Claims
- 1. A semiconductor device comprising:
a lead frame having a die pad, supporting leads continuously formed with said die pad, and a plurality of leads, first ends of said plurality of leads being disposed to surround said die pad in a plane view; a semiconductor chip mounted on said die pad, said semiconductor chip having an integrated circuit and bonding pads formed on a main surface thereof, said main surface of said semiconductor chip having a quadrilateral shape, said bonding pads being disposed along four sides of said main surface of said semiconductor chip, said die pad having a size which is smaller than that of said semiconductor chip; a plurality of bonding wires electrically connecting said bonding pads with the first ends of said plurality of leads respectively; and a resin body sealing said semiconductor chip, said die, said supporting leads, portions of the plurality of leads and said plurality of bonding wires, wherein a pitch between first ones of adjacent bonding pads at each of four corners defined by said four sides of said main surface of said semiconductor chip is wider than a pitch between second ones of adjacent bonding pads which are disposed at a relatively central position of each of said four sides as compared to said four corners.
- 2. A semiconductor device according to claim 1, wherein said semiconductor chip is bonded to said die pad by an adhesive.
- 3. A semiconductor device according to claim 2, wherein said die pad has a circular shape in said plane view.
- 4. A semiconductor device according to claim 2, wherein said die pad has a cross shape in said plane view.
- 5. A semiconductor device according to claim 2, wherein said resin member is formed in a tetragonal shape, and wherein portions of said plurality of leads protrude outwardly from said resin member at four sides of said resin member.
- 6. A semiconductor device according to claim 2, wherein a part of said resin member contacts with a rear surface of said semiconductor chip except for areas to which said die pad is bonded.
Parent Case Info
[0001] This application is a Divisional application of application Ser. No. 09/331,721, filed Jun. 25, 1999, which is a national stage application filed under 35 USC 371 of PCT/JP96/03808, filed Dec. 26, 1996.
Divisions (2)
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Number |
Date |
Country |
Parent |
10371275 |
Feb 2003 |
US |
Child |
10777084 |
Feb 2004 |
US |
Parent |
09331721 |
Oct 1999 |
US |
Child |
09832008 |
Apr 2001 |
US |
Continuations (1)
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Number |
Date |
Country |
Parent |
09832008 |
Apr 2001 |
US |
Child |
10371275 |
Feb 2003 |
US |