Nirupama Chakrapani

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Controlled fluid delivery in a microelectronic package
- Patent number 9,604,210
- Issue date Mar 28, 2017
- Intel Corporation
- Lakshmi Supriya
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Controlled fluid delivery in a microelectronic package
- Patent number 9,101,931
- Issue date Aug 11, 2015
- Intel Corporation
- Lakshmi Supriya
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Treatment for a microelectronic device and method of resisting dama...
- Patent number 8,304,065
- Issue date Nov 6, 2012
- Leonel Arana
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic packages with fine particle wetting and non-wetting zones
- Patent number 8,018,073
- Issue date Sep 13, 2011
- Intel Corporation
- Nirupama Chakrapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Applications of smart polymer composites to integrated circuit pack...
- Patent number 7,952,212
- Issue date May 31, 2011
- Intel Corporation
- Nirupama Chakrapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages with fine particle wetting and non-wetting zones
- Patent number 7,927,925
- Issue date Apr 19, 2011
- Intel Corporation
- Nirupama Chakrapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with wear resistant coating
- Patent number 7,759,780
- Issue date Jul 20, 2010
- Intel Corporation
- Nirupama Chakrapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling substrate surface properties via colloidal coatings
- Patent number 7,687,890
- Issue date Mar 30, 2010
- Intel Corporation
- Gopalakrishnan Subramanian
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Recovery of hydrophobicity of low-k and ultra low-k organosilicate...
- Patent number 7,687,913
- Issue date Mar 30, 2010
- International Business Machines Corporation
- Nirupama Chakrapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recovery of hydrophobicity of low-k and ultra low-k organosilicate...
- Patent number 7,179,758
- Issue date Feb 20, 2007
- International Business Machines Corporation
- Nirupama Chakrapani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTROLLED FLUID DELIVERY IN A MICROELECTRONIC PACKAGE
- Publication number 20150209780
- Publication date Jul 30, 2015
- Intel Corporation
- Lakshmi Supriya
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Electronic Packages With Fine Particle Wetting and Non-Wetting Zones
- Publication number 20110163445
- Publication date Jul 7, 2011
- Nirupama Chakrapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Treatment for a microelectronic device and method of resisting dama...
- Publication number 20110159256
- Publication date Jun 30, 2011
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECOVERY OF HYDROPHOBICITY OF LOW-K AND ULTRA LOW-K ORGANOSILICATE...
- Publication number 20110003402
- Publication date Jan 6, 2011
- Nirupama Chakrapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPLICATIONS OF SMART POLYMER COMPOSITES TO INTEGRATED CIRCUIT PACK...
- Publication number 20100237513
- Publication date Sep 23, 2010
- Nirupama Chakrapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Packages with Fine Particle Wetting and Non-Wetting Zones
- Publication number 20100190302
- Publication date Jul 29, 2010
- Nirupama Chakrapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH WEAR RESISTANT COATING
- Publication number 20100078806
- Publication date Apr 1, 2010
- Nirupama Chakrapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED FLUID DELIVERY IN A MICROELECTRONIC PACKAGE
- Publication number 20090169427
- Publication date Jul 2, 2009
- Lakshmi Supriya
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Controlling substrate surface properties via colloidal coatings
- Publication number 20080237810
- Publication date Oct 2, 2008
- Gopalakrishnan Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic package including thermally conductive sealant betw...
- Publication number 20080237843
- Publication date Oct 2, 2008
- Ashish Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlling flow of underfill using polymer coating and resulting d...
- Publication number 20080142996
- Publication date Jun 19, 2008
- Gopalakrishnan Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic packages with fine particle wetting and non-wetting zones
- Publication number 20080067502
- Publication date Mar 20, 2008
- Nirupama Chakrapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic packages with roughened wetting and non-wetting zones
- Publication number 20080026505
- Publication date Jan 31, 2008
- Nirupama Chakrapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECOVERY OF HYDROPHOBICITY OF LOW-K AND ULTRA LOW-K ORGANOSILICATE...
- Publication number 20070138640
- Publication date Jun 21, 2007
- Nirupama Chakrapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Negative thermal expansion material filler for low CTE composites
- Publication number 20070135550
- Publication date Jun 14, 2007
- Nirupama Chakrapani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Substrate core polymer nanocomposite with nanoparticles and randoml...
- Publication number 20070096083
- Publication date May 3, 2007
- Intel Corporation
- Nachiket Raravikar
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Application of autonomic self healing composites to integrated circ...
- Publication number 20070029653
- Publication date Feb 8, 2007
- Stephen E. Lehman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Recovery of hydrophobicity of low-k and ultra low-k organosilicate...
- Publication number 20050106762
- Publication date May 19, 2005
- Nirupama Chakrapani
- H01 - BASIC ELECTRIC ELEMENTS

Nirupama Chakrapani

Person

Patents Grantslast 30 patents

Controlled fluid delivery in a microelectronic package

Controlled fluid delivery in a microelectronic package

Treatment for a microelectronic device and method of resisting dama...

Electronic packages with fine particle wetting and non-wetting zones

Applications of smart polymer composites to integrated circuit pack...

Electronic packages with fine particle wetting and non-wetting zones

Microelectronic package with wear resistant coating

Controlling substrate surface properties via colloidal coatings

Recovery of hydrophobicity of low-k and ultra low-k organosilicate...

Recovery of hydrophobicity of low-k and ultra low-k organosilicate...

Patents Applicationslast 30 patents

CONTROLLED FLUID DELIVERY IN A MICROELECTRONIC PACKAGE

Electronic Packages With Fine Particle Wetting and Non-Wetting Zones

Treatment for a microelectronic device and method of resisting dama...

RECOVERY OF HYDROPHOBICITY OF LOW-K AND ULTRA LOW-K ORGANOSILICATE...

APPLICATIONS OF SMART POLYMER COMPOSITES TO INTEGRATED CIRCUIT PACK...

Electronic Packages with Fine Particle Wetting and Non-Wetting Zones

MICROELECTRONIC PACKAGE WITH WEAR RESISTANT COATING

CONTROLLED FLUID DELIVERY IN A MICROELECTRONIC PACKAGE

Controlling substrate surface properties via colloidal coatings

Microelectronic package including thermally conductive sealant betw...

Controlling flow of underfill using polymer coating and resulting d...

Electronic packages with fine particle wetting and non-wetting zones

Electronic packages with roughened wetting and non-wetting zones

RECOVERY OF HYDROPHOBICITY OF LOW-K AND ULTRA LOW-K ORGANOSILICATE...

Negative thermal expansion material filler for low CTE composites

Substrate core polymer nanocomposite with nanoparticles and randoml...

Application of autonomic self healing composites to integrated circ...

Recovery of hydrophobicity of low-k and ultra low-k organosilicate...