Nishita Takafumi

Person

Iruma-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 9,818,678
- Issue date Nov 14, 2017
- Renesas Electronics Corporation
- Jumpei Konno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 9,455,240
- Issue date Sep 27, 2016
- Renesas Electronics Corporation
- Jumpei Konno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,701,972
- Issue date Apr 22, 2014
- Renesas Electronics Corporation
- Takafumi Nishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method of the same
- Patent number 8,557,633
- Issue date Oct 15, 2013
- Renesas Electronics Corporation
- Kunio Shigemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,534,532
- Issue date Sep 17, 2013
- Renesas Electronics Corporation
- Jumpei Konno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 8,119,050
- Issue date Feb 21, 2012
- Renesas Electronics Corporation
- Bunshi Kuratomi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,678,706
- Issue date Mar 16, 2010
- Renesas Technology Corp.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having improved adhesion between bonding and b...
- Patent number 7,449,786
- Issue date Nov 11, 2008
- Renesas Technology Corp.
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,445,969
- Issue date Nov 4, 2008
- Renesas Technology Corp.
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method of the same
- Patent number 7,396,701
- Issue date Jul 8, 2008
- Renesas Technology Corp.
- Kunio Shigemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,332,800
- Issue date Feb 19, 2008
- Renesas Technology Corp.
- Takashi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,288,440
- Issue date Oct 30, 2007
- Renesas Technology Corp.
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,247,576
- Issue date Jul 24, 2007
- Renesas Technology Corp.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device to provide improved...
- Patent number 7,049,214
- Issue date May 23, 2006
- Renesas Technology Corp.
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 7,015,069
- Issue date Mar 21, 2006
- Renesas Technology Corp.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a semiconductor device
- Patent number 6,989,334
- Issue date Jan 24, 2006
- Renesas Technology Corp.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded type semiconductor device and fabrication process th...
- Patent number 6,943,456
- Issue date Sep 13, 2005
- Hitachi ULSI Systems Co., Ltd.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with alternate bonding wire arrangement
- Patent number 6,900,551
- Issue date May 31, 2005
- Renesas Technology Corp.
- Tomoo Matsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 6,872,597
- Issue date Mar 29, 2005
- Renesas Technology Corp.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,791,182
- Issue date Sep 14, 2004
- Renesas Technology Corp.
- Junpei Kusukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for manufacturing the same
- Patent number 6,750,080
- Issue date Jun 15, 2004
- Renesas Technology Corp.
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device using a mold
- Patent number 6,723,583
- Issue date Apr 20, 2004
- Renesas Technology Corp.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded type semiconductor device and fabrication process th...
- Patent number 6,692,989
- Issue date Feb 17, 2004
- Renesas Technology Corporation
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device using reinforcing pa...
- Patent number 6,596,561
- Issue date Jul 22, 2003
- Hitachi, Ltd.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded type semiconductor device and fabrication process th...
- Patent number 6,558,980
- Issue date May 6, 2003
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture thereof
- Patent number 6,552,437
- Issue date Apr 22, 2003
- Hitachi, Ltd.
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded type semiconductor device and fabrication process th...
- Patent number 6,291,273
- Issue date Sep 18, 2001
- Hitachi, Ltd.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150236003
- Publication date Aug 20, 2015
- RENESAS ELECTRONICS CORPORATION
- Jumpei Konno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140203431
- Publication date Jul 24, 2014
- RENESAS ELECTRONICS CORPORATION
- Jumpei KONNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20140183759
- Publication date Jul 3, 2014
- RENESAS ELECTRONICS CORPORATION
- Jumpei KONNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140004661
- Publication date Jan 2, 2014
- RENESAS ELECTRONICS CORPORATION
- Jumpei KONNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130001274
- Publication date Jan 3, 2013
- Renesas Electronics Corporation
- Jumpei KONNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20110183474
- Publication date Jul 28, 2011
- RENESAS ELECTRONICS CORPORATION
- Kunio Shigemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20090160084
- Publication date Jun 25, 2009
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20080253100
- Publication date Oct 16, 2008
- Kunio Shigemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20080057626
- Publication date Mar 6, 2008
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20070298545
- Publication date Dec 27, 2007
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having improved adhesion between bonding and b...
- Publication number 20060138679
- Publication date Jun 29, 2006
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device and manufacturing method of the same
- Publication number 20060110859
- Publication date May 25, 2006
- Kunio Shigemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20060049499
- Publication date Mar 9, 2006
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device
- Publication number 20060043641
- Publication date Mar 2, 2006
- Bunshi Kuratomi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of manufacturing a semiconductor device and a semiconductor...
- Publication number 20050127535
- Publication date Jun 16, 2005
- RENESAS TECHNOLOGY CORP.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20050121805
- Publication date Jun 9, 2005
- Renesas Technology Corp. Hitachi ULSI Systems Co., Ltd.
- Tomoo Matsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device
- Publication number 20050106786
- Publication date May 19, 2005
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device
- Publication number 20050070047
- Publication date Mar 31, 2005
- Bunshi Kuratomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050040509
- Publication date Feb 24, 2005
- Takashi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device to provide improved...
- Publication number 20050035449
- Publication date Feb 17, 2005
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device and a semiconductor...
- Publication number 20040164428
- Publication date Aug 26, 2004
- RENESAS TECHNOLOGY CORP.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic molded type semiconductor device and fabrication process th...
- Publication number 20040159922
- Publication date Aug 19, 2004
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20030218245
- Publication date Nov 27, 2003
- Hitachi, Ltd.
- Tomoo Matsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device and a semiconductor...
- Publication number 20030205797
- Publication date Nov 6, 2003
- Hitachi, Ltd.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20030207572
- Publication date Nov 6, 2003
- Miyaki Yoshinori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic molded type semiconductor device and fabrication process th...
- Publication number 20030124770
- Publication date Jul 3, 2003
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for manufacturing the same
- Publication number 20030122262
- Publication date Jul 3, 2003
- Hitachi, Ltd.
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030052420
- Publication date Mar 20, 2003
- Hitachi, Ltd.
- Hiromichi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030042597
- Publication date Mar 6, 2003
- Junpei Kusukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device and a semiconductor...
- Publication number 20020074650
- Publication date Jun 20, 2002
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Nishita Takafumi

