Nobuhiro Mikami

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Air conditioner having relay coil abnormality voltage control
- Patent number 11,009,254
- Issue date May 18, 2021
- Mitsubishi Electric Corporation
- Nobuhiro Mikami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leakage determination system and leakage determination method
- Patent number 10,036,684
- Issue date Jul 31, 2018
- NEC Corporation
- Shohei Kinoshita
- G01 - MEASURING TESTING
Information Patent Grant
Component built-in module, electronic device including same, and me...
- Patent number 9,148,971
- Issue date Sep 29, 2015
- Lenovo Innovations Limited (Hong Kong)
- Nozomu Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in module, electronic device including same, and me...
- Patent number 9,036,359
- Issue date May 19, 2015
- LEONOVO INNOVATIONS LIMITED (HONG KONG)
- Nozomu Nishimura
- F21 - LIGHTING
Information Patent Grant
Mount board and electronic device
- Patent number 8,913,398
- Issue date Dec 16, 2014
- NEC Corporation
- Shinji Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Failure prediction method and failure prediction system
- Patent number 8,861,110
- Issue date Oct 14, 2014
- NEC Corporation
- Soichiro Takata
- G11 - INFORMATION STORAGE
Information Patent Grant
Mount board and electronic device
- Patent number 8,625,296
- Issue date Jan 7, 2014
- NEC Corporation
- Shinji Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Switch integrated casing and electronic equipment having the casing
- Patent number RE44405
- Issue date Aug 6, 2013
- NEC Corporation
- Yoshiaki Kobayashi
- 200 - Electricity: circuit makers and breakers
Information Patent Grant
Heat dissipating structure and portable phone
- Patent number 8,443,874
- Issue date May 21, 2013
- NEC Corporation
- Nobuhiro Mikami
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Circuit board device, wiring board interconnection method, and circ...
- Patent number 8,144,482
- Issue date Mar 27, 2012
- NEC Corporation
- Junya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board device, wiring board connecting method, and circuit b...
- Patent number 8,130,511
- Issue date Mar 6, 2012
- NEC Corporation
- Junya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and semiconductor package
- Patent number 8,119,918
- Issue date Feb 21, 2012
- NEC Corporation
- Junya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package, electronic part and electronic device
- Patent number 7,847,389
- Issue date Dec 7, 2010
- NEC Corporation
- Nobuhiro Mikami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switch integrated casing and electronic equipment having the casing
- Patent number 7,094,985
- Issue date Aug 22, 2006
- NEC Corporation
- Yoshiaki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
AIR CONDITIONER
- Publication number 20190368767
- Publication date Dec 5, 2019
- Mitsubishi Electric Corporation
- Nobuhiro MIKAMI
- F24 - HEATING RANGES VENTILATING
Information Patent Application
PIPING INSPECTION SYSTEM, PIPING INSPECTION DEVICE, PIPING INSPECTI...
- Publication number 20170343514
- Publication date Nov 30, 2017
- NEC Corporation
- Soichiro Takata
- G01 - MEASURING TESTING
Information Patent Application
INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AN...
- Publication number 20170276567
- Publication date Sep 28, 2017
- NEC Corporation
- Yasuhiro SOGAWA
- G01 - MEASURING TESTING
Information Patent Application
LEAKAGE DETERMINATION SYSTEM AND LEAKAGE DETERMINATION METHOD
- Publication number 20160282219
- Publication date Sep 29, 2016
- NEC Corporation
- Shohei KINOSHITA
- G01 - MEASURING TESTING
Information Patent Application
FAILURE PREDICTION METHOD AND FAILURE PREDICTION SYSTEM
- Publication number 20140219071
- Publication date Aug 7, 2014
- NEC Corporation
- Soichiro Takata
- G11 - INFORMATION STORAGE
Information Patent Application
COMPONENT-CONTAINING MODULE AND METHOD FOR PRODUCING COMPONENT-CONT...
- Publication number 20140029208
- Publication date Jan 30, 2014
- NEC Corporation
- Nozomu Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNT BOARD AND ELECTRONIC DEVICE
- Publication number 20140003015
- Publication date Jan 2, 2014
- NEC CORPORATION
- Shinji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT BUILT-IN MODULE, ELECTRONIC DEVICE INCLUDING SAME, AND ME...
- Publication number 20130176746
- Publication date Jul 11, 2013
- NEC Corporation
- Nozomu Nishimura
- F21 - LIGHTING
Information Patent Application
COMPONENT BUILT-IN MODULE, ELECTRONIC DEVICE INCLUDING SAME, AND ME...
- Publication number 20130176689
- Publication date Jul 11, 2013
- NEC Corporation
- Nozomu Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCH INTEGRATED CASING AND ELECTRONIC EQUIPMENT HAVING THE CASING
- Publication number 20120073944
- Publication date Mar 29, 2012
- NEC Corporation
- Yoshiaki KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNT BOARD AND ELECTRONIC DEVICE
- Publication number 20110242780
- Publication date Oct 6, 2011
- NEC Corporation
- Shinji Watanabe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING SAME, SEMICONDUCTOR...
- Publication number 20100148335
- Publication date Jun 17, 2010
- NEC Corporation
- Nobuhiro Mikami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATING STRUCTURE AND PORTABLE PHONE
- Publication number 20100126708
- Publication date May 27, 2010
- Nobuhiro Mikami
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20090266586
- Publication date Oct 29, 2009
- NEC Corporation
- Junya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board Device, Wiring Board Connecting Method, and Circuit B...
- Publication number 20090161331
- Publication date Jun 25, 2009
- Junya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board device, wiring board interconnection method, and circ...
- Publication number 20090135573
- Publication date May 28, 2009
- Junya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE, ELECTRONIC PART AND ELECTRONIC DEVICE
- Publication number 20090096080
- Publication date Apr 16, 2009
- NEC Corporation
- Nobuhiro Mikami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mount Board and Electronic Device
- Publication number 20090002973
- Publication date Jan 1, 2009
- NEC Corporation
- Shinji Watanabe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Switch integrated casing and electronic equipment having the casing
- Publication number 20050236265
- Publication date Oct 27, 2005
- Yoshiaki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Nobuhiro Mikami

