSIVE ATTACHMENT OF COMPONENTS FOR INTE...

Magnetic Field Sensors and Methods for Fabricating the Magnetic Fie...

METHODS FOR MULTI-STAGE MOLDING OF INTEGRATED CIRCUIT PACKAGE

Magnetic Field Sensors and Methods for Fabricating the Magnetic Fie...

METHODS AND APPARATUS FOR MULTI-STAGE MOLDING OF INTEGRATED CIRCUIT...

METHODS AND APPARATUS FOR FLIP-CHIP-ON-LEAD SEMICONDUCTOR PACKAGE

METHODS AND APPARATUS FOR PASSIVE ATTACHMENT OF COMPONENTS FOR INTE...

INTEGRATED CURRENT SENSOR

Methods and apparatus for Flip-Chip-On-Lead semiconductor package

CURRENT SENSOR

Current sensor