Person

Patents Grantslast 30 patents

Semiconductor device

Method of manufacturing semiconductor device and semiconductor device

Method of manufacturing semiconductor device

Electronic device and manufacturing method of the same

Method of manufacturing semiconductor device

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Semiconductor device having improved adhesion between bonding and b...

Method of manufacturing a semiconductor device

Electronic device and manufacturing method of the same

Semiconductor device

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device to provide improved...

Method of manufacturing a semiconductor device and a semiconductor...

Manufacturing method of a semiconductor device

Plastic molded type semiconductor device and fabrication process th...

Semiconductor device with alternate bonding wire arrangement

Method of manufacturing a semiconductor device and a semiconductor...

Semiconductor device

Semiconductor device and process for manufacturing the same

Method of manufacturing a semiconductor device using a mold

Plastic molded type semiconductor device and fabrication process th...

Method of manufacturing a semiconductor device using reinforcing pa...

Plastic molded type semiconductor device and fabrication process th...

Semiconductor device and method of manufacture thereof

Plastic molded type semiconductor device and fabrication process th...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Semiconductor device having improved adhesion between bonding and b...

Electronic device and manufacturing method of the same

Semiconductor device and its manufacturing method

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device and a semiconductor...

Semiconductor device and a method of manufacturing the same

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Semiconductor device

Method of manufacturing a semiconductor device to provide improved...

Method of manufacturing a semiconductor device and a semiconductor...

Plastic molded type semiconductor device and fabrication process th...

Semiconductor device and a method of manufacturing the same

Method of manufacturing a semiconductor device and a semiconductor...

Semiconductor device and its manufacturing method

Plastic molded type semiconductor device and fabrication process th...

Semiconductor device and process for manufacturing the same

Semiconductor device

Semiconductor device

Method of manufacturing a semiconductor device and a semiconductor...