Person

Patents Grantslast 30 patents

Air conditioner having relay coil abnormality voltage control

Leakage determination system and leakage determination method

Component built-in module, electronic device including same, and me...

Component built-in module, electronic device including same, and me...

Mount board and electronic device

Failure prediction method and failure prediction system

Mount board and electronic device

Switch integrated casing and electronic equipment having the casing

Heat dissipating structure and portable phone

Circuit board device, wiring board interconnection method, and circ...

Circuit board device, wiring board connecting method, and circuit b...

Printed circuit board and semiconductor package

Semiconductor package, electronic part and electronic device

Switch integrated casing and electronic equipment having the casing

Patents Applicationslast 30 patents

AIR CONDITIONER

PIPING INSPECTION SYSTEM, PIPING INSPECTION DEVICE, PIPING INSPECTI...

INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AN...

LEAKAGE DETERMINATION SYSTEM AND LEAKAGE DETERMINATION METHOD

FAILURE PREDICTION METHOD AND FAILURE PREDICTION SYSTEM

COMPONENT-CONTAINING MODULE AND METHOD FOR PRODUCING COMPONENT-CONT...

MOUNT BOARD AND ELECTRONIC DEVICE

COMPONENT BUILT-IN MODULE, ELECTRONIC DEVICE INCLUDING SAME, AND ME...

COMPONENT BUILT-IN MODULE, ELECTRONIC DEVICE INCLUDING SAME, AND ME...

SWITCH INTEGRATED CASING AND ELECTRONIC EQUIPMENT HAVING THE CASING

MOUNT BOARD AND ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING SAME, SEMICONDUCTOR...

HEAT DISSIPATING STRUCTURE AND PORTABLE PHONE

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE

Circuit Board Device, Wiring Board Connecting Method, and Circuit B...

Circuit board device, wiring board interconnection method, and circ...

SEMICONDUCTOR PACKAGE, ELECTRONIC PART AND ELECTRONIC DEVICE

Mount Board and Electronic Device

Switch integrated casing and electronic equipment having the casing